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Water-based flux cleaning agent as well as preparation method and application thereof

A flux, water-based technology, used in the field of cleaning agents, can solve the problems of low concentration and reduced chip reliability, and achieve the effects of preventing corrosion, increasing yield, strong surface activity and chelating ability

Active Publication Date: 2022-03-01
ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to propose a water-based flux cleaning agent for the problem that the reliability of the chip is reduced due to the residual flux. While having excellent flux cleaning ability, the flux can also inhibit the oxidation and corrosion of the chip substrate, effectively improving the yield rate of the chip

Method used

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  • Water-based flux cleaning agent as well as preparation method and application thereof
  • Water-based flux cleaning agent as well as preparation method and application thereof
  • Water-based flux cleaning agent as well as preparation method and application thereof

Examples

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Embodiment 1-20

[0040] Table 1 provides the components and contents of Examples 1-20, wherein the general formula of the chelating surfactant is as formula I, the general formula of the pH regulator aliphatic hydroxy acid is as formula II, and the wetting agent The general formula is as formula III. The raw materials and reagents used in the present invention are all commercially available.

[0041] The preparation method of embodiment 1-20 water-based flux cleaning agent is as follows:

[0042] 1) Stir and dissolve deionized water and amino acid for 30-60 minutes to prepare component A;

[0043] 2) adding glycol ether compound, polar solvent, alcohol amine, pH regulator, chelating surfactant and wetting agent in sequence, stirring and dissolving for 30-60 minutes to prepare component B;

[0044] 3) Then component A and component B were mixed and stirred for 30-60 minutes, mixed evenly and filtered with a 0.1-0.5um filter element to obtain a water-based flux cleaning agent.

[0045] The clea...

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Abstract

The invention provides a water-based flux cleaning agent as well as a preparation method and application thereof. The water-based flux cleaning agent comprises the following components in parts by weight: 5-30 parts of alcohol amine; 10-55 parts of a glycol ether compound; 1-25 parts of a polar solvent; 0.001 to 10 parts of a chelating type surfactant; 0.1 to 5 parts of a pH regulator; 0.1 to 10 parts of amino acid; 0.001 to 10 parts of a wetting agent; and 5-60 parts of deionized water. The invention further discloses a preparation method and application of the water-based flux cleaning agent. The water-based flux cleaning agent is low in use concentration and harmless to human bodies and the environment. The water-based flux cleaning agent disclosed by the invention has excellent flux cleaning capability, and can inhibit oxidation and corrosion of a chip substrate, so that the yield of chips is effectively improved.

Description

technical field [0001] The invention relates to cleaning agent technology, in particular to a water-based flux cleaning agent, its preparation method and application. Background technique [0002] In the electronics industry, flux can effectively remove solder and oxides contained in the base material during the soldering process, and prevent the metal substrate from being further oxidized during the soldering process, reducing the surface tension of the solder and improving soldering performance. However, after soldering, flux will inevitably remain on the surface of the object to be soldered, which not only affects the appearance, but also leads to the reliability of the chip; especially when electronic products work under high temperature and humidity conditions for a long time, the residue will be It may lead to problems such as line insulation aging and corrosion, and then a decrease in insulation resistance (SIR) and occurrence of electrochemical migration (ECM). Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/37C11D3/60C11D3/20C11D3/28C11D3/30C11D3/32C11D3/33C11D3/43C11D11/00H01L21/60
CPCC11D1/37C11D3/0047C11D3/0073C11D3/2086C11D3/30C11D3/2068C11D3/33C11D3/32C11D3/28C11D3/43H01L24/80C11D1/10C11D1/146C11D2111/22
Inventor 侯军任浩楠
Owner ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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