Resin composite copper foil

A resin composite, copper foil technology, applied in the direction of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problems of easy residue, questionable connection reliability, circuit over-etching, etc., to achieve heat resistance or moisture absorption heat resistance Good, high practicability, and excellent workability

Active Publication Date: 2011-11-30
MITSUBISHI GAS CHEM CO INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned electrolytic copper foil has good adhesion, there is a problem that when forming a fine circuit by etching, a part of the convex portion of the copper foil is likely to remain on the laminate due to the influence of the unevenness of the roughened surface of the copper foil. If the etching time is prolonged in order to completely remove this part, the circuit will be over-etched, and the positional accuracy and adhesion of the circuit will be reduced.
Also, in order to solve the above-mentioned problems, a resin-composite copper foil having a block copolymerized polyimide (polyimide) resin layer is proposed (for example, refer to Patent Document 3). When copper-clad laminates of foil are subjected to blind via processing, through-hole processing, blind via processing, etc. by carbon dioxide laser, the processability of the block copolymerized polyimide resin layer is poor. The burr of the through hole or blind hole obtained by laser becomes larger, so the connection reliability is problematic

Method used

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Examples

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example

[0051] Hereinafter, the present invention will be specifically described with reference to examples and comparative examples. In addition, when there is no particular description, "part" shows the weight part in solid content.

Synthetic example 1

[0053] A 2L (liter) three-neck flask equipped with a stainless steel anchor type stirring rod, a trap with a nitrogen inlet tube and a stopcock, and a reflux condenser with a ball condenser In, add 117.68g (400mmol) of 3,4,3',4'-biphenyltetracarboxylic dianhydride, 87.7g (300mmol) of 1,3-bis(3-aminophenoxy)benzene, γ-valerolide 4.0g (40mmol) of ester, 4.8g (60mmol) of pyridine, 300g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) and 20g of toluene were heated at 180°C for 1 hour, cooled to around room temperature, and then added 3,4,3',4',-biphenyltetracarboxylic dianhydride 29.42g (100mmol), 2,2-bis{4-(4-aminophenoxy)phenyl}propane 82.12g (200mmol), After mixing 200 g of NMP and 40 g of toluene at room temperature for 1 hour, it heated at 180 degreeC for 3 hours, and obtained the block copolymerization polyimide resin whose solid content was 38%. The block copolymerized polyimide resin has general formula (1): general formula (2)=3:2, and the number average molec...

Synthetic example 2

[0055] Add 3, 4, 3' to a 2L three-neck flask equipped with a stainless steel anchor-type stirring rod, a trap with a nitrogen inlet pipe and a pipe latch, and a reflux condenser with a ball condenser. , 117.68g (400mmol) of 4′-biphenyltetracarboxylic dianhydride, 123.18g (300mmol) of 2,2-bis{4-(4-aminophenoxy)phenyl}propane, and 4.0g of γ-valerolactone (40mmol), pyridine 4.8g (60mmol), NMP 300g and toluene 20g, after heating at 180°C for 1 hour, cooling to around room temperature, then adding 3,4,3',4'-biphenyltetracarboxylic acid di 29.42 g (100 mmol) of anhydride, 58.47 g (200 mmol) of 1,3-bis(3-aminophenoxy)benzene, 200 g of NMP, and 40 g of toluene were mixed at room temperature for 1 hour, and then heated at 180° C. for 3 hours. A block copolymerized polyimide resin having a solid content of 38% was obtained. The block copolymerized polyimide resin has general formula (1): general formula (2)=2:3, and the number average molecular weight is 75,000, and the weight average ...

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Abstract

A resin composite copper foil that can be used with extremely small unevenness on the copper foil (roughened) surface without impairing the adhesive force with the resin composition of the copper-clad laminate. In more detail, the resin composite copper foil includes: copper foil and a polyimide resin layer. The polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.

Description

technical field [0001] The invention relates to a resin composite copper foil used in a printed circuit board. The resin composite copper foil obtained in the present invention has excellent adhesion to the resin composition of the copper-clad laminate, and the heat resistance of the copper-clad laminate using the resin composite copper foil is good, and because the copper foil ( Copper foil with extremely small unevenness on the roughened surface, so it can be used well as a high-density printed circuit board with fine circuits. Background technique [0002] In recent years, in small, thin, and lightweight electronic equipment, there has been an increasing demand for higher densities of printed circuit boards. Along with this, it is necessary to improve the copper foil used to form finer circuits. Conventionally, as a copper foil used in a copper-clad laminate for a printed circuit board, an electrolytic copper foil having good adhesion to the copper foil and having a noti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/088H05K1/09
CPCH05K2201/0358H05K2201/0209H05K3/386H05K2201/0154Y10T428/31681B32B15/088B32B15/20C08G73/10H05K1/09
Inventor 野崎充大森贵文野本昭宏秋山教克永田英史矢野真司
Owner MITSUBISHI GAS CHEM CO INC
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