32results about How to "Solder joints are full" patented technology

The invention relates to the technical field of electronic welding, in particular to lead-free halogen-free tin paste which comprises, in weight percent, 88%-90% of tin powder and 10%-12% of paste flux. The tin powder is made of alloys including 88-94.5% of Sn, 0.2-1.2% of Ag, 0.3-0.8% of Cu and 5-10% of Bi. The paste flux comprises rosin, solvents, corrosion inhibitors, activators, thixotropic agents and thickening agents, wherein the activators comprise organic acid and organic amine. The paste flux is prepared by an emulsion dispersion high-speed shearing process. A preparation method of the tin paste includes the steps: placing the tin powder and the paste flux into a sealed stirrer for stirring according to the proportion; pumping vacuum; releasing the vacuum; finishing preparation of the tin paste. The lead-free halogen-free tin paste is low in melting point, fine in weldability, full in welding spot and fine in reliability, achieves fine welding effects and meets environmental protection requirements, and the service life of the tin paste is prolonged.

The invention discloses Sn0.3Ag0.7Cu lead-free solder paste. The Sn0.3Ag0.7Cu lead-free solder paste particularly comprises, by mass, 9-11% of scaling powder and 89-91% of soldering tin powder. The scaling powder comprises, by mass, 20-25% of rosin, 15-20% of film-forming agent, 15-20% of active agent, 5-10% of thixotropic agent, 1-3% of acidity regulator and the balance solvent. The invention further discloses a preparation method of the Sn0.3Ag0.7Cu lead-free solder paste. The method comprises the steps that the solvent and the film-forming agent are stirred at 75 DEG C to be transparent, and the mixture is cooled to be at the temperature of 65 DEG C, added with the film-forming agent, cooled to be at the temperature of 55 DEG C and added with the active agent to be stirred to be transparent; the mixture is cooled to be at 55 DEG C and added with the thixotropic agent to be stirred to be transparent; the mixture is cooled to be at normal temperature and added with the acidity regulator to be stirred for 15 min, and then the mixture and solder powder are mixed and stirred to obtain the Sn0.3Ag0.7Cu lead-free solder paste. The solder paste is good in printing technology and welding performance, residues left after welding evenly cover the surface welding spots, and the effects of electrical insulation, welding spot protection and the like are achieved.

The invention relates to the technical field of tin wires, in particular to a composite halogen-free lead-free tin wire in line with the EU (European Union) directive. The tin wires comprise the following components in parts by per unit mass: 96-98 parts of tin, 0.6-0.7 part of copper, 0.1-0.2 part of resin, 0.1-0.2 part of non-fluorochloro environmentally-friendly organic solvent, 0.05-0.06 part of thixotropic agnet, 0.02-0.4 part of organic active agent, 0.01-0.02 part of corrosion inhibitor, and 0.01-0.02 part of surfactant, wherein the tin and the copper are the solder of the tin wire, and others are soldering flux. By using said technical scheme in the invention, the product is in line with relative directive of the EU and free from lead and relative halogen. Furthermore, the reliability of the welding is high, bad welding spot cannot be formed, and the welding spot is full and bright.

The invention provides a lead-free solder paste comprising the tin base alloy welding powder and the pewter. The components of the tin base alloy welding powder are as follows (in % by weight): Sn 91-99, Cu 0.5-3, Ag 0.5-6; the components of the pewter are as follows (in % by weight): mixed alcohol ether 25-40, natural colophony 50-70, natural vegetable oil thixotropic agent 5-15, organic acid 0.5-2.0, additives. The lead-free solder paste preparing process includes the following steps: mixing the components of the pewter in proportion, standing to room temperature, putting the pewter in a refrigerating chamber with the temperature of 1 C. to 10 C. for 48 hours; mixing the pewter and the tin base alloy welding powder in the ratio of 1 to 9 in the vacuum dispersion machine, putting the mixture in the package bottle and storing hermetically with the temperature of between 5 C. and 10 C.. The lead-free solder paste is characterized by good surface activity, moderated viscosity, and no smell.

The invention discloses an air conditioner liquid storage device welding protection device and an application method thereof, and belongs to the technical field of welding. The air conditioner liquid storage device welding protection device comprises an outer ventilation block and an inner ventilation block. The outer ventilation block is of a rectangular block-shaped structure and is provided with a transverse air blowing hole and longitudinal air blowing holes and connected with an air source through an outer ventilation connecting hole. An inner air blowing hole is formed in the inner ventilation block and connected with the air source through an inner ventilation connecting hole. According to the method, a cylinder is inflated with protection air through the inner ventilation block in the welding process, the welding position is immediately inflated with the protection air through the outer ventilation block after welding is finished, and air is prevented from making contact with a welding line. By means of the air conditioner liquid storage device welding protection device and the application method thereof, the surface of a welded part can be prevented from being oxidized during liquid storage device welding, the connecting strength of the welding line is improved, the quality of a finished product is improved, and the production cost is reduced.

The invention discloses an alcohol and water mixed-base cleaning-free soldering flux for wire connection, belonging to the technical field of soldering materials. The soldering flux comprises the raw materials by weight percent: 7.0-15 percent of activating agent, 0.5-2.0 percent of film-forming agent, 0.3-1.8 percent of corrosion inhibitor, 18-35 percent of cosolvent and the balance of deionized water. The soldering flux has the advantages of effectively removing oxides and dirt on the surfaces of various leads or pins and improving assembly adaptability of different components, and has the characteristics of stronger activity, high postwelding quality, full welding spots, no poor soldering or cold soldering, less corrosive residues, no need of cleaning, and long service life.

The invention relates to a leadless tin soldering material which comprises the constituents (by mass ratio) of Ag 0.5-6%, Cu 0.1-2%, In 0.0001-1%, P 0.0001-1%, and balancing Sn. The preparing process of the soldering material comprises weighing 1.67-20 parts of Sn-Ag intermediate alloy ingot containing Ag 30%, 1-20 parts of Sn-Cu intermediate alloy ingot containing Cu 30%, 0.002-20 parts of Sn-In intermediate alloy ingot containing In 5%, P 0.0001-1 part, and balancing Sn in the whole 100 parts, charging the raw materials into manganese alloy crucible, smelting in intermediate frequency furnaces, evacuating and filling in nitrogen, elevating the temperature to 450 deg. C, agitating 1 hour, cooling down slowly and homogeneously to 340 deg C, charging weighed P and stirring homogeneously, finally pouring the melted liquid into dies.

The invention belongs to the technical field of solder, and particularly relates to a lead-free low-temperature solder. The solder comprises, by mass, 0.001-58.0% of bismuth, 0.001-1.0% of silver, 0.001-2.0% antimony, 0.001-0.1% of indium, 0.001-0.15% of phosphorus, 0.001-0.08% of germanium, 0.001-0.015% of beryllium, 0.001-0.015% of cerium and the balance tin. Compared with the prior art, when welding is carried out at the temperature of 139DEG C to 200DEG C, little oxidation slag is generated, the surface of a tin furnace can be kept bright basically without oxidation at the temperature, thesolder can not be oxidized within 50 seconds at 200-260 DEG C, so that the welding efficiency is greatly improved, and the damage to electronic components of a PCBA board is reduced; the low-temperature solder is good in oxidation resistance; and in the welding process, compared with a common Sn-Ag-Cu system, the solder has fewer welding defects, the surfaces of welding spots are very light-bright, the welding spots are full, continuous welding does not occur, so that the welding quality is effectively improved, and the solder and the method are environment-friendly and safe.

The invention discloses a multi-wire automatic shearing tin pick-up treatment device, and relates to the technical field of industrial automation. The device comprises a machine body, a loading mechanism, a peeling device and a tin pick-up treatment device are sequentially arranged on one side of the top of the machine body from left to right, a position sensor, a first welding gun, a second welding gun, a third welding gun and a fourth welding gun are sequentially arranged on the other side of the machine body from right to left, the peeling device comprises a left and right adjusting base plate, the top of the left and right adjusting base plate is provided with a front and back adjusting base plate, the top of the front and back adjusting base plate is provided with a jacking air cylinder supporting plate. According to the electronic line welding pretreatment device, the peeling device and the tin pick-up treatment device, trimming tin pick-up pretreatment before welding of the electronic connecting line can be achieved, the rear face and a terminal are better in compatibility during welding, the phenomenon that after line cutting, direct welding is carried out, tin pick-up is not uniform, and welding spots are not full is solved, and the welding quality is improved.

The invention provides a check valve for an air conditioner. The check valve for the air conditioner comprises a valve seat and N valve body assemblies arranged on the valve seat, wherein N is larger than or equal to 2. Each valve body assembly comprises a valve body, a valve element, an air valve core, an O-shaped seal ring located in a seal ring groove of the valve element and a connecting pipe which is connected with an air inlet and an air outlet in the valve body, wherein the valve element is installed in a main hole formed in the valve body, the air valve core is installed in an auxiliary hole formed in the valve body, the main hole is sealed through a copper cap with internal threads, the auxiliary hole is sealed through a copper air valve core nut, and the air outlet is sealed through a copper nut. When the check valve, with the structure, of the air conditioner is installed, a worker just needs to conduct installation operation once, and then the demand for use of a plurality of valve bodies of the connecting pipe of an outdoor unit can be met.

The invention relates to a chip processing table for a high-light-efficiency low-thermal-resistance high-power LED outdoor lamp. The chip processing table comprises a workbench, a welding base arranged on the workbench, and a moving plate which is arranged over the welding base in an up-down moving mode and forms a chip clamping station with the welding base. The chip processing table further comprises a storage bin and a feeding device, wherein the storage bin is located below the welding base and used for storing tin; the feeding device comprises a feeding channel penetrating through the welding base and extending downwards into the storage bin, a pumping assembly arranged in the feeding channel and capable of pumping tin in the storage bin into the feeding channel, and a feeding assembly installed on the pumping assembly and capable of feeding tin in the feeding channel to a chip welding spot; and the feeding assembly comprises a containing bowl used for containing tin, a stirring mechanism rotationally installed in the containing bowl, and a feeding mechanism arranged in the stirring mechanism and capable of conveying scaling powder into the containing bowl. The technical problem that in the prior art, tin is not prone to being attached to a welding spot, and consequently the welding quality is reduced is solved.