Halogen-free high-activity cleaning-free solvent type soldering flux
A high-activity, no-clean technology, applied in the field of chemical substances, can solve the problems of poor flux wetting, corrosion of solder joints, and many residues, and achieve the effects of beautiful solder joints, reduced corrosion, and high activity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0038] A halogen-free, high-activity, no-clean solvent-based flux, with the following components by mass percentage:
[0039] Active agent dimethylolpropionic acid: itaconic acid=1:9 accounted for 1.8%; surfactant NP-9 0.15%; antioxidant dibutylhydroxytoluene 1.5%; corrosion inhibitor benzotriazole 0.5% ; Additive diethanolamine 0.15%; foaming agent saponin 1.5%, the rest is solvent alcohol, the total mass of each component is 100%.
Embodiment 2
[0041] A halogen-free, high-activity, no-clean solvent-based flux, with the following components by mass percentage:
[0042] Active agent itaconic acid: DL-malic acid = 2:8 accounted for 1.9%; surfactant NP-9 0.13%; antioxidant hydroquinone 0.12%; corrosion inhibitor benzotriazole 0.45%; additive three Ethanolamine 0.2%; foaming agent sodium dodecylbenzene sulfonate 1.2%, the rest is solvent isopropanol, the total mass of each component is 100%.
Embodiment 3
[0044] A halogen-free, high-activity, no-clean solvent-based flux, with the following components by mass percentage:
[0045] Active agent dimethylolpropionic acid: maleic acid = 3:7 accounted for 2.5%; surfactant NP-9 0.1%; antioxidant dibutyl hydroxytoluene 0.15%; corrosion inhibitor benzotriazole 0.15% Additive diethanolamine 0.25%; foaming agent sodium lauryl sulfate 1.0%, the rest is solvent glycerol, the total mass of each component is 100%.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com