SMT soldering paste with high wetting dispersibility and weather resistance and preparation method of SMT soldering paste

A technology of wetting, dispersing and weather resistance, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of low viscosity of solder paste, insufficient tin on solder joints, blurred images, etc., and achieve wettability and cutting performance. Good, improve initial viscosity, increase the effect of viscosity
CN114101972APending Publication Date: 2022-03-01JIANGSU ZHENGNENG ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGSU ZHENGNENG ELECTRONICS TECH CO LTD
Publication Date
2022-03-01

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Abstract

The invention provides SMT (surface mount technology) soldering paste with high wetting dispersity and weather resistance, which is prepared from the following components in percentage by mass: 70 to 80 percent of micron-sized tin-silver-copper alloy powder, 0.5 to 5 percent of antioxidant, 4.4 to 18 percent of resin, 3.2 to 7 percent of active agent, 0.5 to 0.9 percent of thixotropic agent, 3 to 5 percent of solvent, 0.1 to 1 percent of wetting agent, 0.1 to 1 percent of corrosion inhibitor and 0.1 to 1 percent of dispersing agent. Compared with commercially available solder paste, the solder paste has the advantages of high wettability, corrosion resistance and expansion rate, good thixotropy, capability of effectively reducing the generation of tin beads, less surface residue and no need of pre-dispersion by a centrifugal machine before use, not only meets related detection standards, but also can be directly used after temperature return.
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Description

technical field

[0001] The invention relates to the technical field of welding materials, in particular to an SMT solder paste with high wettability, dispersibility and weather resistance and a preparation method thereof. Background technique

[0002] With the development of electronic products towards ultra-large scale, digitization and miniaturization, surface mount technology SMT (Surface Mount Technology) has become the mainstream technology of electronic assembly. As an important soldering material, solder paste is widely used in surface mount technology. It plays a series of roles in the soldering process, such as fixing electronic components, removing surface oxide film, forming reliable solder joints, etc. Its quality is directly related to the quality of surface mount components.

[0003] At present, the defects and deficiencies of the existing technology: 1. During double-sided SMD welding, the components fall off: the wettability and solderability of the solder p...

Claims

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