Soldering flux in use for SnZn series solder with no lead, and preparation method

Abstract

A flux for improving the wetting and spreading performane of lead-free SnZn solder is proportionally prepared from rosin, surfactant FSN, benzotriazazole and absolute alcohole through proportionally dissolving said components in absolute alcohol in sealed state, and filtering.

Description

technical field

[0001] The invention relates to a flux, which is suitable for soldering of SnZn-based lead-free solder in the field of electronic packaging, and is especially suitable for manufacturing solder cores of SnZn-based solder wires and fluxes for wave soldering of SnZn-based solder. Background technique

[0002] The application of traditional tin-lead (SnPb) solder has a history of thousands of years and is currently the main material for electronic packaging and interconnection. However, lead and its compounds are toxic substances, which bring great harm to the living environment and safety of human beings. Since the U.S. anti-lead bill HR25374 (U.S. Congress), S22637 and S2391 (U.S. Senate) were proposed, various organizations, scientific research institutions and companies around the world have launched a series of prohibition proposals, test evaluations and environmental protection products. On February 13, 2003, the European Union promulgated the "Waste Elect...