154results about "Anticorrosion compositions" patented technology

The present invention addresses the problem of providing a processing liquid for a semiconductor device, said processing liquid having excellent corrosion resistance with respect to a metal-containing layer, excellent removability of an object to be removed, and excellent solubility in a post-processing liquid. The present invention also addresses the problem of providing a method for processing a substrate using the processing liquid. This processing liquid for a semiconductor device contains water, a remover, and a copolymer, the copolymer having a first repeating unit having at least one group selected from the group consisting of a primary amino group, a secondary amino group, a tertiary amino group, and a quaternary ammonium cation, and a second repeating unit different from the first repeating unit.

A treatment composition that includes a treatment adjunct and a population of core / shell delivery particles, where the shell is made from an acid-treated chitosan and a cross-linking agent, where the acid-treated chitosan results from treating chitosan with a weak acid, or even a mixture of a strong acid and a weak acid. Related methods of making and using such compositions.

An object of the invention is to provide a method of cleaning semiconductor substrates that is excellent in abrasive particle removing performance with respect to semiconductor substrates having undergone CMP, as well as a cleaning liquid for semiconductor substrates having undergone CMP. The invention provides a method of cleaning semiconductor substrates, the method comprising a cleaning step of cleaning, by use of a cleaning liquid, a semiconductor substrate having undergone CMP using a polishing liquid containing abrasive particles. The semiconductor substrate contains metal, and the cleaning liquid has a pH of more than 7 at 25° C. The cleaning liquid comprises: a chelating agent; a specific component A; and an anticorrosive. The method satisfies Condition 1 that a product of a contact angle ratio obtained by a specific test method 1 and a specific degree of agglomeration obtained by a specific test method 2 is not more than 15.

The present invention relates to a photoresist stripper composition for manufacturing a display, and more particularly, to an integrated photoresist stripper composition which can be used in every process for manufacturing a display. More specifically, the photoresist stripper composition for manufacturing a display according to the present invention can be applied to all of transition metals and oxide semiconductor wirings, and has an excellent ability to remove modified photoresist after a hard bake process, and implant process, and a dry etch process have been performed. In particular, the photoresist stripper composition for manufacturing a display according to the present invention exhibits a corrosion inhibitory effect that has been further specialized for copper (Cu) wiring pattern edge portions which are susceptible to corrosion following dry-etching.

The present invention relates to an automatic dishwashing (ADW) composition comprising as component (A) at least one imidazole-based compound selected from the group consisting of unsubstituted or at least monosubstituted imidazole and benzimidazole as defined below in further detail. The inventive automatic dishwashing composition may contain further components, such as polyakylene imines (component (B)), at least one silicate (component (C)) and / or at least one chelating agent (component (D)). The present invention further relates to a process for cleaning dishware employing said ADW composition according to the present invention as well as to the use of said ADW composition, for example, to reduce any corrosion, such as silver corrosion on the items to be dishwashed (dishware). Beyond that, the present invention relates to the use of at least one imidazole-based compound according to component (A) as corrosion inhibitor in such automatic dishwashing processes.

The present invention provides a composition for cleaning a semiconductor substrate, the composition having a high tungsten oxide removal rate, while having Ti / W etching selectivity.　A composition for cleaning a semiconductor substrate, the composition containing (A) an oxidant, (B) a fluorine compound, (C) a tungsten metal corrosion inhibitor and (D) a tungsten oxide etching accelerator, wherein: the addition ratio of the oxidant (A) is 0.0001% to 10% by mass relative to the total mass of the composition for cleaning a semiconductor substrate; the addition ratio of the fluorine compound (B) is 0.005% to 10% by mass relative to the total mass of the composition for cleaning a semiconductor substrate; and the addition ratio of the tungsten metal corrosion inhibitor (C) is 0.0001% to 5% by mass relative to the total mass of the composition for cleaning a semiconductor substrate.

The present application provides a treatment liquid which is excellent in removal of organic residues and excellent in stability. A treatment method of a treated object related to the above treatment liquid is also provided. The treatment liquid contains water, hydroxylamine, and hydrazine species selected from one or more of hydrazine, hydrazine salts, and hydrazine derivatives, and the total content of the hydrazine species is 1 parts by mass or less relative to 100 parts by mass of the hydroxylamine.

There are provided a processing solution containing an alkali compound, water, and a corrosion inhibitor, in which the amount of dissolved oxygen one week after the preparation of the processing solution is 0.2 mg / L or more and 1.5 mg / L or less, and the corrosion inhibitor is at least one selected from the group consisting of N,N-diethylhydroxylamine, 1-thioglycerol, 1-amino-4-methylpiperazine, carbohydrazide, methylethylketoxime, erythorbic acid, and salts thereof, a method for manufacturing the processing solution, and a method for processing a substrate and a method for manufacturing a semiconductor device using the processing solution.

A liquid detergent concentrate comprising: a. at least one phosphonate; b. a first chelating agent selected from aminopolycarboxylic acids, hydroxycarboxylic acids, hydroxypolycarboxylic acids, and salts thereof; and c. at least one enzyme, preferably a proteolytic enzyme, and having a pH of 9 or greater. The present invention also relates to a ready-to-use solution; its use for cleaning and / or disinfecting objects; and a cleaning method.

The invention relates to a metal anti-corrosion cleaning agent, a preparation method and application, and the metal anti-corrosion cleaning agent comprises the following components in parts by weight: 0.001-0.06 part of a composite functional agent; 0.1 to 3 parts of a pH regulator; 0.01 to 1 part of inorganic acid; 50-80 parts of an organic solvent; and 20-50 parts of ultrapure water. The thienyl carboxylic ester derivative and the alkanol derivative are combined, the thienyl carboxylic ester derivative removes metal ions (such as Cu < + > and Fe < + >) in a targeted mode by means of the strong chelating capacity of ester groups, and organic pollutants are stripped through the pi-pi effect; the alkanol derivative wraps non-polar residual gum by using a long-chain hydrophobic end, and a hydrophilic end enhances the wettability of a solution, so that full-coverage cleaning of a nano-scale structure is realized.

This disclosure describes a composition which can provide real-time feedback during medical device cleaning or reprocessing. The composition can be used to monitor the amount of biological material cleaned from medical devices and to determine when cleaning is complete. The disclosure also relates to a method of cleaning, or assessing the cleanliness of, a medical device such as an endoscope. Cleanliness can be assessed by contacting the medical device with the composition, shining an excitation light on the composition, and measuring intensity of resulting fluorescence over time.

The disclosure provides a cleaning composition, comprising purified water, sodium ionized water, coconut oil, calcium oxide and an alkaline substance. A content of the purified water is greater than 50 wt %. A content of the sodium ionized water is 15 to 25 wt %. A content of the coconut oil is 3 to 7 wt %. A content of the calcium oxide is 0.5 to 2.5 wt %. A content of the alkaline substance is 7 to 13 wt %. The purified water, the sodium ionized water, the coconut oil and the alkaline substance account for less than or equal to 100 wt % of the total weight percentage of the cleaning composition. The disclosure further provides a preparation method of a cleaning composition.

A composition may include a fluorine-containing compound, an oxidizing agent, a titanium etching inhibitor, and a solvent. The titanium etching inhibitor may include a compound represented by Formula 1:A description of Formula 1 is provided in the present specification. A cleaning method may use the composition. A method of manufacturing a semiconductor device may use the composition.

The invention discloses a special nursing aerosol for a robot and a preparation method of the special nursing aerosol. The special nursing aerosol comprises 35%-50% of a fluorine-containing refrigerant, 5%-8% of a lubricant, 15%-25% of an organic solvent, 5%-10% of a nonionic surfactant, 1%-3% of an organic antirust agent, 0.5%-1.5% of an organic antioxidant, 0.5%-2% of a quaternary ammonium salt antistatic agent, 1%-3% of an organic silicon water repellent, 2%-5% of a compatilizer and the balance of an auxiliary propellant. The humanoid robot can be cooled, lubricated, cleaned, protected, antistatic, dustproof and other functions at the same time, the maintenance process of the humanoid robot is simplified, the maintenance efficiency is improved, the service life of the humanoid robot is prolonged, and stable and efficient operation of the humanoid robot is guaranteed.

Provided are a method for processing a semiconductor substrate, a method for manufacturing a semiconductor device, and a processing solution for a semiconductor device usable therefor, in which: a processing step of processing a semiconductor substrate including a layer containing a metal nitride with a processing solution for a semiconductor device is included; the processing solution for a semiconductor device contains NH3, a corrosion inhibitor, and water; the corrosion inhibitor is at least one selected from the group consisting of 5-methyl-1H-benzotriazole, imidazole, and 5-amino-1H-tetrazole; and a mass ratio of a content of NH3 to a content of the corrosion inhibitor (NH3 / corrosion inhibitor) is 5 to 60.

The invention relates to a cleaning reagent for cleaning after leveling treatment of films in semiconductor devices and integrated circuits, in particular to a cleaning solution. According to the cleaning solution, silica sol is agglomerated, the particle size is increased by 10-30 times, and the free energy of the particle surface is reduced, so that the cleaning solution is easier to remove from the wafer surface in the cleaning process, namely, the cleaning solution has excellent cleaning performance, and can effectively remove residual abrasive particles, flat pad scraps, metal ions, organic additives and the like on the wafer surface; and meanwhile, the corrosion inhibition performance is good.

A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.

Described herein is a method of using a cleaning composition in combination with one or more oxidants for removing post-etch or post-ash residue from the surface of a semiconductor substrate and / or for oxidative etching or partially oxidative etching of a layer or mask. Also described herein is the cleaning composition and a method of using the cleaning composition for removing post-etch or post-ash residue from the surface of a semiconductor substrate. Also described herein is a wet-etch composition including the cleaning composition and one or more oxidants as well as a method of using the wet-etch composition. Also described herein are a process for the manufacture of a semiconductor device from a semiconductor substrate and a kit including the cleaning composition and one or more oxidants.

The invention discloses an autocatalytic decomposition chemical agent for cleaning scale deposited in a heat conduction oil pipeline and a preparation method thereof, and relates to the technical field of pipeline cleaning agents.The autocatalytic decomposition chemical agent is prepared from, by weight, 10-20 parts of organic acid, 5-10 parts of autocatalytic auxiliaries, 3-8 parts of surfactant, 1-5 parts of corrosion inhibitor and 50-70 parts of deionized water; the autocatalytic promoter is a composite catalyst and comprises the following components in parts by weight: 3-6 parts of transition metal salt and 2-4 parts of organic ligand, the organic acid is selected from at least one of citric acid, oxalic acid and formic acid, and the transition metal salt is selected from at least one of copper sulfate, ferric chloride and nickel nitrate; the organic ligand is selected from at least one of ethylenediaminetetraacetic acid, trisodium citrate and potassium sodium tartrate. The self-catalytic decomposition chemical agent for cleaning the scale deposit in the heat conduction oil pipeline contains the self-catalytic additive, can achieve the self-catalytic decomposition effect in the cleaning process, continuously promotes the decomposition of the scale deposit along with the proceeding of the reaction, and greatly improves the cleaning efficiency.

The invention relates to the technical field of preparation of composite cleaning agents, in particular to a preparation method of a composite cleaning agent for electrified insulation equipment. Carrying out composite reaction; deep purification; packaging, simulating and storing; the material preparation pretreatment comprises the steps of base material preparation, main material preparation, auxiliary material preparation, equipment preparation and raw material treatment, and the composite reaction comprises the steps of weighing and proportioning, mixed reaction, condition regulation and control and sensitivity monitoring. In combination with the dissolution effect of the insulating solvent, the decontamination rate of 95% or above can be achieved; a protective film can be formed on the surface of an equipment metal part to inhibit electrochemical corrosion; the raw material utilization rate is improved; after caking, the surfactant is dried and crushed at a specific temperature, so that the original performance can be recovered, and the characteristics of different raw materials can be adapted; and the stirring kettle with explosion-proof and insulating properties is adopted, so that the safety risk possibly caused by friction, static electricity and the like in the mixing process is reduced from the source of equipment.

The application discloses a car body outer surface dirt cleaning agent and a preparation method thereof, and mainly comprises the following components: 5-15% of citric acid, 0.5-3% of aminosulfonic acid, 5-12% of triethanolamine, 0.1-0.5% of lan-826, 0.1-0.5% of benzotriazole, 12-24% of fatty alcohol polyoxyethylene ether, 5-10% of isomeric tridecanol ether, 2-5% of decyl glucoside, 0.1-0.5% of corrosion inhibitor, and deionized water added to 100%. The product is a compound product, is suitable for various cleaning processes such as scrubbing, brushing, and automatic train cleaning machine, has strong cleaning capacity, can clean various dirt in a targeted manner, is mild in performance, has no influence on the surface paint of the car body, contains the corrosion inhibitor polyaspartic acid, belongs to a precipitation film type corrosion inhibitor, mainly inhibits cathodic reaction, has good corrosion inhibition effect, can ensure that the car body metal is basically not corroded on the basis of strong cleaning capacity, and the product does not contain controlled substance components which are toxic and harmful to human bodies and the environment, and is an ideal environment-friendly cleaning agent.

Warewash detergent compositions with reducing agents to overcome corrosion challenges in stainless steel dish machines subject to conditions from chlorine sanitizing rinse steps (or other oxidizing chlorine containing compositions) are provided. Detergent compositions or booster compositions used in combination with detergents beneficially containing a reducing agent that reacts with chlorine introduced in sanitizing rinse steps that follow detergent cleaning steps are provided. Methods for ware washing using the detergent compositions with reducing agents and methods for reducing residual chlorine in a ware washing cycle are also provided.

The invention discloses a cleaning agent for dirt on the surface of an insulator. The cleaning agent comprises a surfactant, a chelating dispersant, an anti-deposition agent, a solvent, an auxiliary agent and a PH regulator. Wherein the surface active agent is prepared from straight-chain fatty alcohol-polyoxyethylene ether AEO-9, isomeric fatty alcohol-polyoxyethylene ether and fatty alcohol-polyoxyethylene ether AEO-3; wherein the chelating dispersant is sodium gluconate, ethylene diamine tetraacetic acid disodium salt and sodium polyacrylate; wherein the anti-deposition agent is a fluorine-containing acrylate polymer and polyvinyl alcohol; wherein the solvent and the auxiliary agent are deionized water, fatty alcohol-polyoxyethylene ether JFC and disodium 1-hydroxyethylidene-1, 1-diphosphonate; wherein the pH regulator is citric acid; the cleaning agent has the advantages of strong decontamination capability, environmental friendliness, good equipment protection effect and good long-term protection effect, and is particularly suitable for cleaning dirt on the surfaces of insulators mainly comprising chemical dust, fire coal fly ash, dust, sand wind, pollen, bird excrement and the like in industrial cities and surrounding areas, inland arid areas and farmland areas.

Foam rich instant cleaning block is manufactured by parts by weight of 15-25 parts of alkali salt, 15-20 parts of pH buffer regulator, 5-8 parts of sodium lauryl sulfate, 28-30 parts of sodium lauroyl glutamate, 20-25 parts of filler, 0.3-0.5 parts of sodium carboxymethylcellulose, 1-2.5 parts of preservative, 0-0.5 parts of essence, 0-0.1 parts of colorant, which has a uniform distribution of components and a density of 1.1-1.25 g / cm. 3 The compressive strength is 130~180N / cm 2 The solid lump composition is a simple preparation, convenient to use, and various packaging methods are all effective for storage. It contains a high proportion of cleaning ingredients, and the body soap after dissolving can produce abundant and stable foam. Compared with ordinary quick-dissolving soap, this formula is milder, and the body soap after dissolving has a weak acidity close to the skin, which is suitable for bathing.

The invention relates to the technical field of water treatment, and discloses a solid color-changing scale remover which comprises a core layer and an outer layer, the core layer is wrapped in the outer layer, and the core layer is prepared from the following formula components in percentage by mass: 60%-75% of an acid scale remover, 4%-7% of a corrosion inhibitor, 0.5%-1% of a color-changing indicator, 15%-23% of an excipient and 2%-3% of a surfactant. The preparation method comprises the steps of raw material pretreatment, gradient mixing, wet granulation and double-layer tabletting. The preparation equipment comprises tabletting equipment, the tabletting equipment comprises a feeding device, and the feeding device comprises an outer feeding pipe, an inner feeding pipe, an outer opening and closing mechanism and an inner opening and closing mechanism. The invention provides a solid color-changing water scale scavenger as well as a preparation method and preparation equipment thereof, which can solve or at least alleviate the problems of poor detection limit, color difference, stability and anti-interference performance of the existing color-changing water scale scavenger.

This application relates to cleaning compositions containing corrosion inhibitors. A cleaning composition and method for cleaning microelectronic device substrates within a process, such as post-chemical mechanical polishing (CMP) cleaning, to remove residue from the surface thereof, wherein the cleaning composition can be particularly effective for cleaning substrate surfaces comprising exposed metals such as cobalt, copper, or both, as well as dielectric or low-k dielectric materials, and wherein the cleaning composition includes a corrosion inhibitor to inhibit corrosion of the exposed metals.

The invention discloses an energy-saving boiler scale remover, and relates to the technical field of boiler scale removers. The boiler scale remover comprises the following components in parts by weight: 50-60 parts of a multi-component compound, 5-10 parts of sodium thiosulfate, 4-8 parts of a surfactant, 3-5 parts of a corrosion inhibitor and 2-3 parts of copper oxide, the invention further discloses a preparation method of the boiler scale remover. The cam is driven to rotate through airflow power, in the rotating process of the cam, the cam extrudes the conical stress part to enable the conical stress part to move upwards, then the conical plugging piece moves upwards to relieve plugging of the discharging opening in the bottom of the storage bin, and at the moment, part of raw materials in the storage bin fall into the mixing tank along the material guiding pipeline and the material guiding hopper; therefore, intermittent output and mixing of the raw materials in the storage bin can be realized.

An object is to provide a composition having excellent corrosion inhibition properties for copper and excellent cleanability for residues in a case of being applied for cleaning a semiconductor substrate containing a copper-containing substance. The composition of the present invention is a composition for cleaning a semiconductor substrate, the composition containing a compound represented by Formula (1), a compound represented by Formula (2), a polycarboxylic acid, and water.