Lead-free paste welding material and preparation method thereof

A technology for welding materials and lead-free solder alloys, applied in welding/cutting media/materials, welding equipment, welding media, etc., which can solve the problem of poor bonding strength and solder joint reliability, oxides that do not protect the melt, and limit the application of solder alloys, etc. problem, to achieve the effect of improving anti-oxidation performance, excellent reliability, and improving performance

Inactive Publication Date: 2017-03-08
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bonding strength of Sn-Zn based solder to the substrate and the reliability of solder joints are poor
In addition, Zn is an element that is easily oxidized, and oxides are more likely to form on the surface of the melt containing more Zn, and the oxides formed have no effect on protecting the melt, resulting in poor oxidation resistance of the solder, which limits the solder alloy. Applications

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A lead-free paste soldering material, which is made by mixing lead-free solder alloy powder and flux in a mass ratio of 10:0.9, and the lead-free solder alloy powder is made of the following raw materials: Zn 7wt%, Ti 0.15wt% and graphene 1.8wt%, the balance is Sn; the components of the flux are: 45wt% hydrogenated rosin, 8wt% glutaric acid and 6wt% hydrogenated castor oil, and the balance is benzyl alcohol.

[0027] The preparation method of lead-free solder alloy powder is as follows:

[0028] a. Encapsulate pure zinc ingots, pure titanium ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then fill with high-purity nitrogen protective gas to 1.1×10 5 Pa, and then the packaged raw materials are put into the reaction furnace for smelting at 650°C for heat treatment, and the melt is completely melted;

[0029] b. Graphene is placed in a stirring ball mill, filled with liquid nitrogen until the balls are completely submerged, then b...

Embodiment 2

[0037] A lead-free paste soldering material, which is made by mixing lead-free solder alloy powder and flux in a mass ratio of 11:1. The lead-free solder alloy powder is made of the following raw materials: Zn 5wt%, Ti 0.2wt% and graphene 02.4wt%, and the balance is Sn; the components of the flux are: hydrogenated rosin glyceride 50wt%, salicylic acid 3wt%, fatty acid amide 1wt%, ethylene bis-stearic acid amide 1wt%, The balance is ethanol.

[0038] The preparation method of lead-free solder alloy powder is as follows:

[0039] a. Encapsulate pure zinc ingots, pure titanium ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then fill with high-purity nitrogen protective gas to 1.2×10 5 Pa, and then the packaged raw materials are put into the reaction furnace for melting at 670°C heat treatment, and the completely melted melt;

[0040] b. Graphene is placed in a stirring ball mill, filled with liquid nitrogen until the balls are completel...

Embodiment 3

[0048] A lead-free paste soldering material, which is made by mixing lead-free solder alloy powder and flux in a mass ratio of 11:1.2, and the lead-free solder alloy powder is made of the following raw materials: Zn 10wt%, Ti 0.1wt% and graphene 0.6wt%, the balance is Sn; the components of the flux are: 40wt% methyl styrene resin, 12wt% salicylic acid and 8wt% polyethylene wax, and the balance is diethylene glycol.

[0049] The preparation method of lead-free solder alloy powder is as follows:

[0050] a. Encapsulate pure zinc ingots, pure titanium ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then fill with high-purity nitrogen protective gas to 1.2×10 5 Pa, and then the packaged raw materials are put into the reaction furnace for melting at 670°C heat treatment, and the completely melted melt;

[0051] b. Graphene is placed in a stirring ball mill, filled with liquid nitrogen until the balls are completely submerged, then ball mill...

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PUM

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Abstract

The invention proposes a lead-free paste welding material and a preparation method thereof. The lead-free paste welding material is prepared by mixing lead-free solder alloy powder with a flux according to a mass ratio of 10-11: 0.9-1.2; the lead-free solder alloy powder is prepared by the following raw materials: 5-10 wt% of Zn, 0.1-0.2 wt% of Ti, 0.6-2.4 wt% of graphene, and the balance of Sn; and the flux has the following components: 40-50 wt% of adhesive film forming agent, 3-12 wt% of activating agent, 2-8 wt% of thixotropy anti-sinking slipping agent, and the balance of solvent. The preparation method comprises the following steps: the lead-free solder alloy powder and the flux are mixed according to the mass ratio of 10-11: 0.9-1.2; the flux is firstly put in a synthesizer; then, solder powder of the lead-free solder alloy powder is added; the synthesizer is sealed; then, a vacuum system is started for vacuumizing to fill nitrogen to reach positive pressure; a stirring system is started for stirring; the stirring is stopped; and the discharge is performed to obtain the lead-free paste welding material. The lead-free paste welding material is excellent in welding point combination strength; and meanwhile, the flux is better in oxidation resistance without needing to add antioxidant.

Description

technical field [0001] The invention belongs to the technical field of paste soldering materials, and in particular relates to a lead-free paste soldering material and a preparation method thereof. Background technique [0002] With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. Traditional solder paste is gradually replaced because it contains a lot of lead and generates a lot of smoke and dust. The use of low-silver solder alloys is an important way to improve lead-free electronic assembly. The development trend of cost performance. In the existing market, there are solder pastes based on SAC305, but its disadvantage is that the cost is relatively high. Therefore, it is urgent to reduce the Ag content in the solder alloy to improve the cost performance of the assembly process. [0003] Sn-Zn solder is currently a lead-free solder that replaces Sn-Pb solder in the electronic pack...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/3613B23K35/40
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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