Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof

A soft solder and anti-oxidation technology, applied in the field of solder manufacturing, can solve the problems of insufficient mechanical strength performance of high lead tin wire, low interface adhesion work, easy wetting, etc., so as to improve mechanical properties and anti-oxidation. The effect of stability, long service life, easy winding and packaging

Inactive Publication Date: 2014-10-01
BEIJING COMPO ADVANCED TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical strength of high-lead tin wire is insufficient. Although the addition of silver can improve its mechanical properties, a large amount of addition is not conducive to the control of industrial costs, and due to the easy oxidation of lead, it is prone to insufficient wetting during use. Although the wetting angle is small during brazing, the interface adhesion work is also small, especially when soldering without flux is prone to interface virtual welding or false welding
[0003] Chinese patents 200710057349.9, 200510037416.1, and 200410040724.5 all disclose solders with anti-oxidation characteristics, that is, trace elements such as P, Ga, and Sb are added to the solders, but the patents are based on solders that do not contain Pb. The use temperature is significantly lower, which belongs to the field of medium temperature soldering

Method used

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  • Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof
  • Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof
  • Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof

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preparation example Construction

[0025] Such as figure 1 Shown is the process flow chart for the preparation of the anti-oxidation high-temperature solder solid wire of the present invention. The preparation method of the anti-oxidation high-temperature solder solid wire of the present invention includes 5 steps: 1 is alloy batching and smelting; 2 is Preparation of solder alloy bar blank; 3 is large deformation extrusion drawing; 4 is surface adhesion coating; 5 is winding packaging.

[0026] The first step: Weigh the alloy raw materials according to the composition ratio. The alloy composition is 2-15wt% Sn, 0-5wt% Ag, 0.01wt%-1wt% added elements P, Ge, Ga and Bi, Sb, Zn In order to improve the oxidation resistance and strength of the solder, 0.01wt%-1wt% of P, Ge, Ga and one of Bi, Sb, Zn are added. One or more combination elements; the second step: the alloy raw materials are smelted under the protection of nitrogen or argon atmosphere, and the stirring is strengthened to prepare an alloy rod with uniform co...

Embodiment 1

[0028] The preparation of tin wire with round ends and dodecahydroxystearic acid coating layer includes the following steps:

[0029] (1) According to the weight ratio Pb:Sn:Sb=97:2:1, weigh the purity to be 99.99% pure Sn, pure Sb and pure Pb, totaling 50kg, and heat to 700℃ to melt in a vacuum melting furnace protected by argon. Insulation, stirring, standing, and deslagging;

[0030] (2) Pour the above melt quickly on The cylindrical mold is prepared to produce a cylindrical bar blank with a defect-free appearance of Φ84×180mm;

[0031] (3) Load the obtained bar stock into a 350-ton large deformation extruder, extrude and draw into a solid wire of Φ0.5mm;

[0032] (4) Put a sufficient amount of dodecanoic acid in the tin wire coating barrel, control the temperature of the coating barrel at 100°C, pass the tin wire into the coating barrel for surface coating, and control the wire output speed at 2.0m / min or so, and air-dry at the end of the wire;

[0033] (5) The obtained tin wire...

Embodiment 2

[0036] The preparation of tin wire with a square end surface and a benzotriazole coating layer includes the following steps:

[0037] (1) According to the weight ratio Pb:Sn:Bi=89:10:1, weigh the purity to be 99.99% pure Sn, pure Bi and pure Pb, totaling 50kg, and heat to 500℃ to melt in a nitrogen-protected melting furnace. Stir, stand still, remove slag;

[0038] (2) Pour the above melt quickly on The cylindrical mold is prepared to produce a cylindrical bar blank with a defect-free appearance of Φ84×180mm;

[0039] (3) Load the obtained bar stock into a 350-ton large-deformation extruder, extrude and draw into a solid wire of 0.3×0.6mm square size;

[0040] (4) Put a sufficient amount of benzotriazole in the tin wire coating barrel, control the temperature of the coating barrel at 150℃, pass the tin wire into the coating barrel for surface coating, and control the wire output speed at 1.0m / About min, and air-dry at the end of the wire;

[0041] (5) The obtained tin wire is moved ...

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Abstract

The invention relates to an anti-oxidation high-temperature soft-solder solid wire and a manufacturing method thereof and belongs to the technical field of solder production. The anti-oxidation solid wire comprises a high-temperature soft-solder solid wire and an anti-oxidation protective layer covering the solid wire. The high-temperature soft-solder solid wire comprises, by weight, Sn 2-15wt%, Ag 0-5wt%, one or multiple of P, Ge, Ga, Bi, Sb and Zn 0.01-1wt% and the balance Pb. Solder wires manufactured by the method effectively solve the problems such as black oxide of a surface layer of a lead-based solder, poor wetting during brazing without soldering flux and clamminess and damage to the surface of the solder wires in winding and use. The solder wires have the advantages of strong bonding strength, round welding spot, bright halation, good sealing performance, high reliability, long service life and the like in brazing and use.

Description

Technical field [0001] The invention relates to an anti-oxidation high-temperature soft solder solid wire and a preparation method thereof. The solid wire undergoes online surface layer coating and anti-oxidation treatment in a large deformation extrusion drawing preparation process, and belongs to the technical field of solder manufacturing. Background technique [0002] Tin-lead solder has a suitable melting temperature (the temperature difference between alloy solid and liquidus is small). At brazing temperature, it has good wettability and spreadability to copper, copper alloy and steel base metal. It will not be in the molten state. Causes the melting of the base metal, with uniform composition, good joint strength, corrosion resistance and manufacturability, and excellent brazing reliability; and the alloy has abundant raw materials and low cost, so it has always been used in electrical appliances, aviation, automotive, It is an important connecting material in the electric...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40C22C11/06
CPCB23K35/268B23K35/0227B23K35/40C22C11/06
Inventor 徐骏胡强贺会军朱学新张富文朱捷曲俊峰安宁
Owner BEIJING COMPO ADVANCED TECH
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