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SMT soldering paste with high wetting dispersibility and weather resistance and preparation method of SMT soldering paste

A technology of wetting, dispersing and weather resistance, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of low viscosity of solder paste, insufficient tin on solder joints, blurred images, etc., and achieve wettability and cutting performance. Good, improve initial viscosity, increase the effect of viscosity

Pending Publication Date: 2022-03-01
JIANGSU ZHENGNENG ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the defects and deficiencies of the existing technology: 1. During double-sided SMD welding, the components fall off: the wettability and solderability of the solder paste are poor; 2. There are problems such as tin wire, adhesion, and blurred images during printing: The viscosity of the solder paste itself is low; the overflow of the solder paste is poor; the solder paste is unevenly mixed; 3. The tin on the solder joint is not full: the wettability and cut-off of the flux are not good; 4. The solder joint is exposed to high humidity and high heat, etc. It is easy to fail in special environments, and the weather resistance is not good; 5. Component tombstone after soldering: uneven distribution of solder paste

Method used

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  • SMT soldering paste with high wetting dispersibility and weather resistance and preparation method of SMT soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A SMT solder paste with high wettability, dispersibility and weather resistance, prepared from the following components according to mass percentage:

[0032] Micron (D50:20-38um) Sn96.5-Ag3.0-Cu0.5 alloy powder 70%;

[0033] Antioxidant: Resveratrol 5%;

[0034] Resin: hydrogenated rosin methyl ether 9%, polymerized rosin 9%;

[0035] Active Ingredients: D-Camphoric Acid 3.2%;

[0036] Thixotropic agent: ethylene bis (16-hydroxy) stearic acid amide 0.5%;

[0037] Solvents: Diethylene glycol monocaprylyl ether 1.5%, Dioctyl adipate 1.5%;

[0038] Wetting agent: Oleamidopropyldimethylamine 0.1%;

[0039] Corrosion inhibitor: sulfonated lignin 0.1%;

[0040] Dispersant: Unsaturated polyamine amide 0.1%.

[0041] Adopt the preparation method of a kind of high wetting dispersibility and weather resistance SMT solder paste of above-mentioned component, concrete steps are as follows:

[0042] Step (1) Add the resin (hydrogenated rosin methyl ether, polymerized rosin) i...

Embodiment 2

[0047] A SMT solder paste with high wettability, dispersibility and weather resistance, prepared from the following components according to mass percentage:

[0048] Micron (D50:20-38um) Sn96.5-3.0Ag-Cu0.5 alloy powder 80%;

[0049] Antioxidant: Vitamin E 0.5%;

[0050] Resin: polymerized rosin 2.2%, ice white rosin 2.2%;

[0051] Actives: Azelaic Acid 7%;

[0052] Thixotropic agent: Ethylene bislauric acid amide 0.6%;

[0053] Solvents: Dioctyl Adipate 2.5%, 2-Hexyl-1-Decanol 2.5%;

[0054] Wetting agent: Trimethylbutenediol 0.5%;

[0055] Corrosion inhibitor: cetylamine 1%;

[0056] Dispersant: Polycarboxylate 1%.

[0057] Adopt the preparation method of a kind of high wetting dispersibility and weather resistance SMT solder paste of above-mentioned component, concrete steps are as follows:

[0058] Step (1) Add the resin (polymerized rosin, ice-white rosin) into the solvent (2-hexyl-1-decanol), heat to 80°C, and stir at 400rpm until all are dissolved evenly to obtain...

Embodiment 3

[0063] A SMT solder paste with high wettability, dispersibility and weather resistance, prepared from the following components according to mass percentage:

[0064] Micron (D50:20-38um) Sn96.5-3.0Ag-Cu0.5 alloy powder 75%;

[0065] Antioxidant: Ascorbic Acid 2.5%;

[0066] Resin: Ice White Rosin 5.5%, Hydrogenated Rosin Methyl Ester 5.5%;

[0067] Active Agent: Dipropionic Acid 5%;

[0068] Thixotropic agent: castor oil derivative 0.7%;

[0069] Solvents: 2-Hexyl-1-Decanol 2%, Tetraglyme 2.5%;

[0070] Wetting agent: oleyl alcohol polyoxyethylene ether 0.3%;

[0071] Corrosion inhibitor: octadecylamine 0.5%;

[0072] Dispersant: Polyetheramide 0.5%.

[0073] Adopt the preparation method of a kind of high wetting dispersibility and weather resistance SMT solder paste of above-mentioned component, concrete steps are as follows:

[0074] Step (1) Add the resin (ice-white rosin, hydrogenated rosin methyl ester) into the solvent (2-hexyl-1-decanol), heat to 80°C, stir at 40...

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Abstract

The invention provides SMT (surface mount technology) soldering paste with high wetting dispersity and weather resistance, which is prepared from the following components in percentage by mass: 70 to 80 percent of micron-sized tin-silver-copper alloy powder, 0.5 to 5 percent of antioxidant, 4.4 to 18 percent of resin, 3.2 to 7 percent of active agent, 0.5 to 0.9 percent of thixotropic agent, 3 to 5 percent of solvent, 0.1 to 1 percent of wetting agent, 0.1 to 1 percent of corrosion inhibitor and 0.1 to 1 percent of dispersing agent. Compared with commercially available solder paste, the solder paste has the advantages of high wettability, corrosion resistance and expansion rate, good thixotropy, capability of effectively reducing the generation of tin beads, less surface residue and no need of pre-dispersion by a centrifugal machine before use, not only meets related detection standards, but also can be directly used after temperature return.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to an SMT solder paste with high wettability, dispersibility and weather resistance and a preparation method thereof. Background technique [0002] With the development of electronic products towards ultra-large scale, digitization and miniaturization, surface mount technology SMT (Surface Mount Technology) has become the mainstream technology of electronic assembly. As an important soldering material, solder paste is widely used in surface mount technology. It plays a series of roles in the soldering process, such as fixing electronic components, removing surface oxide film, forming reliable solder joints, etc. Its quality is directly related to the quality of surface mount components. [0003] At present, the defects and deficiencies of the existing technology: 1. During double-sided SMD welding, the components fall off: the wettability and solderability of the solder p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/30
CPCB23K35/362B23K35/3006B23K35/302
Inventor 张群刘瑞鸿丰昭耿心彤许飞赵军
Owner JIANGSU ZHENGNENG ELECTRONICS TECH CO LTD
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