Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Board-to-Board Connector

A board-to-board connector and connector terminal technology, applied in the direction of connection, fixed connection, contact parts, etc., can solve the problems of poor tin climbing, affecting the conduction of the board-to-board connector, etc., and the strength of the connection will not be affected. The effect of influencing and inhibiting poor tin climbing and long service life

Inactive Publication Date: 2011-12-21
KUSN DLK ELECTRONICS TECH
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem in the prior art that board-to-board connectors are prone to poor solder creep during board-to-board soldering and affect the conduction of the board-to-board connector, the present invention provides an adjustable brushing solder paste thickness, so that the soldering Points are full, use reliable board-to-board connectors with better conduction performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Board-to-Board Connector
  • Board-to-Board Connector
  • Board-to-Board Connector

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Such as Figure 1-5 As shown, a board-to-board connector includes an insulating body 1 and several connector terminals, each connector terminal is held in a corresponding receiving cavity of the insulating body 1, and the connector terminals include a terminal body 2 and solder pins 3. On both sides of the bottom of the terminal body 2, solder feet 3 for welding are respectively protruded, and contact ports 4 are respectively provided on both sides of the terminal body 2, and at least one of the solder legs 3 is connected to the terminal body 2 Bend structure 5 upwards. During soldering, upwardly bending the structure 5 will cause resistance to the flow of tin, so that the tin will not climb to the contact port 4, which has the effect of inhibiting the bad tin climbing. In order to better suppress the defect of tin creeping, multiple upward bending structures ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a board-to-board connector, which includes an insulating body and several connector terminals, each connector terminal is held in a corresponding receiving cavity of the insulating body, and the connector terminal includes a terminal body and a welding leg , the two sides of the bottom of the terminal body are respectively protruded with welding feet for welding, and the two sides of the terminal body are respectively provided with contact ports. It is characterized in that: at least one upward bending structure, at least one concave cut is provided on the terminal body between the solder leg and the contact port. The invention solves the problem that board-to-board connectors in the prior art are prone to poor tin creeping during furnace welding, which affects the conduction of the board-to-board connector, and provides an adjustable solder paste thickness, solder joint Full, use reliable board-to-board connectors with better conduction performance.

Description

technical field [0001] The invention relates to a board-to-board connector requiring board-to-board welding, in particular to a board-to-board connector with embedded board-to-board welding. Background technique [0002] Board-to-board connectors are currently the connector products with the strongest transmission capacity among all connector product types. They are mainly used in power systems, communication networks, financial manufacturing, elevators, industrial automation, medical equipment, office equipment, home appliances, military manufacturing, etc. industry. The solder feet of the known board-to-board connectors need to be tinned when the board is pasted and soldered. Tin-climbing refers to the process of printing solder paste on the pads of the circuit board, and then placing the board-to-board connector on the pads. over the solder paste. After passing it through the oven, the solder paste melts while the tin climbs up the fillet. However, at present, board-to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01R12/57H01R13/02
Inventor 周磊
Owner KUSN DLK ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com