A kind of smokeless solder wire and preparation method thereof

A technology of solder wire and tin solder, applied in the direction of welding equipment, manufacturing tools, welding media, etc., can solve the problems of increasing the physical injury of soldering workers, generating smoke, affecting the environment, etc., to avoid empty soldering and bridging, and improve lubrication Humidity, excellent alkali resistance effect

Active Publication Date: 2021-11-16
SHENZHEN XINGHONGTAI TIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the temperature resistance of rosin can only reach 300°C, while the temperature of lead-free soldering iron tip needs to reach 360-450°C. Rosin will be carbonized or incompletely carbonized at 360-450°C, which will cause smoke during soldering and affect the environment. , and increase the physical injury to solder workers
[0004] In view of the above-mentioned related technologies, the applicant believes that the current solder wire prepared with rosin as a carrier has serious smoke in the solder

Method used

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  • A kind of smokeless solder wire and preparation method thereof
  • A kind of smokeless solder wire and preparation method thereof
  • A kind of smokeless solder wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0037]Preparation examples 1-23 provide a smokeless carrier, and preparation example 1 is taken as an example for illustration below.

[0038] A smokeless carrier provided in Preparation Example 1, the preparation steps are: heating 10g of diethylene glycol hexyl ether (CAS No.: 112-59-4) to 65°C and keeping it warm for 1h, then adding 20g of polyamide wax, stirring Evenly, finally add 40g of microcrystalline cellulose (model: 235486), stir until completely dissolved, and obtain a smokeless carrier;

[0039] Wherein, the polyamide wax is formed by mixing the polyamide wax with the grade of SUNMIDE 50 and the polyamide wax with the grade of MT 6900-20 in a mass ratio of 1:1.2.

preparation example 2-3

[0040] Preparation Examples 2-3 are the same as Preparation Example 1, except that the quality of the raw materials for the preparation of the smokeless carrier is different, see Table 2 for details.

[0041] Table 2

[0042] components Preparation Example 1 Preparation example 2 Preparation example 3 Diethylene glycol hexyl ether (g) 10 15 12.5 Microcrystalline Cellulose (g) 40 60 50 Polyamide wax (g) 20 30 25

[0043] Preparation Examples 4-5 are the same as Preparation Example 3, except that the composition of the polyamide wax is different, see Table 3 for details.

[0044] table 3

[0045]

[0046] Preparation Examples 6-11 are the same as Preparation Example 5, except that the type and composition of the cellulose are different, see Table 4 for details.

[0047] Table 4

[0048]

[0049] Preparation Examples 12-17 are the same as Preparation Example 10, except that the types and compositions of the ether solvents are di...

preparation example 18

[0052] Preparation Example 18 is the same as Preparation Example 1, except that the polyamide wax with the brand name of SUNMIDE 50 is replaced with polyamide wax with the brand name of PA-670.

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Abstract

The application relates to solder technology, in particular to a smokeless solder wire and a preparation method thereof. A smokeless solder wire, comprising a tin solder alloy and smokeless flux filled in the tin solder alloy, the mass ratio of the tin solder alloy to the smokeless flux is (97-98):(2-3 ), the smokeless flux includes a smokeless carrier and a flux activator, and the mass ratio of the smokeless carrier to a flux activator is (94-96): 5; the smokeless carrier consists of the following parts by weight Made of raw materials: 40-60 parts of cellulose, 20-30 parts of polyamide wax, 10-15 parts of ether solvent; the polyamide wax is a polyamide wax with an acid value less than 10mgKOH / g and a density of 0.88-0.9g / cm 3 A mixture of modified polyamide waxes. The smokeless solder wire provided by this application does not produce smoke during soldering, eliminates toxic and harmful gases, and the welded parts are clean and tidy after soldering.

Description

technical field [0001] The application relates to solder technology, in particular to a smokeless solder wire and a preparation method thereof. Background technique [0002] With the vigorous development of the electronics industry and the improvement of light weight, miniaturization and miniaturization of electronic products, the quality requirements of electronic products are more stringent, especially the emergence of environmentally friendly products, requiring the gradual replacement of tin-lead solder by lead-free solder. The current development of lead-free solder is very fast, especially lead-free ultra-fine wire. In electronic packaging, solder wire is a common soldering material for manual soldering or semi-automatic machine soldering. Solder wire is commonly used to electrically or mechanically connect electronic devices and electronic components. [0003] At present, in the application of soldering tin in the electronic and electrical industry, rosin is used as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/36B23K35/40
CPCB23K35/3612B23K35/40
Inventor 邢璧元王寿银王超邢璧凡
Owner SHENZHEN XINGHONGTAI TIN
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