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Water based detergent used for high density packing and cleaning method

A water-based, high-density technology, applied in the directions of cleaning methods, detergent compositions, detergent compounding agents, etc., can solve the problems of affecting the health of workers, cumbersome preparation methods of cleaning agents, and complicated components, and achieve low cost, The cleaning process is easy to operate and the preparation method is simple.

Pending Publication Date: 2019-02-22
CHONGQING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation method of the cleaning agent is cumbersome, and an ultrasonic machine is needed as an auxiliary equipment in the preparation process, and the composition is complex, resulting in high cost, and the added ethanol, isopropanol, etc. are volatile drugs, which affect the health of the staff

Method used

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Examples

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Effect test

preparation example Construction

[0049] A method for preparing a high-density packaged water-based cleaning agent. According to the ingredients and content ratios contained in any one of the aforementioned water-based cleaning agents, the raw materials of each component are measured respectively, and at normal temperature and pressure, in a room with a stirrer Add deionized water into the reaction kettle to start stirring, then add surfactant, corrosion inhibitor and defoamer respectively, continue stirring until completely mixed, stop stirring and let stand.

[0050] A high-density packaging water-based cleaning agent cleaning method is characterized in that it comprises the following steps:

[0051] 1) The parts to be cleaned are soaked in 80℃+2℃ for 35~50min;

[0052] 2) Put the configured cleaning agent and the parts to be cleaned in the ultrasonic cleaning machine, adjust the initial temperature to 60°C-65°C, and ultrasonically clean for 25~40min. The power of the selected ultrasonic machine is 100~800W ...

Embodiment 1

[0056] The composition of water-based cleaning agent for high-density packaging is as follows: Surfactant accounts for 6% by weight, of which fatty alcohol polyoxyethylene ether: DuPont fluorocarbon surfactant 3100: Surfyonl440=5:4:1, corrosion inhibitor 0.01% , is benzotriazole, defoamer 0.01%, is polyether modified silicone oil, and the balance is deionized water.

Embodiment 2

[0058] The composition of water-based cleaning agent for high-density packaging is as follows: Surfactant accounts for 7% by weight, of which Tween 20: DuPont fluorocarbon surfactant 3100: Surfyonl440=6:3:1, corrosion inhibitor 0.02%, which is benzene And triazole, defoamer 0.018%, is polyether modified silicone oil, and the balance is deionized water.

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Abstract

The invention provides a water based detergent used for high density packing and a cleaning method. The water based detergent is prepared from the following raw materials by mass percentage: 6%-12% ofa surfactant, 0%-0.1% of a corrosion inhibitor, 0%-0.05% of a defoaming agent and the balance of deionized water, wherein the surfactant is formed by compounding the following ingredients by weight percentage: 50%-69% of a nonionic surfactant, 30%-49% of a waterborne anionic surfactant and 1%-20% of a binary starnonionic surfactant. Through the match of the detergent and a cleaning process, surface residues after welding of a rosin flux can be strongly removed, a welding spot keeps bright, and the insulating property of the surface is high; the detergent is completely halogen-free, is low involatility, is safe and environmentally friendly and does not generate public nuisance substances. The water based detergent is low in cost and simple in preparation method, almost no foam is generated in a cleaning process, and the cleaning process is easily operated.

Description

technical field [0001] The invention belongs to the field of post-soldering cleaning agent manufacturing for electronic products, and relates to a water-based cleaning agent for high-density packaging and a cleaning process method. Background technique [0002] Today's society is already in the heyday of the information age, and people have higher and higher requirements for the function and reliability (life) of electronic products, which promotes the development of electronic products in the direction of multi-function, high performance, miniaturization and light weight. , so as to introduce advanced high-density packaging, and its BGA packaging technology is the most typical, but after soldering, there will inevitably be residues such as flux, flux, solder paste and other foreign pollutants on the component pins, which will not only It will make the product reliability worse, and may lead to electrical failure caused by short circuit and corrosion in the later stage. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/825C11D3/28C11D3/30C11D3/37C11D3/60C11D11/00
CPCC11D1/825C11D3/28C11D3/30C11D3/3738C11D1/008C11D1/72C11D1/66C11D2111/44C11D2111/46C11D2111/14C11D2111/22
Inventor 甘贵生曹华东刘歆田谧哲夏大权蒋刘杰吴应雪蒋妮曹俊昌
Owner CHONGQING UNIV OF TECH
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