Board-to-Board Connector

A board-to-board connector and connector terminal technology, applied in the direction of connection, fixed connection, contact parts, etc., can solve the problems of poor tin climbing, affecting the conduction of the board-to-board connector, etc., and the strength of the connection will not be affected. The effect of influencing and inhibiting poor tin climbing and long service life

Inactive Publication Date: 2011-12-21
KUSN DLK ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem in the prior art that board-to-board connectors are prone to poor solder creep during board-to-board soldering and affect the conduction of the board-to-board con

Method used

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Examples

Experimental program
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Example Embodiment

[0018] The present invention will be further described below in conjunction with the drawings.

[0019] Such as Figure 1-5 As shown, a board-to-board connector includes an insulating body 1 and a number of connector terminals. Each connector terminal is held in a corresponding receiving cavity of the insulating body 1. The connector terminal includes a terminal body 2 and solder feet. 3. On both sides of the bottom of the terminal body 2, there are protruding solder feet 3 for welding, and contact ports 4 are respectively provided on both sides of the terminal body 2, and at least one of the solder feet 3 is connected to the terminal body 2 Upward bending structure 5. When welding, the upward bending structure 5 will cause resistance to the flow of tin, so that the tin will not climb to the contact port 4, which has the effect of suppressing the poor tin climbing. In order to better suppress poor tin climbing, a plurality of upward bending structures 5 can be arranged in a pro...

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PUM

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Abstract

The invention discloses a board-to-board connector, which includes an insulating body and several connector terminals, each connector terminal is held in a corresponding receiving cavity of the insulating body, and the connector terminal includes a terminal body and a welding leg , the two sides of the bottom of the terminal body are respectively protruded with welding feet for welding, and the two sides of the terminal body are respectively provided with contact ports. It is characterized in that: at least one upward bending structure, at least one concave cut is provided on the terminal body between the solder leg and the contact port. The invention solves the problem that board-to-board connectors in the prior art are prone to poor tin creeping during furnace welding, which affects the conduction of the board-to-board connector, and provides an adjustable solder paste thickness, solder joint Full, use reliable board-to-board connectors with better conduction performance.

Description

technical field [0001] The invention relates to a board-to-board connector requiring board-to-board welding, in particular to a board-to-board connector with embedded board-to-board welding. Background technique [0002] Board-to-board connectors are currently the connector products with the strongest transmission capacity among all connector product types. They are mainly used in power systems, communication networks, financial manufacturing, elevators, industrial automation, medical equipment, office equipment, home appliances, military manufacturing, etc. industry. The solder feet of the known board-to-board connectors need to be tinned when the board is pasted and soldered. Tin-climbing refers to the process of printing solder paste on the pads of the circuit board, and then placing the board-to-board connector on the pads. over the solder paste. After passing it through the oven, the solder paste melts while the tin climbs up the fillet. However, at present, board-to...

Claims

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Application Information

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IPC IPC(8): H01R12/57H01R13/02
Inventor 周磊
Owner KUSN DLK ELECTRONICS TECH
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