A kind of solder paste for improving BGA package soldering performance and preparation method thereof

Abstract

The invention provides a solder paste for improving the soldering performance of BGA packaging, which is made of tin powder and solder paste with a mass ratio of 89:11; wherein, the solder paste is composed of the following components by weight: Rosin 35 ~40 parts, 40~45 parts of solvent, 5~10 parts of thixotropic agent, 5~10 parts of active agent, 1~2 parts of antioxidant, 1~2 parts of polyazide modifier, 0.5 parts of fluorocarbon surfactant ~ 1 serving. The invention also provides a preparation method of the solder paste. The solder paste provided by the invention can effectively avoid the poor soldering performance caused by the temperature inside the cover plate, and obtain good soldering effects of moistness, bright solder joints and no tin beads.

Description

technical field

[0001] The invention relates to a solder paste for improving BGA package soldering performance and a preparation method thereof. Background technique

[0002] With the rapid development of the modern information electronics industry, the requirements for electronic packaging are getting higher and higher. In order to meet the requirements of miniaturization, high performance and high reliability, advanced packaging technologies such as BGA, POP and CSP have emerged. Among them, the failure of BGA package solder joints is more common, and because the I / O terminal of BGA is located under the package body, its soldering quality is not easy to detect and judge. Make quantitative judgments. Therefore, improving the soldering performance of BGA packages is very important for packaged products. At present, more attention is paid to the deoxidation ability and secondary oxidation of solder paste, but an important issue is ignored, that is, the temperature problem ...