208results about "Anticorrosion compositions" patented technology

A treatment liquid for a semiconductor device contains water, a removing agent, and a copolymer. The copolymer has a first repeating unit having at least one group selected from a primary amino group, a secondary amino group, a tertiary amino group, and a quaternary ammonium cation, and a second repeating unit different from the first repeating unit. A substrate treatment method using the treatment liquid is also provided.

The present invention addresses the problem of providing a processing liquid for a semiconductor device, said processing liquid having excellent corrosion resistance with respect to a metal-containing layer, excellent removability of an object to be removed, and excellent solubility in a post-processing liquid. The present invention also addresses the problem of providing a method for processing a substrate using the processing liquid. This processing liquid for a semiconductor device contains water, a remover, and a copolymer, the copolymer having a first repeating unit having at least one group selected from the group consisting of a primary amino group, a secondary amino group, a tertiary amino group, and a quaternary ammonium cation, and a second repeating unit different from the first repeating unit.

A treatment composition that includes a treatment adjunct and a population of core / shell delivery particles, where the shell is made from an acid-treated chitosan and a cross-linking agent, where the acid-treated chitosan results from treating chitosan with a weak acid, or even a mixture of a strong acid and a weak acid. Related methods of making and using such compositions.

The invention relates to the technical field of dirt cleaning agents, in particular to a complex dirt removing and preventing chelating cleaning agent for an oil field pipeline oil well and a preparation process thereof, and the cleaning agent comprises an organic chelating agent, a dispersing agent, a polymer activator, a mutual solvent, 1%-5% of a corrosion inhibitor and 50%-83% of deionized water. The target cleaning agent is obtained by quantitatively weighing all the effective components, compounding all the components step by step, adding deionized water into all the effective components, and uniformly mixing, so that various complex scales such as barium and strontium scales generated by oil field pipelines, oil wells and the like can be solved; and the cleaning agent has good cleaning and anti-scaling effects on barium and strontium scales and other complex scales. The efficient polymer activator and the neutral corrosion inhibitor added in the invention can effectively inhibit the formation of calcium strontium barium sulfur salt, carbonate scale and iron oxide precipitate in the oilfield water injection system, effectively reduce the corrosion rate and prolong the service life of equipment.

The invention discloses a composite CIP (cleaning in place) acidic cleaning agent for food processing, which is prepared from the following raw materials in parts by weight according to 100 parts. The cleaning agent is prepared from the following components in parts by weight: 20-50 parts of nitric acid, 0.5-5 parts of sodium gluconate, 1-5 parts of hydroxyethylidene diphosphonic acid, 2-5 parts of citric acid, 1-3 parts of phosphoric acid, 0.5-2 parts of a surfactant and 30-75 parts of deionized water. Meanwhile, the invention further provides a preparation method of the cleaning agent. The cleaning agent is high in cleaning efficiency, low in foam, easy to wash, high in seepage force and small in corrosivity.

An object of the invention is to provide a method of cleaning semiconductor substrates that is excellent in abrasive particle removing performance with respect to semiconductor substrates having undergone CMP, as well as a cleaning liquid for semiconductor substrates having undergone CMP. The invention provides a method of cleaning semiconductor substrates, the method comprising a cleaning step of cleaning, by use of a cleaning liquid, a semiconductor substrate having undergone CMP using a polishing liquid containing abrasive particles. The semiconductor substrate contains metal, and the cleaning liquid has a pH of more than 7 at 25° C. The cleaning liquid comprises: a chelating agent; a specific component A; and an anticorrosive. The method satisfies Condition 1 that a product of a contact angle ratio obtained by a specific test method 1 and a specific degree of agglomeration obtained by a specific test method 2 is not more than 15.

The present invention relates to a photoresist stripper composition for manufacturing a display, and more particularly, to an integrated photoresist stripper composition which can be used in every process for manufacturing a display. More specifically, the photoresist stripper composition for manufacturing a display according to the present invention can be applied to all of transition metals and oxide semiconductor wirings, and has an excellent ability to remove modified photoresist after a hard bake process, and implant process, and a dry etch process have been performed. In particular, the photoresist stripper composition for manufacturing a display according to the present invention exhibits a corrosion inhibitory effect that has been further specialized for copper (Cu) wiring pattern edge portions which are susceptible to corrosion following dry-etching.

STEEL-COMPATIBLE FOAMING COMPOSITION FOR AID-ASSISTED HYDROCARBON RECOVERY The present invention relates to a corrosion-inhibiting foaming composition comprising a) a surfactant composition including at least one amphoteric compound and optionally one or more additional surfactants selected from ionic and non-ionic surfactants, and b) at least one sulfur compound. The invention also relates to the use of said foaming composition to prevent corrosion formation, as well as the process for assisted hydrocarbon recovery employing said foaming composition. Fig.: none

The present invention relates to an automatic dishwashing (ADW) composition comprising as component (A) at least one imidazole-based compound selected from the group consisting of unsubstituted or at least monosubstituted imidazole and benzimidazole as defined below in further detail. The inventive automatic dishwashing composition may contain further components, such as polyakylene imines (component (B)), at least one silicate (component (C)) and / or at least one chelating agent (component (D)). The present invention further relates to a process for cleaning dishware employing said ADW composition according to the present invention as well as to the use of said ADW composition, for example, to reduce any corrosion, such as silver corrosion on the items to be dishwashed (dishware). Beyond that, the present invention relates to the use of at least one imidazole-based compound according to component (A) as corrosion inhibitor in such automatic dishwashing processes.

Cleaning compositions and the method of using the same are disclosed, where the compositions include one or more alkanolamines, one or more ether alcohol solvents or aromatic containing alcohol, one or more corrosion inhibitors, and optionally one or more secondary solvents.

A cleaning agent which contains, separately from one another in a packaging form, at least one enzyme-containing preparation and at least one builder-containing preparation, as well as a clear rinser preparation.

The present invention provides a cleaning composition comprises water; one or more organic acid; at least two surfactants wherein the first type surfactant is a diphenyl disulfonic surfactant, the second type surfactant has a surface tension of less than 50 dynes / cm at 0.01wt% concentration in water, and the second type surfactant is not the first type surfactant; and optionally fluoride compounds, polymers, corrosion inhibitors, biological preservatives, pH adjusting agents.

The present invention provides a composition for cleaning a semiconductor substrate, the composition having a high tungsten oxide removal rate, while having Ti / W etching selectivity.　A composition for cleaning a semiconductor substrate, the composition containing (A) an oxidant, (B) a fluorine compound, (C) a tungsten metal corrosion inhibitor and (D) a tungsten oxide etching accelerator, wherein: the addition ratio of the oxidant (A) is 0.0001% to 10% by mass relative to the total mass of the composition for cleaning a semiconductor substrate; the addition ratio of the fluorine compound (B) is 0.005% to 10% by mass relative to the total mass of the composition for cleaning a semiconductor substrate; and the addition ratio of the tungsten metal corrosion inhibitor (C) is 0.0001% to 5% by mass relative to the total mass of the composition for cleaning a semiconductor substrate.

The present application provides a treatment liquid which is excellent in removal of organic residues and excellent in stability. A treatment method of a treated object related to the above treatment liquid is also provided. The treatment liquid contains water, hydroxylamine, and hydrazine species selected from one or more of hydrazine, hydrazine salts, and hydrazine derivatives, and the total content of the hydrazine species is 1 parts by mass or less relative to 100 parts by mass of the hydroxylamine.

There are provided a processing solution containing an alkali compound, water, and a corrosion inhibitor, in which the amount of dissolved oxygen one week after the preparation of the processing solution is 0.2 mg / L or more and 1.5 mg / L or less, and the corrosion inhibitor is at least one selected from the group consisting of N,N-diethylhydroxylamine, 1-thioglycerol, 1-amino-4-methylpiperazine, carbohydrazide, methylethylketoxime, erythorbic acid, and salts thereof, a method for manufacturing the processing solution, and a method for processing a substrate and a method for manufacturing a semiconductor device using the processing solution.

A liquid detergent concentrate comprising: a. at least one phosphonate; b. a first chelating agent selected from aminopolycarboxylic acids, hydroxycarboxylic acids, hydroxypolycarboxylic acids, and salts thereof; and c. at least one enzyme, preferably a proteolytic enzyme, and having a pH of 9 or greater. The present invention also relates to a ready-to-use solution; its use for cleaning and / or disinfecting objects; and a cleaning method.

The invention relates to a metal anti-corrosion cleaning agent, a preparation method and application, and the metal anti-corrosion cleaning agent comprises the following components in parts by weight: 0.001-0.06 part of a composite functional agent; 0.1 to 3 parts of a pH regulator; 0.01 to 1 part of inorganic acid; 50-80 parts of an organic solvent; and 20-50 parts of ultrapure water. The thienyl carboxylic ester derivative and the alkanol derivative are combined, the thienyl carboxylic ester derivative removes metal ions (such as Cu < + > and Fe < + >) in a targeted mode by means of the strong chelating capacity of ester groups, and organic pollutants are stripped through the pi-pi effect; the alkanol derivative wraps non-polar residual gum by using a long-chain hydrophobic end, and a hydrophilic end enhances the wettability of a solution, so that full-coverage cleaning of a nano-scale structure is realized.

This disclosure describes a composition which can provide real-time feedback during medical device cleaning or reprocessing. The composition can be used to monitor the amount of biological material cleaned from medical devices and to determine when cleaning is complete. The disclosure also relates to a method of cleaning, or assessing the cleanliness of, a medical device such as an endoscope. Cleanliness can be assessed by contacting the medical device with the composition, shining an excitation light on the composition, and measuring intensity of resulting fluorescence over time.

The disclosure provides a cleaning composition, comprising purified water, sodium ionized water, coconut oil, calcium oxide and an alkaline substance. A content of the purified water is greater than 50 wt %. A content of the sodium ionized water is 15 to 25 wt %. A content of the coconut oil is 3 to 7 wt %. A content of the calcium oxide is 0.5 to 2.5 wt %. A content of the alkaline substance is 7 to 13 wt %. The purified water, the sodium ionized water, the coconut oil and the alkaline substance account for less than or equal to 100 wt % of the total weight percentage of the cleaning composition. The disclosure further provides a preparation method of a cleaning composition.

A composition may include a fluorine-containing compound, an oxidizing agent, a titanium etching inhibitor, and a solvent. The titanium etching inhibitor may include a compound represented by Formula 1:A description of Formula 1 is provided in the present specification. A cleaning method may use the composition. A method of manufacturing a semiconductor device may use the composition.

The present invention is related to a dishwashing, preferably an automatic dishwashing, composition, wherein the composition comprises a 1,3,4-thiadiazole having the formula (I), wherein R1 = C1–C18 hydrocarbon moiety, NR3R4 moiety, S-R5 moiety, S-S-R6 moiety, H, S- anion with a counterion; wherein R3, R4, R5, and R6 can be identical or different; wherein R3, R4, R5, and R6 = H, C1–C18 hydrocarbon moiety; R2 = C1–C18 hydrocarbon moiety, NR3R4 moiety, S-R5 moiety, S-S-R6 moiety, H, S- anion with a counterion; wherein R3, R4, R5, and R6 can be identical or different; wherein R3, R4, R5, and R6 = H, C1-C18 hydrocarbon moiety; and wherein said two moieties R1 and R2 are identical or different. The invention further relates to the use of such an inventive dishwashing, preferably an automatic dishwashing, composition for silver corrosion protection of silver dishwashing goods; wherein preferably said dishwashing, preferably said automatic dishwashing, composition is a detergent composition or a rinse aid composition.

The invention discloses a special nursing aerosol for a robot and a preparation method of the special nursing aerosol. The special nursing aerosol comprises 35%-50% of a fluorine-containing refrigerant, 5%-8% of a lubricant, 15%-25% of an organic solvent, 5%-10% of a nonionic surfactant, 1%-3% of an organic antirust agent, 0.5%-1.5% of an organic antioxidant, 0.5%-2% of a quaternary ammonium salt antistatic agent, 1%-3% of an organic silicon water repellent, 2%-5% of a compatilizer and the balance of an auxiliary propellant. The humanoid robot can be cooled, lubricated, cleaned, protected, antistatic, dustproof and other functions at the same time, the maintenance process of the humanoid robot is simplified, the maintenance efficiency is improved, the service life of the humanoid robot is prolonged, and stable and efficient operation of the humanoid robot is guaranteed.

Provided are a method for processing a semiconductor substrate, a method for manufacturing a semiconductor device, and a processing solution for a semiconductor device usable therefor, in which: a processing step of processing a semiconductor substrate including a layer containing a metal nitride with a processing solution for a semiconductor device is included; the processing solution for a semiconductor device contains NH3, a corrosion inhibitor, and water; the corrosion inhibitor is at least one selected from the group consisting of 5-methyl-1H-benzotriazole, imidazole, and 5-amino-1H-tetrazole; and a mass ratio of a content of NH3 to a content of the corrosion inhibitor (NH3 / corrosion inhibitor) is 5 to 60.

The invention relates to a cleaning reagent for cleaning after leveling treatment of films in semiconductor devices and integrated circuits, in particular to a cleaning solution. According to the cleaning solution, silica sol is agglomerated, the particle size is increased by 10-30 times, and the free energy of the particle surface is reduced, so that the cleaning solution is easier to remove from the wafer surface in the cleaning process, namely, the cleaning solution has excellent cleaning performance, and can effectively remove residual abrasive particles, flat pad scraps, metal ions, organic additives and the like on the wafer surface; and meanwhile, the corrosion inhibition performance is good.

A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.

Provided is a multifunctional group metal corrosion inhibitor, as shown in one or more of formula (I-a) to formula (I-c). The metal corrosion inhibitor disclosure is a multifunctional group metal corrosion inhibitor comprising Schiff base or a derivative structure thereof, a catechol group and a mercapto group. A plurality of active functional groups are introduced, so that the active adsorption site of the inhibitor can be increased, and the synergetic effect of the three functional groups can enhance the adsorption effect of the inhibitor and a metal, And thus, the inhibitor is suitable for applicable for adsorptions of plurality of metals. Therefore, the inhibitor can exert a high anti-corrosion efficiency under the condition of a low addition amount, and provides a protection effect for the plurality of the metals.

Described herein is a method of using a cleaning composition in combination with one or more oxidants for removing post-etch or post-ash residue from the surface of a semiconductor substrate and / or for oxidative etching or partially oxidative etching of a layer or mask. Also described herein is the cleaning composition and a method of using the cleaning composition for removing post-etch or post-ash residue from the surface of a semiconductor substrate. Also described herein is a wet-etch composition including the cleaning composition and one or more oxidants as well as a method of using the wet-etch composition. Also described herein are a process for the manufacture of a semiconductor device from a semiconductor substrate and a kit including the cleaning composition and one or more oxidants.

Alkaline sprayable aqueous compositions for cleaning, sanitizing and disinfecting are disclosed. In particular, the sprayable compositions include an alkali soluble emulsion polymer, an alkalinity source, a foaming agent, and water. Beneficially, the sprayable cleaning compoistions have reduced misting and are environmentally safe for users to apply. Further the compositions exhibit less running on non-horizontal surfaces than acrylamide-based compositions.