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Halogen-free high-activity cleaning-free solvent type soldering flux

A high-activity, no-clean technology, applied in the field of chemical substances, can solve the problems of poor flux wetting, corrosion of solder joints, and many residues, and achieve the effects of beautiful solder joints, reduced corrosion, and high activity

Inactive Publication Date: 2019-11-15
CHONGQING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the deficiencies of the above-mentioned technologies, the present invention invents a halogen-free high-activity no-cleaning solvent-based flux, which has a good fluxing effect, does not contain halogens, has no corrosive products, has a wide application window, good compatibility, and beautiful solder joints. There is no need to introduce a cleaning process after welding, which solves the disadvantages of poor wettability of the existing flux, more residues after welding, serious corrosion of solder joints, and high cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A halogen-free, high-activity, no-clean solvent-based flux, with the following components by mass percentage:

[0039] Active agent dimethylolpropionic acid: itaconic acid=1:9 accounted for 1.8%; surfactant NP-9 0.15%; antioxidant dibutylhydroxytoluene 1.5%; corrosion inhibitor benzotriazole 0.5% ; Additive diethanolamine 0.15%; foaming agent saponin 1.5%, the rest is solvent alcohol, the total mass of each component is 100%.

Embodiment 2

[0041] A halogen-free, high-activity, no-clean solvent-based flux, with the following components by mass percentage:

[0042] Active agent itaconic acid: DL-malic acid = 2:8 accounted for 1.9%; surfactant NP-9 0.13%; antioxidant hydroquinone 0.12%; corrosion inhibitor benzotriazole 0.45%; additive three Ethanolamine 0.2%; foaming agent sodium dodecylbenzene sulfonate 1.2%, the rest is solvent isopropanol, the total mass of each component is 100%.

Embodiment 3

[0044] A halogen-free, high-activity, no-clean solvent-based flux, with the following components by mass percentage:

[0045] Active agent dimethylolpropionic acid: maleic acid = 3:7 accounted for 2.5%; surfactant NP-9 0.1%; antioxidant dibutyl hydroxytoluene 0.15%; corrosion inhibitor benzotriazole 0.15% Additive diethanolamine 0.25%; foaming agent sodium lauryl sulfate 1.0%, the rest is solvent glycerol, the total mass of each component is 100%.

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PUM

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Abstract

The invention discloses a halogen-free high-activity cleaning-free solvent type soldering flux. The halogen-free high-activity cleaning-free solvent type soldering flux comprises the following components of, in percentage by mass, 1.8%-5.8% of an active agent, 0%-0.15% of surfactant, 0.08%-1.5% of an antioxidant, 0.05%-0.5% of a corrosion inhibitor, 0.08%-1.5% of an additive, 0%-1.5% of a foamingagent, and the balance a solvent, and the total mass of the whole components is 100%. The halogen-free high-activity cleaning-free solvent type soldering flux has the advantages of no halide, no toxicity, no pungent smell and no harm to the human body and the natural environment, and greatly reduces the corrosion to a circuit board; the activity is high, the soldering assisting effect is obvious,the wettability is good, welding spots are full and free of retraction and tin explosion, the high-integration packaging is met, and other auxiliary equipment does not need to be used; the surface ofthe circuit board is extremely low in residue, and the welding spots are attractive and bright; and the soldering flux has good universality for Sn-Ag, Sn-Cu series or low silver lead-free solder alloys.

Description

Technical field [0001] The invention relates to the field of chemical substances used in the technical field of electronic packaging, in particular to a halogen-free, high-activity, cleaning-free solvent flux. Background technique [0002] With the development of miniaturization, high density and multi-dimensional electronic products, the packaging requirements of products are becoming higher and higher. In the field of electronic packaging, due to the differences in the performance of fluxes, the selection of flux will also determine the entire product. Life. Traditional rosin-based flux is about to withdraw from the market. On the one hand: the residue after traditional flux is attached to the surface of the solder joints, which causes the surface of the solder joints to be dim. It can also cause problems such as the electrical insulation performance of electronic products and short circuits, resulting in partial product failures. Even the scrapping of the entire product. On ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/363
CPCB23K35/3612B23K35/362
Inventor 甘贵生曹华东刘歆夏大权蒋刘杰田谧哲江兆琪许乾柱陈仕琦甘树德
Owner CHONGQING UNIV OF TECH
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