Water-based flux cleaning agent as well as preparation method and application thereof

Abstract

The invention provides a water-based flux cleaning agent as well as a preparation method and application thereof. The water-based flux cleaning agent comprises the following components in parts by weight: 5-30 parts of alcohol amine; 10-55 parts of a glycol ether compound; 1-25 parts of a polar solvent; 0.001 to 10 parts of a chelating type surfactant; 0.1 to 5 parts of a pH regulator; 0.1 to 10 parts of amino acid; 0.001 to 10 parts of a wetting agent; and 5-60 parts of deionized water. The invention further discloses a preparation method and application of the water-based flux cleaning agent. The water-based flux cleaning agent is low in use concentration and harmless to human bodies and the environment. The water-based flux cleaning agent disclosed by the invention has excellent flux cleaning capability, and can inhibit oxidation and corrosion of a chip substrate, so that the yield of chips is effectively improved.

Description

technical field

[0001] The invention relates to cleaning agent technology, in particular to a water-based flux cleaning agent, its preparation method and application. Background technique

[0002] In the electronics industry, flux can effectively remove solder and oxides contained in the base material during the soldering process, and prevent the metal substrate from being further oxidized during the soldering process, reducing the surface tension of the solder and improving soldering performance. However, after soldering, flux will inevitably remain on the surface of the object to be soldered, which not only affects the appearance, but also leads to the reliability of the chip; especially when electronic products work under high temperature and humidity conditions for a long time, the residue will be It may lead to problems such as line insulation aging and corrosion, and then a decrease in insulation resistance (SIR) and occurrence of electrochemical migration (ECM). Ther...

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