The invention discloses scaling
powder capable of preventing the head-in-pillow effect and a preparation method and application thereof, and belongs to the technical field of solder. The scaling
powder capable of preventing the head-in-pillow effect comprises, by weight percentage, 30-50% of unsaturated
rosin resin, 20-50% of solvents, 5-20% of thixotropic agents and 1-10% of
organic acid. The scaling
powder preventing the head-in-pillow effect is prepared through the steps of crushing the unsaturated
rosin resin, adding the crushed unsaturated
rosin resin into the
organic acid, and heating the mixture to 90 DEG C while stirring; adding the solvents into the mixture, naturally cooling the mixture to 80 DEG C after the solvents are dispersed uniformly, adding
polyamide into the mixture, and heating the mixture while the
polyamide is dispersed until the whole solution becomes transparent; and naturally cooling the mixture to 60 DEG C, then adding hydrogenated
castor oil into the mixture, and cooling the mixture to obtain light yellow paste. After the scaling powder is mixed with lead-free
tin powder to prepare
soldering paste, the requirements of
reflow soldering working conditions with long soaking and preheating time and high soaking and preheating temperature can be met, and good effects with good
wetting property and bright
welding spots and almost without
tin sweats can be realized. The scaling powder has excellent performance of preventing the head-in-pillow effect.