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Cooling water discharge device for semiconductor processing

This utility model relates to the field of semiconductor processing equipment technology, and more particularly to a cooling drainage device for semiconductor processing. It includes a cooling water tank, with lifting components on both sides of the tank, and a fixing component mounted on the lifting components, the fixing component located inside the cooling water tank. In this utility model, the wafer semiconductor is directly placed on the placement plate of the fixing component. After the fixing component descends, the wafer can be quickly immersed in the coolant in the cooling water tank, achieving direct contact cooling. Unlike the prior art where cooling pipes are located on the side of the cooling tank and indirect cooling of the semiconductor requires waiting for the water level to rise, this device avoids cooling delay, significantly accelerates heat transfer, and significantly improves the cooling efficiency of the semiconductor, meeting the stringent requirements of semiconductor production for cooling timeliness.
Owner:YANCHENG DEKAL ELECTRONIC TECHNOLOGY CO LTD