Low-carbon low-volatility water-based flux and preparation method thereof

Abstract

The invention provides a low-carbon low-volatility water-based flux and a preparation method thereof. The low-carbon low-volatility water-based flux is prepared from the following components, by mass:2-4.5% of an active agent, 1.5-4% of a surface active agent, 0-0.4% of a film-forming agent, 0.01-0.3% of an antioxidant, 0.01-0.4% of a corrosion inhibitor and the balance a solvent, specifically, the active agent is prepared by mixing at least two of succinic acid, benzoic acid, DL-malic acid and adipic acid at the mass ratio of greater than 0% respectively at the temperature of 30-60 DEG C; and the surface active agent is any one of AEC-9NA or TX-10 phosphate, or the surface active agent is prepared by mixing both of the AEC-9NA and TX-10 phosphate at the mass ratio of greater than 0% respectively. The flux has low solid residue content, no halogen, no rosin, low carbon, no volatile organic compound, no irritating odor, little corrosion to a circuit board, and round and bright solder joints. Besides, the flux is easy to manufacture, quite low in cost, convenient to store and transport, free of solder explosion, stable in chemical property, free of influence on physical health of operators and environmentally friendly.

Description

technical field

[0001] The invention belongs to the chemical industry field of preparing flux for circuit welding, and relates to a low-carbon and low-volatility water-based flux and a preparation method thereof. Background technique

[0002] Flux is an indispensable part of the welding process, and its main function is to remove oxides on the metal surface. In addition, it can also protect the welding area, reduce the surface tension of the liquid solder, improve the diffusion of the liquid solder, enhance the filling ability, and improve the heat transfer and balance of the welding area.

[0003] At present, the active ingredients of some fluxes on the market contain halogens. Fluxes containing halogens can quickly remove the oxide film of the pad and enhance the wettability of the solder. However, the addition of halogens will weaken the reliability of solder joints and cause surface insulation. The reduction of resistance will also have adverse effects on the ecological...