Cleaning-free multifunctional solvent-type soldering flux

Abstract

The invention discloses a cleaning-free multifunctional solvent-type soldering flux. The soldering flux comprises the following components of, in percentage by mass, 1.5% - 6.5% of an active agent, 0%- 0.2% of a surfactant, 0.05% - 1.5% of an antioxidant, 0.05% - 0.5% of a corrosion inhibitor, 0.1% -1.5% of an additive, 0% -2% of a foaming agent and the balance a solvent, wherein the total mass of the whole component is 100%. The cleaning-free multifunctional solvent-type soldering flux is free of halide and non-toxic, pungent smell is not generated, harm is not caused to a human body and a natural environment, and the corrosion to a circuit board is greatly reduced; and the soldering flux has the advantages of being high in activity, obvious in soldering-aid effect, good in wettability,smooth and full and free of shrinkage and tin blasting phenomena in soldering spot, suitable for high-integration packaging and free of introducing other auxiliary equipment; the surface of the circuit board is extremely low in residue, soldering spots are attractive and bright, a cleaning process does not need to be introduced; and the universality is good, and the soldering flux is suitable forSn - Ag, Sn - Cu systems or low silver lead-free brazing filler metal alloys.

Description

technical field

[0001] The invention relates to the field of chemical substances used in the technical field of electronic packaging, in particular to a no-cleaning multifunctional solvent-based flux. Background technique

[0002] With the miniaturization, high density and multi-dimensional development of electronic products, the packaging requirements of products are becoming higher and higher. In the field of electronic packaging, due to the differences in the performance of fluxes, the selection of fluxes will also determine the entire product. lifespan. Traditional rosin-based fluxes are about to be withdrawn from the market. On the one hand, the residues of traditional fluxes adhere to the surface of solder joints after soldering, which makes the surface of solder joints dull. It also causes problems such as the decline in electrical insulation performance and short circuits of electronic products, resulting in the failure of some functions of the products. Even the sc...