102results about "Anticorrosion compositions" patented technology

A treatment composition that includes a treatment adjunct and a population of core / shell delivery particles, where the shell is made from an acid-treated chitosan and a cross-linking agent, where the acid-treated chitosan results from treating chitosan with a weak acid, or even a mixture of a strong acid and a weak acid. Related methods of making and using such compositions.

An object of the invention is to provide a method of cleaning semiconductor substrates that is excellent in abrasive particle removing performance with respect to semiconductor substrates having undergone CMP, as well as a cleaning liquid for semiconductor substrates having undergone CMP. The invention provides a method of cleaning semiconductor substrates, the method comprising a cleaning step of cleaning, by use of a cleaning liquid, a semiconductor substrate having undergone CMP using a polishing liquid containing abrasive particles. The semiconductor substrate contains metal, and the cleaning liquid has a pH of more than 7 at 25° C. The cleaning liquid comprises: a chelating agent; a specific component A; and an anticorrosive. The method satisfies Condition 1 that a product of a contact angle ratio obtained by a specific test method 1 and a specific degree of agglomeration obtained by a specific test method 2 is not more than 15.

The present invention provides a composition for cleaning a semiconductor substrate, the composition having a high tungsten oxide removal rate, while having Ti / W etching selectivity.　A composition for cleaning a semiconductor substrate, the composition containing (A) an oxidant, (B) a fluorine compound, (C) a tungsten metal corrosion inhibitor and (D) a tungsten oxide etching accelerator, wherein: the addition ratio of the oxidant (A) is 0.0001% to 10% by mass relative to the total mass of the composition for cleaning a semiconductor substrate; the addition ratio of the fluorine compound (B) is 0.005% to 10% by mass relative to the total mass of the composition for cleaning a semiconductor substrate; and the addition ratio of the tungsten metal corrosion inhibitor (C) is 0.0001% to 5% by mass relative to the total mass of the composition for cleaning a semiconductor substrate.

The present application provides a treatment liquid which is excellent in removal of organic residues and excellent in stability. A treatment method of a treated object related to the above treatment liquid is also provided. The treatment liquid contains water, hydroxylamine, and hydrazine species selected from one or more of hydrazine, hydrazine salts, and hydrazine derivatives, and the total content of the hydrazine species is 1 parts by mass or less relative to 100 parts by mass of the hydroxylamine.

There are provided a processing solution containing an alkali compound, water, and a corrosion inhibitor, in which the amount of dissolved oxygen one week after the preparation of the processing solution is 0.2 mg / L or more and 1.5 mg / L or less, and the corrosion inhibitor is at least one selected from the group consisting of N,N-diethylhydroxylamine, 1-thioglycerol, 1-amino-4-methylpiperazine, carbohydrazide, methylethylketoxime, erythorbic acid, and salts thereof, a method for manufacturing the processing solution, and a method for processing a substrate and a method for manufacturing a semiconductor device using the processing solution.

This disclosure describes a composition which can provide real-time feedback during medical device cleaning or reprocessing. The composition can be used to monitor the amount of biological material cleaned from medical devices and to determine when cleaning is complete. The disclosure also relates to a method of cleaning, or assessing the cleanliness of, a medical device such as an endoscope. Cleanliness can be assessed by contacting the medical device with the composition, shining an excitation light on the composition, and measuring intensity of resulting fluorescence over time.

The disclosure provides a cleaning composition, comprising purified water, sodium ionized water, coconut oil, calcium oxide and an alkaline substance. A content of the purified water is greater than 50 wt %. A content of the sodium ionized water is 15 to 25 wt %. A content of the coconut oil is 3 to 7 wt %. A content of the calcium oxide is 0.5 to 2.5 wt %. A content of the alkaline substance is 7 to 13 wt %. The purified water, the sodium ionized water, the coconut oil and the alkaline substance account for less than or equal to 100 wt % of the total weight percentage of the cleaning composition. The disclosure further provides a preparation method of a cleaning composition.

The invention discloses a special nursing aerosol for a robot and a preparation method of the special nursing aerosol. The special nursing aerosol comprises 35%-50% of a fluorine-containing refrigerant, 5%-8% of a lubricant, 15%-25% of an organic solvent, 5%-10% of a nonionic surfactant, 1%-3% of an organic antirust agent, 0.5%-1.5% of an organic antioxidant, 0.5%-2% of a quaternary ammonium salt antistatic agent, 1%-3% of an organic silicon water repellent, 2%-5% of a compatilizer and the balance of an auxiliary propellant. The humanoid robot can be cooled, lubricated, cleaned, protected, antistatic, dustproof and other functions at the same time, the maintenance process of the humanoid robot is simplified, the maintenance efficiency is improved, the service life of the humanoid robot is prolonged, and stable and efficient operation of the humanoid robot is guaranteed.

Provided are a method for processing a semiconductor substrate, a method for manufacturing a semiconductor device, and a processing solution for a semiconductor device usable therefor, in which: a processing step of processing a semiconductor substrate including a layer containing a metal nitride with a processing solution for a semiconductor device is included; the processing solution for a semiconductor device contains NH3, a corrosion inhibitor, and water; the corrosion inhibitor is at least one selected from the group consisting of 5-methyl-1H-benzotriazole, imidazole, and 5-amino-1H-tetrazole; and a mass ratio of a content of NH3 to a content of the corrosion inhibitor (NH3 / corrosion inhibitor) is 5 to 60.

A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.

Described herein is a method of using a cleaning composition in combination with one or more oxidants for removing post-etch or post-ash residue from the surface of a semiconductor substrate and / or for oxidative etching or partially oxidative etching of a layer or mask. Also described herein is the cleaning composition and a method of using the cleaning composition for removing post-etch or post-ash residue from the surface of a semiconductor substrate. Also described herein is a wet-etch composition including the cleaning composition and one or more oxidants as well as a method of using the wet-etch composition. Also described herein are a process for the manufacture of a semiconductor device from a semiconductor substrate and a kit including the cleaning composition and one or more oxidants.

The invention relates to the technical field of preparation of composite cleaning agents, in particular to a preparation method of a composite cleaning agent for electrified insulation equipment. Carrying out composite reaction; deep purification; packaging, simulating and storing; the material preparation pretreatment comprises the steps of base material preparation, main material preparation, auxiliary material preparation, equipment preparation and raw material treatment, and the composite reaction comprises the steps of weighing and proportioning, mixed reaction, condition regulation and control and sensitivity monitoring. In combination with the dissolution effect of the insulating solvent, the decontamination rate of 95% or above can be achieved; a protective film can be formed on the surface of an equipment metal part to inhibit electrochemical corrosion; the raw material utilization rate is improved; after caking, the surfactant is dried and crushed at a specific temperature, so that the original performance can be recovered, and the characteristics of different raw materials can be adapted; and the stirring kettle with explosion-proof and insulating properties is adopted, so that the safety risk possibly caused by friction, static electricity and the like in the mixing process is reduced from the source of equipment.

Warewash detergent compositions with reducing agents to overcome corrosion challenges in stainless steel dish machines subject to conditions from chlorine sanitizing rinse steps (or other oxidizing chlorine containing compositions) are provided. Detergent compositions or booster compositions used in combination with detergents beneficially containing a reducing agent that reacts with chlorine introduced in sanitizing rinse steps that follow detergent cleaning steps are provided. Methods for ware washing using the detergent compositions with reducing agents and methods for reducing residual chlorine in a ware washing cycle are also provided.

The invention discloses a cleaning agent for dirt on the surface of an insulator. The cleaning agent comprises a surfactant, a chelating dispersant, an anti-deposition agent, a solvent, an auxiliary agent and a PH regulator. Wherein the surface active agent is prepared from straight-chain fatty alcohol-polyoxyethylene ether AEO-9, isomeric fatty alcohol-polyoxyethylene ether and fatty alcohol-polyoxyethylene ether AEO-3; wherein the chelating dispersant is sodium gluconate, ethylene diamine tetraacetic acid disodium salt and sodium polyacrylate; wherein the anti-deposition agent is a fluorine-containing acrylate polymer and polyvinyl alcohol; wherein the solvent and the auxiliary agent are deionized water, fatty alcohol-polyoxyethylene ether JFC and disodium 1-hydroxyethylidene-1, 1-diphosphonate; wherein the pH regulator is citric acid; the cleaning agent has the advantages of strong decontamination capability, environmental friendliness, good equipment protection effect and good long-term protection effect, and is particularly suitable for cleaning dirt on the surfaces of insulators mainly comprising chemical dust, fire coal fly ash, dust, sand wind, pollen, bird excrement and the like in industrial cities and surrounding areas, inland arid areas and farmland areas.

Foam rich instant cleaning block is manufactured by parts by weight of 15-25 parts of alkali salt, 15-20 parts of pH buffer regulator, 5-8 parts of sodium lauryl sulfate, 28-30 parts of sodium lauroyl glutamate, 20-25 parts of filler, 0.3-0.5 parts of sodium carboxymethylcellulose, 1-2.5 parts of preservative, 0-0.5 parts of essence, 0-0.1 parts of colorant, which has a uniform distribution of components and a density of 1.1-1.25 g / cm. 3 The compressive strength is 130~180N / cm 2 The solid lump composition is a simple preparation, convenient to use, and various packaging methods are all effective for storage. It contains a high proportion of cleaning ingredients, and the body soap after dissolving can produce abundant and stable foam. Compared with ordinary quick-dissolving soap, this formula is milder, and the body soap after dissolving has a weak acidity close to the skin, which is suitable for bathing.

This application relates to cleaning compositions containing corrosion inhibitors. A cleaning composition and method for cleaning microelectronic device substrates within a process, such as post-chemical mechanical polishing (CMP) cleaning, to remove residue from the surface thereof, wherein the cleaning composition can be particularly effective for cleaning substrate surfaces comprising exposed metals such as cobalt, copper, or both, as well as dielectric or low-k dielectric materials, and wherein the cleaning composition includes a corrosion inhibitor to inhibit corrosion of the exposed metals.

The invention discloses a flux cleaning agent for PCB assembly and a preparation method thereof, and relates to the technical field of flux cleaning agent preparation, and the preparation method comprises the following steps: adding xanthan gum into deionized water, adding an ion adsorbent and an antioxidant, and stirring and mixing uniformly to obtain a water phase; the preparation method comprises the following steps: adding a surfactant and oleic acid bis-imidazoline quaternary ammonium salt into an organic solvent, and uniformly stirring and mixing to obtain an organic phase; adding the organic phase into the water phase, uniformly stirring and mixing, adding the metal organic framework-active enzyme compound, uniformly stirring and mixing, clarifying and defoaming to obtain the flux cleaning agent. The flux cleaning agent prepared by the invention can clean residual flux in gaps and adsorb residual halogen elements, so that the corrosion risk is reduced.

The invention relates to an interconnectable collage system. A tile system for covering a surface is disclosed. The tile system includes a first tile assembly connected to a second tile assembly by a connector. Each tile assembly includes a first tile stacked on a second tile, the first and second tiles joined to a reinforcing material disposed therebetween. The connector includes a first component and a second component complementary to the first component. The first component is mounted to the first tile assembly and the second component is mounted to the second tile assembly.

A composition and method useful for removing residues and photoresist from a semiconductor substrate, comprising about 5 to about 60 wt% water; about 10 to about 90 wt% water miscible organic solvent; about 5 to about 90 wt% at least one alkanolamine; about 0.05 to about 20 wt% at least one polyfunctional organic acid; and about 0.1 to about 10 wt% at least one phenol-type corrosion inhibitor, substantially free of hydroxylamine.

The invention discloses a preparation method of a high-hydrophilicity OP emulsifier, and the emulsifier is prepared from the following raw materials in parts by weight: 98-116 parts of dodecylphenol, 0.5-1 part of a catalyst, 55-64 parts of ethylene oxide, 8-14 parts of polyarylene amine, 0.8-4 parts of a water-soluble thickening agent, 3-5 parts of hydroxy acid and 7-13 parts of lauryl sodium sulfate. 12 to 15 parts of fatty alcohol-polyoxyethylene ether and 5 to 15 parts of modified polyether amine. The polyarylene amine is added to improve the hydrophilicity of the emulsifier, the lauryl sodium sulfate and the fatty alcohol-polyoxyethylene ether which are compounded according to a certain proportion are added to remarkably improve the emulsifying capacity and the performance stability of the OP emulsifier, and the hydroxy acid is added to further improve the hydrophilicity of the emulsifier. The thermal stability of the OP emulsifier is improved by adding modified polyether amine.

An object of the present invention is to provide a cleaning liquid for a semiconductor substrate, which has excellent corrosion prevention performance for a metal-containing layer. In addition, another object of the present invention is to provide a method for cleaning a semiconductor substrate.The cleaning liquid of an embodiment of the present invention is a cleaning liquid for a semiconductor substrate that has been subjected to a chemical mechanical polishing treatment, in which the cleaning liquid includes a component A having two or more onium structures in a molecule, and water, and has a pH of 7.0 to 11.8 at 25° C.

To provide reduced-misting sprayable cleaning compositions for reducing and / or eliminating exposure of users to mist or other small particles generated by spraying of the compositions.SOLUTION: Alkaline sprayable aqueous compositions for cleaning, sanitizing and disinfecting are disclosed. In particular, the sprayable compositions include an alkali-soluble emulsion polymer, an alkalinity source, a foaming agent, and water. Beneficially, the sprayable cleaning compositions have reduced misting and are environmentally safe for users to apply. Further, the compositions exhibit less running on non-horizontal surfaces than acrylamide-based compositions.SELECTED DRAWING: Figure 1

The present invention relates to the use of a carboxylic-acid-containing cleaning agent for removing stains of vegetable origin and / or for decontaminating surfaces contaminated by plant-protection agents. The agent comprises 20-60 wt. % of an aliphatic C1-C10 carboxylic acid, preferably formic acid, or a mixture of two or more of such aliphatic carboxylic acids which preferably comprises formic acid, at least one surfactant, preferably an anionic surfactant and / or at least one non-ionic surfactant, and water and / or solvent as the remainder. In another aspect, the present invention relates to specific carboxylic-acid-containing cleaning agents for hard surfaces, which agents are particularly suitable for the intended use.

Solid cleaning compositions that are safe for contact without the use of personal protective equipment (PPE) and have optimal dissolution rate and degreasing performance. In particular, the solid cleaning compositions include a non-hydroxide alkali metal alkalinity source(s), acid(s), water conditioning agent(s), a cleaning surfactant comprising an amphoteric, anionic and / or nonionic surfactant(s) and / or a coating surfactant comprising a nonionic surfactant(s) to provide the optimal dissolution and performance while being PPE-free are disclosed. Methods of providing concentrate and / or use solutions of the solid cleaning compositions and methods of use thereof are also disclosed.

To provide a method of using a cleaning composition for removing post-etch or post-ash residues from a surface of a semiconductor substrate and / or layers that include an aluminum compound from a surface of a semiconductor substrate.SOLUTION: A cleaning compositions include one or more compounds such as 4-methylmorpholine-4-oxide as a dissolving agent, one or more corrosion inhibitors selected from the group consisting of unsubstituted or substituted benzotriazoles and mixtures thereof, one or more polar aprotic organic solvents, water, and one or more alkyl glycol ethers in combination with one or more oxidizing agents.SELECTED DRAWING: None

The invention provides a cleaning composition and application thereof, a leveling process and an electronic device. The cleaning composition comprises an anionic surfactant and an organic acid complexing agent, the anionic surfactant comprises one or more of ammonium dodecyl sulfate and dodecylbenzene sulfonic acid; the organic acid complexing agent comprises a first complexing agent containing a carboxylic acid group and a second complexing agent containing a phosphonic acid group, and / or the organic acid complexing agent comprises a third complexing agent containing a carboxylic acid group and a phosphonic acid group; in the cleaning composition, the mass percentage content of the anionic surfactant is less than 0.5%; the pH value of the cleaning composition is greater than 7 and less than or equal to 12. According to the cleaning composition, the foam amount can be effectively reduced by performing proper component matching and pH value regulation and control on the cleaning composition, grinding materials and other impurities remaining on the surface of a workpiece can be effectively removed by applying the cleaning composition to cleaning of the leveling workpiece, and the comprehensive performance of a semiconductor device is remarkably improved.

The invention discloses an environment-friendly electrified cleaning agent for electrical equipment and a preparation method of the environment-friendly electrified cleaning agent, and relates to the technical field of cleaning agents. The invention discloses an environment-friendly electrified cleaning agent for electrical equipment. The environment-friendly electrified cleaning agent comprises the following components in parts by mass: 40-60 parts of an organic solvent, 5-15 parts of a surfactant, 1-5 parts of a corrosion inhibitor, 10-20 parts of an environment-friendly cosolvent, 2-6 parts of an antioxidant and 15-25 parts of deionized water. The antioxidant disclosed by the invention adopts a large-steric-hindrance phenolic hydroxyl structure, and can efficiently quench free radicals and block an oxidation chain reaction. The mechanism is particularly effective in an electrified, high-temperature or oxygen-containing environment, and the probability that the cleaning agent is oxidized is reduced.

A treatment system for a gas turbine engine includes a detergent supply containing a detergent, the detergent comprising a corrosion-resistance additive (e.g., Gadolinium doped ceria particles, a foam generating assembly operably coupled to the detergent supply, the foam generating assembly being configured to generate a foam using the detergent, and a foam supply line fluidly coupling the foam generating assembly to a cleaning port of the gas turbine engine to supply the foam into the gas turbine engine.

The present invention relates to a method of making a solid cleaning composition. The method can include pressing and / or vibrating a flowable solid of a self-solidifying cleaning composition. For a self-solidifying cleaning composition, pressing and / or vibrating a flowable solid determines the shape and density of the solid but is not required for forming a solid. The method can employ a concrete block machine for pressing and / or vibrating. The present invention also relates to a solid cleaning composition made by the method and to solid cleaning compositions including particles bound together by a binding agent.