This utility model relates to the field of
semiconductor processing equipment technology, and more particularly to a cooling drainage device for
semiconductor processing. It includes a cooling water tank, with lifting components on both sides of the tank, and a fixing component mounted on the lifting components, the fixing component located inside the cooling water tank. In this utility model, the
wafer semiconductor is directly placed on the placement plate of the fixing component. After the fixing component descends, the
wafer can be quickly immersed in the
coolant in the cooling water tank, achieving direct contact cooling. Unlike the prior art where cooling pipes are located on the side of the cooling tank and indirect cooling of the semiconductor requires waiting for the
water level to rise, this device avoids cooling
delay, significantly accelerates
heat transfer, and significantly improves the
cooling efficiency of the semiconductor, meeting the stringent requirements of
semiconductor production for cooling timeliness.