47results about How to "Bright spot" patented technology

The invention discloses a low-splash and halogen-free welding agent for tin wires and a preparation method thereof. The welding agent is mainly used for agent cores of tin-based alloy tin wires. The welding agent is composed of, by weight, 80-90% of rosin and rosin derivatives, 5-15% of active agents, 0.1-2% of efficient surface active agents, 0.5-2% of corrosion inhibitors and 3-10% of viscosity modifiers. The prepared halogen-free welding agent for the tin wires is needless of any halogen element, is little in splash and smoke when welding is conducted, has high activity, is high in surface insulation resistance, and can be used for preparing tin-lead series tin wires, tin-copper series tin wires and tin-silver-copper series tin wires. The prepared tin wires are good in wetting performance, high in reliability after being welded, and light and full in welding point.

The invention relates to rosin used for scaling powder as well as a preparation method and application, belonging to the field of basic resin used for the scaling powder. Rosin which contains mercusicacid is taken as a raw material to prepare the rosin used for the scaling powder. The rosin used for the scaling powder has excellent solubility and crystallization resistance in a scaling powder solvent system, is high in weld-aid activity and low in corrosivity, and has very good wettability for brazing filler metal free of lead; and the rosin used for the scaling powder is good in both heat stability and film-forming property, and the formed welding spot is full, bright and regular.

The invention discloses scaling powder capable of preventing the head-in-pillow effect and a preparation method and application thereof, and belongs to the technical field of solder. The scaling powder capable of preventing the head-in-pillow effect comprises, by weight percentage, 30-50% of unsaturated rosin resin, 20-50% of solvents, 5-20% of thixotropic agents and 1-10% of organic acid. The scaling powder preventing the head-in-pillow effect is prepared through the steps of crushing the unsaturated rosin resin, adding the crushed unsaturated rosin resin into the organic acid, and heating the mixture to 90 DEG C while stirring; adding the solvents into the mixture, naturally cooling the mixture to 80 DEG C after the solvents are dispersed uniformly, adding polyamide into the mixture, and heating the mixture while the polyamide is dispersed until the whole solution becomes transparent; and naturally cooling the mixture to 60 DEG C, then adding hydrogenated castor oil into the mixture, and cooling the mixture to obtain light yellow paste. After the scaling powder is mixed with lead-free tin powder to prepare soldering paste, the requirements of reflow soldering working conditions with long soaking and preheating time and high soaking and preheating temperature can be met, and good effects with good wetting property and bright welding spots and almost without tin sweats can be realized. The scaling powder has excellent performance of preventing the head-in-pillow effect.

The invention provides a water based detergent used for high density packing and a cleaning method. The water based detergent is prepared from the following raw materials by mass percentage: 6%-12% ofa surfactant, 0%-0.1% of a corrosion inhibitor, 0%-0.05% of a defoaming agent and the balance of deionized water, wherein the surfactant is formed by compounding the following ingredients by weight percentage: 50%-69% of a nonionic surfactant, 30%-49% of a waterborne anionic surfactant and 1%-20% of a binary starnonionic surfactant. Through the match of the detergent and a cleaning process, surface residues after welding of a rosin flux can be strongly removed, a welding spot keeps bright, and the insulating property of the surface is high; the detergent is completely halogen-free, is low involatility, is safe and environmentally friendly and does not generate public nuisance substances. The water based detergent is low in cost and simple in preparation method, almost no foam is generated in a cleaning process, and the cleaning process is easily operated.

The invention provides a low-foam high-efficiency water-base detergent and a cleaning method. The low-foam high-efficiency water-base detergent is prepared from the following raw materials in percentage by mass: 6-12% of a surfactant, 0-0.1% of a corrosion inhibitor, 0-0.5% of a defoaming agent and the balance of deionized water, wherein a nonionic surfactant is prepared from any one, two, three or four of fatty alcohol-polyoxyethylene ether, Tween-20, alkylphenol polyoxyethylene 9-ether and triethanolamine through mixing in a respective mass ratio greater than 0%; and a cationic surfactant isprepared from any one, two or three of hexadecyl trimethyl ammonium chloride, tetradecyl trimethyl ammonium chloride and dodecyl trimethyl ammonium chloride through mixing in a respective mass ratiogreater than 0%. Together with a cleaning process, the detergent is capable of strongly removing surface residues after welding of a rosin type welding flux, a welding point is kept bright, and good surface insulation is achieved; and the detergent is low in volatilization in the cleaning process, free of pollution substance which can affect health of operators, and in addition free of bubble in the cleaning process.

The invention provides a low-volatilization high-performance water-base detergent and a cleaning method. The low-volatilization high-performance water-base detergent is prepared from the following rawmaterials in percentage by mass: 6-12% of a surfactant, 0-0.1% of a corrosion inhibitor, 0-0.5% of a defoaming agent and the balance of deionized water, wherein the surfactant is prepared from a nonionic surfactant, a zwitterionic surfactant, a binary star nonionic surfactant and a cationic surfactant through compounding; the nonionic surfactant and the binary star nonionic surfactant account for50-69% of the total weight of the surfactant; the zwitterionic surfactant accounts for 10-25% of the total weight of the surfactant; and the cationic surfactant accounts for 15-35% of the total weight of the surfactant. Together with a cleaning process, the detergent is capable of strongly removing surface residues after welding of a rosin type welding flux, a welding point is kept bright, and good surface insulation is achieved; and compared with a conventional detergent, the detergent is completely low in volatilization, safe and environmental-friendly, free of pollution substance, free ofbubble in the cleaning process, and easy in cleaning process operation.

The invention provides a low-carbon low-volatility water-based flux and a preparation method thereof. The low-carbon low-volatility water-based flux is prepared from the following components, by mass:2-4.5% of an active agent, 1.5-4% of a surface active agent, 0-0.4% of a film-forming agent, 0.01-0.3% of an antioxidant, 0.01-0.4% of a corrosion inhibitor and the balance a solvent, specifically, the active agent is prepared by mixing at least two of succinic acid, benzoic acid, DL-malic acid and adipic acid at the mass ratio of greater than 0% respectively at the temperature of 30-60 DEG C; and the surface active agent is any one of AEC-9NA or TX-10 phosphate, or the surface active agent is prepared by mixing both of the AEC-9NA and TX-10 phosphate at the mass ratio of greater than 0% respectively. The flux has low solid residue content, no halogen, no rosin, low carbon, no volatile organic compound, no irritating odor, little corrosion to a circuit board, and round and bright solder joints. Besides, the flux is easy to manufacture, quite low in cost, convenient to store and transport, free of solder explosion, stable in chemical property, free of influence on physical health of operators and environmentally friendly.

The invention provides a lead-free solder paste comprising the tin base alloy welding powder and the pewter. The components of the tin base alloy welding powder are as follows (in % by weight): Sn 91-99, Cu 0.5-3, Ag 0.5-6; the components of the pewter are as follows (in % by weight): mixed alcohol ether 25-40, natural colophony 50-70, natural vegetable oil thixotropic agent 5-15, organic acid 0.5-2.0, additives. The lead-free solder paste preparing process includes the following steps: mixing the components of the pewter in proportion, standing to room temperature, putting the pewter in a refrigerating chamber with the temperature of 1 C. to 10 C. for 48 hours; mixing the pewter and the tin base alloy welding powder in the ratio of 1 to 9 in the vacuum dispersion machine, putting the mixture in the package bottle and storing hermetically with the temperature of between 5 C. and 10 C.. The lead-free solder paste is characterized by good surface activity, moderated viscosity, and no smell.

The invention relates to the technical field of tin wires, in particular to a composite halogen-free lead-free tin wire in line with the EU (European Union) directive. The tin wires comprise the following components in parts by per unit mass: 96-98 parts of tin, 0.6-0.7 part of copper, 0.1-0.2 part of resin, 0.1-0.2 part of non-fluorochloro environmentally-friendly organic solvent, 0.05-0.06 part of thixotropic agnet, 0.02-0.4 part of organic active agent, 0.01-0.02 part of corrosion inhibitor, and 0.01-0.02 part of surfactant, wherein the tin and the copper are the solder of the tin wire, and others are soldering flux. By using said technical scheme in the invention, the product is in line with relative directive of the EU and free from lead and relative halogen. Furthermore, the reliability of the welding is high, bad welding spot cannot be formed, and the welding spot is full and bright.

The invention relates to the technical field of cleaning agents, and specifically discloses a green and environment-friendly neutral water-based cleaning agent as well as its preparation method and application. The cleaning agent includes the following components in mass percentage: surfactant 3%-10%; oil-soluble solvent 10%-20%; builder 2%-8%; defoamer 0.1%-0.5%; deionized water 65%‑80%. The raw materials of the present invention are all neutral products with mild performance, and the cleaning agent produced has light smell, no halogen, no flash point, no corrosion of materials, no phosphorus and environmental protection, no influence on the cleaned components, and good material compatibility , non-flammable, non-explosive, safe to use, strong cleaning power, and the solder joints of parts after cleaning remain bright, etc., suitable for PCB cleaning.

The invention discloses a complex environment water-based cleaning agent, which is characterized in that it is made of the following raw materials in weight percentage: surfactant: 3%-12%; corrosion inhibitor: 0.01%-0.25%; defoamer: 0.1%~0.3%; the balance is deionized water, and the sum of the weight percentages of each component is 100%. The water-based cleaning agent obtained by the present invention can quickly and effectively remove flux residues and other pollutants on the surface of components, and has good compatibility and wide application range, especially suitable for complex environments such as high temperature, high acid, alkali and high oxidation In the cleaning process; low foam, low volatility, low toxicity, good cleaning effect, no residue on the surface after washing, and bright solder joints; the water-based cleaning agent is simple to prepare, and the cleaning process is easy to operate. It is used in conjunction with automatic spray cleaning and ultrasonic cleaning on the market.

The invention discloses a halogen-free high-activity cleaning-free solvent type soldering flux. The halogen-free high-activity cleaning-free solvent type soldering flux comprises the following components of, in percentage by mass, 1.8%-5.8% of an active agent, 0%-0.15% of surfactant, 0.08%-1.5% of an antioxidant, 0.05%-0.5% of a corrosion inhibitor, 0.08%-1.5% of an additive, 0%-1.5% of a foamingagent, and the balance a solvent, and the total mass of the whole components is 100%. The halogen-free high-activity cleaning-free solvent type soldering flux has the advantages of no halide, no toxicity, no pungent smell and no harm to the human body and the natural environment, and greatly reduces the corrosion to a circuit board; the activity is high, the soldering assisting effect is obvious,the wettability is good, welding spots are full and free of retraction and tin explosion, the high-integration packaging is met, and other auxiliary equipment does not need to be used; the surface ofthe circuit board is extremely low in residue, and the welding spots are attractive and bright; and the soldering flux has good universality for Sn-Ag, Sn-Cu series or low silver lead-free solder alloys.

The invention provides a solder paste for improving the soldering performance of BGA packaging, which is made of tin powder and solder paste with a mass ratio of 89:11; wherein, the solder paste is composed of the following components by weight: Rosin 35 ~40 parts, 40~45 parts of solvent, 5~10 parts of thixotropic agent, 5~10 parts of active agent, 1~2 parts of antioxidant, 1~2 parts of polyazide modifier, 0.5 parts of fluorocarbon surfactant ~ 1 serving. The invention also provides a preparation method of the solder paste. The solder paste provided by the invention can effectively avoid the poor soldering performance caused by the temperature inside the cover plate, and obtain good soldering effects of moistness, bright solder joints and no tin beads.

A flux for improving the wetting and spreading performane of lead-free SnZn solder is proportionally prepared from rosin, surfactant FSN, benzotriazazole and absolute alcohole through proportionally dissolving said components in absolute alcohol in sealed state, and filtering.

The invention discloses soldering paste special for aluminum material soldering and a preparation method and a using method thereof. The soldering paste is prepared from, by weight, 84-89% of solder powder, 8-12% of scaling powder and 2-5% of a dispersing agent. The solder powder is prepared from, by weight, 3.2-4.8% of Zn, 1.6-2.4% of Bi, 0.7-1.3% of In, 0.4-0.8% of Ga, 0.2-0.5% of Sb, 0.1-0.3% of Ru and the balance Sn. The scaling powder is prepared from, by weight, 40-50% of a main material, 20-35% of a solvent, 8-16% of an activating agent, 4-8% of a thixotropic agent, 2-4% of a surfactantand 1-3% of antioxidant. The soldering paste has excellent tin soldering performance, welding spots are full, bright and firm, and lead is not used, so that safety and environment protection are achieved.