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Lighting device and lighting device

A technology for lighting devices and light emitting devices, which is applied in the direction of lighting devices, components of lighting devices, cooling/heating devices of lighting devices, etc., and can solve the problem of inability to dissipate heat effectively, the heat of light emitting elements cannot be effectively conducted to the substrate, light output or light emission Problems such as color deviation

Inactive Publication Date: 2015-07-29
TOSHIBA LIGHTING & TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the above-mentioned conventional substrates, the light-emitting elements are bonded by an adhesive made of a resin material. Therefore, the heat generated from the light-emitting elements may not be efficiently conducted to the substrate, and heat dissipation may not be performed effectively.
Furthermore, when a plurality of light-emitting elements are mounted on a substrate, the temperature of each light-emitting element becomes non-uniform, and the light output or luminous color of each light-emitting element may vary.

Method used

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  • Lighting device and lighting device
  • Lighting device and lighting device
  • Lighting device and lighting device

Examples

Experimental program
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no. 1 Embodiment approach

[0072] refer to Figure 1 to Figure 8 The light emitting device of this embodiment will be described. In addition, in each figure, the same code|symbol is attached|subjected to the same part, and overlapping description is abbreviate|omitted.

[0073] Such as Figure 1 to Figure 4 As shown, the light-emitting device 1 includes: a ceramic substrate 2; a metal heat-conducting layer 3 formed on the substrate; a light-emitting element 4 mounted on the metal heat-conducting layer; and a metal bonding layer 5 interposed between the metal heat-conducting layer 3 and the light-emitting element 4.

[0074] The substrate 2 has insulating properties and is formed of a ceramic material such as white alumina or aluminum nitride. The board|substrate 2 is formed in substantially quadrilateral shape, and the notch part 2a which engages with the fixing means, such as a screw, is formed in each corner|angular part.

[0075] Such as Figure 2 to Figure 4 As shown, on the surface of the subs...

no. 2 Embodiment approach

[0106] refer to Figure 9 , the light-emitting device 1 using a DCB (Direct Copper Bonding) substrate will be described. The DCB substrate is a substrate in which a copper layer 16 with a thickness of about 50 μm is formed on the back surface of the ceramic substrate 2, and the structure of the surface side of the ceramic substrate 2 is, for example, the same as Figure 4 same. In addition, in Figure 9 In the diagram, the thermal conduction layer 3 is composed of a metal layer. When a DCB substrate is used, the thickness of the heat conduction layer 3 on the surface side may be set to 250 μm or more.

no. 3 Embodiment approach

[0108] The light emitting device 1 can be configured as a light source of an LED lamp, a lighting fixture used indoors or outdoors, or a lighting device incorporated in a device body such as a display device.

[0109] refer to Figure 10 , the lighting device of this embodiment will be described. The lighting device 100 includes two light emitting devices 1 , a body 103 , a concave reflector 104 and a mirror support member 105 . The light emitting device 1 described in the first embodiment or the second embodiment can be used.

[0110] The main body 103 includes a heat sink 131 and a heat receiving portion 135 in a case. The heat sink 131 integrally has a plurality of heat dissipation fins (fins) 133 vertically attached to the rear surface of a substantially disk-shaped base (base) 132 . The heat receiving portion 135 is a cuboid having a thickness approximately equal to that of the base 132 . The heat receiving part 135 is different from the heat sink 131 , and is install...

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Abstract

According to one embodiment, a light emitting device (1) includes a ceramics substrate (2), a metallic thermally-conductive layer (3) formed on the substrate (2) in which the substrate involves no electric connection, a light emitting element (4) mounted on the metallic thermally-conductive layer (3), and a metallic bonding layer (5) interposed between the metallic thermally-conductive layer (3) and the light emitting element (4) to bond the light emitting element (4) to the metallic thermally-conductive layer (3).

Description

technical field [0001] Embodiments of the present invention relate to a light emitting device and a lighting device using a light emitting element such as a light emitting diode (Light Emitting Diode, LED). Background technique [0002] Recently, LEDs are gradually being used as light sources of lighting devices. The light source is a bare chip on which a plurality of LEDs are mounted on a substrate, and each LED chip is electrically connected with a bonding wire to form a light emitting device. [0003] As the temperature of light-emitting elements such as LEDs rises, the lifespan decreases along with a decrease in light output and a change in characteristics. Therefore, in a light-emitting device using a solid-state light-emitting element such as an LED as a light source, it is necessary to suppress temperature rise of the light-emitting element and improve various characteristics such as life and efficiency. [0004] Conventionally, a ceramics substrate is known as a su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L33/62F21S2/00F21Y101/02
CPCH01L33/486H01L33/62F21Y2101/02H01L2224/73265H01L33/641H01L25/0753F21V7/06H01L33/647H01L2224/48091F21V29/76H01L2224/45144H01L24/45H01L2224/48137H01L2924/12041H01L2924/181F21Y2115/10H01L2924/00014H01L2924/00H01L2924/00012
Inventor 松田周平竹中绘梨果三瓶友広森川和人泉昌裕西村洁
Owner TOSHIBA LIGHTING & TECH CORP
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