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Oxygen-permeation-resistant soldering paste and preparation method thereof

A solder paste, oxygen penetration technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of welding defects, oxidation inactivation of active components, etc., and achieve bright solder joints, good wetting, and improved oxidation resistance. Effect

Active Publication Date: 2017-09-12
HOERSON ELECTRONICS TECH
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Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide an anti-oxidation permeation solder paste and its preparation method, aiming to solve the problem that the existing solder paste easily oxidizes and deactivates the active components in the solder paste during the surface assembly process , resulting in the problem of soldering defects

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  • Oxygen-permeation-resistant soldering paste and preparation method thereof

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Embodiment 1

[0037] The present invention provides an anti-oxidation permeation solder paste, which includes the following components by weight percentage: metal tin powder 80-90%wt, solder paste 10-20%wt, wherein the solder paste is measured by the following weight percentage Components: butyl ether 20-28%wt, butene 10-15%wt, corrosion inhibitor imidazole and benzotriazole 3-5%wt, thixotropic agent modified hydrogenated castor oil 2-5%wt, add active Agent 5-10%wt, described active agent comprises the polyethylene glycol of 60-80%wt, the malonic acid of 4-10%wt and the dibromobutene glycol of 16-30%wt, as the present invention preferred implementation.

[0038] The preparation method of above-mentioned anti-oxidation penetration solder paste comprises the following steps:

[0039] A. Put 20-28%wt of butyl ether and 10-15%wt of butene into the mixer for stirring and dispersing. The dispersing rate is 10000rpm / min, and the dispersing temperature is 90℃. Mix and disperse until it becomes tra...

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Abstract

The invention discloses oxygen-permeation-resistant soldering paste and a preparation method thereof. The oxygen-permeation-resistant soldering paste comprises, by weight, 80-90% of tin powder and 10-20% of paste flux, wherein the paste flux comprises, by weight, 20-28% of butyl ether, 10-15% of butene, 3-5% of a corrosion inhibitor, 2-5% of thixotropic agent modified hydrogenated castor oil and 5-10% of an active agent. According to the oxygen-permeation-resistant soldering paste provided by the invention, under the saddle-type reflux temperature curve conditions, the oxidation resistance of the paste flux is obviously improved through formula improvement even though under the long-time high temperature preservation, so that the losses of the active agent are reduced to the minimum, and the good effects of good wetting, bright welding spots and almost inexistence of soldering balls are achieved in the welding process.

Description

technical field [0001] The invention relates to the technical field of solder, in particular to an anti-oxygen penetration solder paste and a preparation method thereof. Background technique [0002] With the development of miniaturization and thinning of electronic products, surface mount technology has become the most important electronic product assembly technology, and solder paste has also become the most important electronic product assembly welding material. The surface mount technology process is mainly divided into three steps: printing solder paste on the PCB pad, mounting components, and reflow soldering. Among them, in the reflow soldering process, in order to achieve as uniform temperature as possible among the various components on the complex board assembly, it is generally necessary to use a saddle-shaped reflow temperature curve for soldering; that is, in the reflow temperature curve, before the reflow zone There is a high temperature holding phase that las...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/3615B23K35/40
Inventor 马鑫李高峰汪敏
Owner HOERSON ELECTRONICS TECH
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