Method for preparing through-type composite strip embedded with silver copper

Abstract

The application discloses a method for preparing a through-type composite strip embedded with silver copper. The method comprises the steps of: extruding silver and copper ingots into profiled strips according to a design shape, respectively cleaning the surfaces of the profiled silver strip and the purchased profiled copper strip, removing a greasy dirt, an impurity and oxide on the surface; mutually embedding the silver strip and the copper strip into a whole; reinforcing and welding two heads to prepare a pre-composite material; continuously rolling and hot rolling to form a silver copper composite material from the pre-composite material under a complete-atmosphere protection state; dragging and receiving materials by a receiving machine, and then annealing in a diffusion manner, rolling and cutting to obtain the product. The method disclosed by the application is high in bonding strength, low in demand on manufacturing device, easy to process, long in length of strip, and convenient to automatically process, and manufacturing on a large scale can be carried out, thus, the cost is greatly reduced.

Description

technical field [0001] The invention relates to a material processing method, in particular to a preparation method of a silver-clad copper inlaid penetrating composite strip. Background technique [0002] Precious metal (gold and silver, etc.) composite materials, new contact materials for electrical switches, thermostats, fuses, micro-motor brushes, etc. Electrogrinding, conductivity and fusing performance are widely used in low-voltage electrical appliances and fuses. It has the advantages of good comprehensive performance and less silver consumption, which effectively saves the consumption of precious metal resources. [0003] As a substitute material for pure silver, the silver-clad copper penetrating composite material maintains the fast fusing effect of pure silver materials, and is an ideal material for replacing pure silver fusing at present. [0004] At present, the preparation methods for producing through-type and side silver-copper composite strips include braz...

AI Technical Summary

Problems solved by technology

The method requires heat preservation and heating for a certain period of time in a heating furnace protected by an argon atmosphere, and then taken out of the furnace for rolling and compounding. The disadvantages of this method are: high requirements for the protection effect of the atmosphere protection furnace equipment, and the material is easily damaged during the rolling process. Oxidation occurs, and the stability of the composite material’s bonding strength is poor. Its manufacturing equipment requires high capacity and the material’s manufacturing length is short, so it is not suitable for mass production.

[0006] CN101670365A, a method for preparing a double-sided inlaid silver-clad copper composite strip, has the disadvantages that brazing material needs to be added to the joint, and the brazing and welding at the joint is not completely stable, which increases the difficulty of solder production Large, short length of material, not suitable for mass production

[0007] CN101318286A, the preparation method of through-type lateral composite plate strip and the mold hot-pressing device, the preparation method is pressing and compounding with a large reduction of hydraulic press, reheating, rolling, and its disadvantages are: high equipment requirements, and its The service life of the mold hot pressing device is limited, the operation is difficult, the production efficiency is low, and the processing cost is high

[0009] 1. The length of the prepared strip is limited, and most of them are composited with short plates, which cannot meet the needs of automatic rolling, punching, welding, etc.;

[0010] 2. The one-time investment of composite equipment is large, and the process control is difficult;

[0011] 3. The material yield is low, which makes the material processing cost higher;

[0012] 4. The material in the compounding process is easy to oxidize, and the bonding strength is poor, so it is not suitable for silver-copper material compounding

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