A cooling device and method

Abstract

The invention discloses a heat dissipation device and method, including a heat dissipation adapter plate and a bottom cover, wherein the heat dissipation adapter plate is used for heat dissipation contact with a device on a PCB that needs heat dissipation, and a heat dissipation contact with a housing, and a heat dissipation contact with a housing. The bottom cover is connected; the bottom cover is used for connecting with the heat dissipation adapter board. The natural heat dissipation system based on the uTCA structure of the present invention not only greatly improves the problems that the current fan heat dissipation system is easily corroded, the dust-proof net is easily blocked, and the reliability is low; During the installation process, the heat conduction adapter board and the PCB are installed as a whole, which avoids damage to the single board due to excessive stress during the installation of the enclosure box, and greatly enhances the portability of the box. Through the method of the present invention, only a small heat dissipation adapter board is designed to match the PCB, which ensures the heat dissipation effect, greatly improves the reliability and service life of the system, and thus reduces the maintenance cost of the system.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a heat dissipation device and method. Background technique [0002] At present, most systems based on the simplified version of ATCA (uTCA, Micro Telecommunications Computing Architecture; also known as MicroTCA) architecture adopt fan cooling method, and, according to the uTCA standard, special fan slots are also specified. Among them, Advanced Telecommunications Computing Architecture (ATCA, Advanced Telecommunications Computing Architecture; also known as AdvancedTCA) is a communication market-oriented specification launched by PCI Industrial Computer Manufacturers Group (PICMG, PCI Industrial Computer Manufacturers Group). [0003] Using the method of fan heat dissipation, the fan will be corroded to varying degrees in harsh acidic environments. At the same time, in applications with a lot of dust, the dust-proof net of the fan is easily blocked, resulting in a decrease in syste...

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Problems solved by technology

[0003] Using the method of fan heat dissipation, the fan will be corroded to varying degrees in harsh acidic environments. At the same time, in applications with a lot of dust, the dust-proof net of the fan is easily blocked, resulting in a decrease in system cooling efficiency; in addition, according to the previous application conditions According to statistics, the mean time between failure (MTBF, Mean Time Between Failure) of ordinary fans is only 50,000 hours, which is lower than the system equipment requirements, which undoubtedly greatly increases the maintenance cost of the system

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