Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sorter pick-and-place device

A pick-and-place device and sorting machine technology, applied in sorting, manipulators, manufacturing tools, etc., can solve the problems of increasing sorting time, unable to increase the speed of pick-and-place arm 13, and unable to improve sorting efficiency

Inactive Publication Date: 2011-12-07
PRECISION MACHINERY RES & DEV CENT +1
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the size of the wafer becomes larger, the length specification of the pick-and-place arm 13 must be lengthened to have enough freedom to rotate, and the setting position of the pick-and-place arm 13 must be further away from the to-be-sorted tray 11 and the sorted tray 12 , causing the disadvantage of increasing the overall volume of the sorter 1
[0004] In addition, the sorter 1 can only move one semiconductor element 15 at a time, and must stop when picking up and placing. Although the rotation angle is less than 180 degrees, the rotation speed of the pick-and-place arm 13 cannot be increased during the rotation. The aforementioned reasons are all The problem that the classification time increases and the classification efficiency cannot be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sorter pick-and-place device
  • Sorter pick-and-place device
  • Sorter pick-and-place device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

[0024] refer to Figure 4 , Figure 5 and Figure 6 , The first preferred embodiment of the pick-and-place device for the sorter of the present invention includes a tray 2 to be sorted, a tray 3 that has been sorted, and a pick-and-place arm set 4 .

[0025] The tray 2 to be sorted moves on a horizontal plane along a first direction x' and a second direction y', the sorted tray 3 is spaced apart from the tray 2 to be sorted along the first direction x', and the sorted tray 3 Move along the first direction x' and the second direction y'. In this preferred embodiment, the first direction x' and the second direction y' are perpendicular to each other, but it is not limited to this in ot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A pick-and-place device for a sorter includes a tray to be sorted and a tray to be sorted that move along a first direction and a second direction respectively, the sorted tray is arranged at intervals from the tray to be sorted along the first direction, and a pick-and-place arm set It is arranged in the middle of the tray to be sorted and the sorted tray along the first direction. The pick-and-place arm group includes two pick-and-place arms arranged at 180 degrees apart from each other. The placing arm is positioned above the sorted tray to place semiconductor components synchronously, effectively improving the efficiency of picking and placing semiconductor components.

Description

technical field [0001] The invention relates to a sorting machine for semiconductor components, in particular to a pick-and-place device for the sorting machine. Background technique [0002] refer to figure 1 , figure 2 and image 3 , a semiconductor component sorting machine 1 in the past, including a tray 11 to be sorted, a tray 12 that has been sorted, and a pick-and-place arm 13. Moving in a second direction Y, a wafer 14 is placed on the tray 11 to be sorted, and a plurality of semiconductor elements 15 are separated on the wafer 14, and the pick-and-place arm 13 is adjacent to the tray 11 to be sorted and the tray 12 that has been sorted Set, the pick-and-place arm 13 moves up and down along a third direction Z, the pick-and-place arm 13 is used to absorb the semiconductor element 15 that has passed the test on the tray 11 to be sorted, and rotates to the top of the sorted tray 12, and will pass through The inspected semiconductor element 15 is placed on the sort...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B07C5/36B25J15/06
Inventor 廖茂钦徐秋田
Owner PRECISION MACHINERY RES & DEV CENT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products