The invention provides a low-cost and high-plating-speed pure
palladium chemical plating solution for a power
chip, which comprises the following components based on the total amount of the plating solution: 0.4-0.6 g / L of water-soluble
palladium salt, 20-30 g / L of composite complexing agent, 10-20 g / L of pH buffer agent, 8-12 g / L of double
reducing agent, 0.1-0.5 g / L of accelerator and 5-8 mg / L of stabilizer, the composite complexing agent comprises 5-10 g / L of organic amines and 15-20 g / L of amino
carboxylic acid; the double reducing agents are selected from two of hydrazine substances,
formic acid substances or
hydroxylamine substances. The chemical
palladium plating solution disclosed by the invention can be used for high-speed pure palladium plating in an
aluminum substrate chemical
nickel-palladium-
gold plating surface treatment process on a power
chip, an obtained plating layer is a
phosphorus-free pure palladium plating layer, the plating speed of the plating solution under the condition of lower palladium content reaches 0.049 mu m / min, the liquid
medicine cost and the
time cost in the production process can be effectively reduced, and the production efficiency is improved. And meanwhile, the plating solution further has good stability, and stable operation of five MTOs can be achieved.