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Alcohol and water mixed-base cleaning-free soldering flux for wire connection

A flux, mixed-based technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of unsuitable flux and low activity, and achieve full solder joints, high qualified rate of finished products, and improved adaptive effect

Inactive Publication Date: 2012-01-04
YIYUAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This no-clean flux overcomes the hazards and dangers in the use of VOC substances as the main solvent of the flux and the preparation process, and is replaced by deionized water, and is also more suitable for soldering flux on the surface of printed circuit boards, but due to the The ingredients in the flux have low activity and are specially targeted at printed circuit boards, so they are not suitable for soldering fluxes used for wire lapping.

Method used

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  • Alcohol and water mixed-base cleaning-free soldering flux for wire connection
  • Alcohol and water mixed-base cleaning-free soldering flux for wire connection
  • Alcohol and water mixed-base cleaning-free soldering flux for wire connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 6

[0031] The active agent described in embodiment 6 is adipic acid, succinic acid diester, succinic acid amide and TX-100, and their weight ratio is 1: 3: 2: 1; Described film forming agent is poly Ethylene glycol 200, polyethylene glycol 300 and polyethylene glycol 600, their weight ratio is 3: 1: 2; Described corrosion inhibitor is benzotriazole; Described cosolvent is diethylene glycol and Diethylene glycol butyl ether, the weight ratio of the two is 1:3.

Embodiment 7

[0032] The active agent described in embodiment 7 is succinic acid amide; Described film-forming agent is polyethylene glycol 400 and polyethylene glycol 600, and their weight ratio is 3: 2; Described corrosion inhibitor is Ethylene glycol benzoazole; Described cosolvent is diethylene glycol butyl ether.

Embodiment 8

[0033] The described active agent described in embodiment 8 is succinic acid amide; Described film-forming agent is polyethylene glycol 400 and polyethylene glycol 300, and their weight ratio is 1: 2; Etching agent is ethylene glycol benzoxazole and benzotriazole, and the weight ratio of the two is 2: 3; Described auxiliary solvent is diethylene glycol butyl ether and diethylene glycol, and the weight ratio of the two is 4: 1.

[0034] After selecting raw materials according to the weight parts of all components in the above-mentioned Examples 1-8, firstly add the co-solvent and part of deionized water into the reaction kettle, then add the film-forming agent, stir until dissolved, then add the active agent and buffer etchant and the remaining deionized water, stir until all the components are dissolved, mix the materials evenly, and then filter and remove the filter residue. The obtained filtrate is the alcohol water used for wire bonding as described in Embodiments 1-8 of th...

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Abstract

The invention discloses an alcohol and water mixed-base cleaning-free soldering flux for wire connection, belonging to the technical field of soldering materials. The soldering flux comprises the raw materials by weight percent: 7.0-15 percent of activating agent, 0.5-2.0 percent of film-forming agent, 0.3-1.8 percent of corrosion inhibitor, 18-35 percent of cosolvent and the balance of deionized water. The soldering flux has the advantages of effectively removing oxides and dirt on the surfaces of various leads or pins and improving assembly adaptability of different components, and has the characteristics of stronger activity, high postwelding quality, full welding spots, no poor soldering or cold soldering, less corrosive residues, no need of cleaning, and long service life.

Description

technical field [0001] The invention relates to a welding flux, in particular to an alcohol-water mixed base no-cleaning flux used for wire bonding, and belongs to the technical field of welding materials. Background technique [0002] At present, most of the colored lights for landscape decoration on the market are made of winding wires and light-emitting diodes through low-temperature brazing, so that the wires and the pins of the light-emitting diodes are welded together to produce a colored light of the required length. components. These colorful lamp components can be wound on trees, hung on walls or other places, and after being powered on, they can emit light of different colors and form different light patterns, thereby achieving a decorative effect. [0003] In the prior art, semi-automatic dip soldering is mostly used for soldering between wires and lead wires of LEDs, and the solder used is mainly Sn-0.7Cu or Su-Ag-Cu lead-free solder. But because most of the ex...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 雷永平余洪桂林健符寒光吴中伟吴芝锭
Owner YIYUAN ELECTRONICS TECH
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