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Solder paste for improving BGA package welding performance and preparation method thereof

A technology of soldering performance and solder paste, which is applied in the field of solder paste and its preparation to improve the soldering performance of BGA packages, can solve problems such as poor soldering performance, achieve good wetting, reduce BGA void rate, and high energy density

Active Publication Date: 2020-08-25
深圳市唯特偶新材料股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention also has the problem of poor welding performance caused by the temperature inside the cover plate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The solder paste for improving the soldering performance of BGA packaging is made of tin powder with a particle size of 25-40nm and solder paste with a mass ratio of 89:11; wherein, the solder paste is composed of the following components by weight: 40 parts of rosin , 39 parts of diethylene glycol monoethyl ether, 4 parts of isopropanol, 5 parts of hydrogenated castor oil, 4 parts of succinic acid, 4 parts of malic acid, 2 parts of hydroquinone, 1 part of polyazide glycidyl ether GAP, 1 part of fluorocarbon surfactant.

[0026] The preparation method of the present embodiment comprises the following steps:

[0027] S1. Weigh each component by weight, grind the rosin and add it to diethylene glycol monoethyl ether and isopropanol, heat and stir to dissolve the rosin completely, then add hydroquinone, hydrogenated castor oil, and polyazide in sequence Glycidyl ether GAP, fluorocarbon surfactant, heating and stirring to obtain a mixture evenly;

[0028] S2. Add succinic...

Embodiment 2

[0032] The solder paste for improving the soldering performance of BGA packaging is made of tin powder with a particle size of 25-40nm and solder paste with a mass ratio of 89:11; wherein, the solder paste is composed of the following components by weight: rosin 35 parts , 40 parts of diethylene glycol monoethyl ether, 5 parts of ethanol, 6 parts of hydrogenated castor oil, 5 parts of stearic acid, 5 parts of succinic acid, 2 parts of hydroquinone, branched polyazide glycidyl ether B-GAP 1 part, 1 part of fluorocarbon surfactant.

[0033] The preparation method of the present embodiment comprises the following steps:

[0034] S1. Weigh each component by weight, grind the rosin and add it to diethylene glycol monoethyl ether and ethanol, heat and stir to dissolve the rosin completely, then add hydroquinone, hydrogenated castor oil, and branched polyazide in sequence Glycidyl ether B-GAP, fluorocarbon surfactant, heating and stirring to obtain a mixture evenly;

[0035] S2. St...

Embodiment 3

[0039] The solder paste for improving the soldering performance of BGA packaging is made of tin powder with a particle size of 25-40nm and solder paste with a mass ratio of 89:11; wherein, the solder paste is composed of the following components by weight: rosin 39 parts , 36 parts of diethylene glycol monoethyl ether, 4 parts of ethylene glycol butyl methyl ether, 10 parts of hydrogenated castor oil, 5 parts of citric acid, 3.5 parts of succinic acid, 1 part of hydroquinone, 3,3-diazide 1 part of methyl oxetane BAMO, 0.5 part of fluorocarbon surfactant.

[0040] The preparation method of the present embodiment comprises the following steps:

[0041] S1. Weigh each component by weight, grind the rosin and add it to diethylene glycol monoethyl ether and ethylene glycol butyl methyl ether, heat and stir to dissolve the rosin completely, then add hydroquinone, hydrogenated castor oil, 3,3-diazidomethyl oxetane BAMO, fluorocarbon surfactant, heating and stirring to obtain a mixtu...

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PUM

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Abstract

The invention provides a solder paste for improving the BGA package welding performance. The solder paste is prepared from tin powder and paste flux, wherein the mass ratio of the tin powder to the paste flux is 89:11, the paste flux is prepared from the following components in parts by weight: 35 to 40 parts of rosin, 40 to 45 parts of solvents, 5 to 10 parts of thixotropic agents, 5 to 10 partsof active agents, 1 to 2 parts of antioxidants, 1 to 2 parts of polyazide modifiers and 0.5 to 1 part of fluorocarbon surfactant. The invention further provides a preparation method of the solder paste. According to the solder paste provided by the invention, the bad welding performance caused by the temperature in a cover plate can be effectively avoided, and good welding effects of wetness, brightness of welding spots and no solder ball are achieved.

Description

technical field [0001] The invention relates to a solder paste for improving BGA package soldering performance and a preparation method thereof. Background technique [0002] With the rapid development of the modern information electronics industry, the requirements for electronic packaging are getting higher and higher. In order to meet the requirements of miniaturization, high performance and high reliability, advanced packaging technologies such as BGA, POP and CSP have emerged. Among them, the failure of BGA package solder joints is more common, and because the I / O terminal of BGA is located under the package body, its soldering quality is not easy to detect and judge. Make quantitative judgments. Therefore, improving the soldering performance of BGA packages is very important for packaged products. At present, more attention is paid to the deoxidation ability and secondary oxidation of solder paste, but an important issue is ignored, that is, the temperature problem ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/36B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 段佐芳赵宁吴晶
Owner 深圳市唯特偶新材料股份有限公司
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