Halogen-free high-activity cleaning-free solvent type soldering flux

Abstract

The invention discloses a halogen-free high-activity cleaning-free solvent type soldering flux. The halogen-free high-activity cleaning-free solvent type soldering flux comprises the following components of, in percentage by mass, 1.8%-5.8% of an active agent, 0%-0.15% of surfactant, 0.08%-1.5% of an antioxidant, 0.05%-0.5% of a corrosion inhibitor, 0.08%-1.5% of an additive, 0%-1.5% of a foamingagent, and the balance a solvent, and the total mass of the whole components is 100%. The halogen-free high-activity cleaning-free solvent type soldering flux has the advantages of no halide, no toxicity, no pungent smell and no harm to the human body and the natural environment, and greatly reduces the corrosion to a circuit board; the activity is high, the soldering assisting effect is obvious,the wettability is good, welding spots are full and free of retraction and tin explosion, the high-integration packaging is met, and other auxiliary equipment does not need to be used; the surface ofthe circuit board is extremely low in residue, and the welding spots are attractive and bright; and the soldering flux has good universality for Sn-Ag, Sn-Cu series or low silver lead-free solder alloys.

Description

Technical field

[0001] The invention relates to the field of chemical substances used in the technical field of electronic packaging, in particular to a halogen-free, high-activity, cleaning-free solvent flux. Background technique

[0002] With the development of miniaturization, high density and multi-dimensional electronic products, the packaging requirements of products are becoming higher and higher. In the field of electronic packaging, due to the differences in the performance of fluxes, the selection of flux will also determine the entire product. Life. Traditional rosin-based flux is about to withdraw from the market. On the one hand: the residue after traditional flux is attached to the surface of the solder joints, which causes the surface of the solder joints to be dim. It can also cause problems such as the electrical insulation performance of electronic products and short circuits, resulting in partial product failures. Even the scrapping of the entire product. On ...