Lead-free low-temperature solder and preparation method thereof
A low-temperature solder and solder technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of multi-oxidized slag, poor welding quality, insufficient safety, etc., and achieve less welding defects and good fluidity. , good wetting effect
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Embodiment 1
[0019] A lead-free low-temperature solder provided in this embodiment comprises the following components in terms of mass percentage: 15% bismuth, 0.3% silver, 0.8% antimony, 0.03% indium, 0.05% phosphorus, 0.015% germanium, beryllium 0.008%, cerium 0.008%; the balance is tin.
[0020] Its preparation method comprises the following steps:
[0021] The first step is to weigh bismuth powder, silver powder, antimony powder, indium powder, phosphorus powder, germanium powder, beryllium powder, cerium powder and tin powder according to the mass percentage. The particle size of the above powders is 150 mesh, and the oxygen content is 1000%. third;
[0022] The second step is to mix the powder with a V-type powder mixing machine, and the duration of the powder mixing is 5 hours to obtain a mixed powder, and then roll the mixed powder into a 1.0mm thick slab on a powder rolling mill;
[0023] In the third step, the slab is put into a vacuum furnace, the vacuum degree is not lower th...
Embodiment 2
[0026] A lead-free low-temperature solder provided in this embodiment comprises the following components in terms of mass percentage: 1.0% bismuth, 0.01% silver, 0.01% antimony, 0.01% indium, 0.01% phosphorus, 0.01% germanium, beryllium 0.01%, cerium 0.01%; the balance is tin.
[0027] Its preparation method comprises the following steps:
[0028] The first step is to weigh bismuth powder, silver powder, antimony powder, indium powder, phosphorus powder, germanium powder, beryllium powder, cerium powder and tin powder according to the mass percentage. The particle size of the above powder is 170 mesh, and the oxygen content is 1,000 parts fifth;
[0029] The second step is to mix the powder with a V-type powder mixing machine. The duration of the powder mixing is 6 hours to obtain the mixed powder, and then the mixed powder is rolled into a 0.9mm thick slab on the powder rolling mill;
[0030] In the third step, the slab is put into a vacuum furnace, the vacuum degree is not...
Embodiment 3
[0033] A lead-free low-temperature solder provided in this embodiment includes the following components in terms of mass percentage:
[0034] Bismuth 10.0%, silver 0.05%, antimony 0.08%, indium 0.03%, phosphorus 0.07%, germanium 0.03%, beryllium 0.07%, cerium 0.08%; the balance is tin.
[0035] Its preparation method comprises the following steps:
[0036] The first step is to weigh bismuth powder, silver powder, antimony powder, indium powder, phosphorus powder, germanium powder, beryllium powder, cerium powder and tin powder according to the mass percentage. The particle size of the above powder is 200 mesh, and the oxygen content is 1,000 parts third;
[0037] The second step is to mix the powder with a V-type powder mixing machine. The duration of the powder mixing is 8 hours to obtain the mixed powder, and then the mixed powder is rolled into a 1.1mm thick slab on the powder rolling mill;
[0038] In the third step, the slab is put into a vacuum furnace, the vacuum degr...
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