Lead-free low-temperature solder and preparation method thereof

A low-temperature solder and solder technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of multi-oxidized slag, poor welding quality, insufficient safety, etc., and achieve less welding defects and good fluidity. , good wetting effect

Inactive Publication Date: 2018-04-06
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the lead-free low-temperature solder in the prior art will have more oxide slag during soldering, the soldering quality is poor, and the safety is not enough

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A lead-free low-temperature solder provided in this embodiment comprises the following components in terms of mass percentage: 15% bismuth, 0.3% silver, 0.8% antimony, 0.03% indium, 0.05% phosphorus, 0.015% germanium, beryllium 0.008%, cerium 0.008%; the balance is tin.

[0020] Its preparation method comprises the following steps:

[0021] The first step is to weigh bismuth powder, silver powder, antimony powder, indium powder, phosphorus powder, germanium powder, beryllium powder, cerium powder and tin powder according to the mass percentage. The particle size of the above powders is 150 mesh, and the oxygen content is 1000%. third;

[0022] The second step is to mix the powder with a V-type powder mixing machine, and the duration of the powder mixing is 5 hours to obtain a mixed powder, and then roll the mixed powder into a 1.0mm thick slab on a powder rolling mill;

[0023] In the third step, the slab is put into a vacuum furnace, the vacuum degree is not lower th...

Embodiment 2

[0026] A lead-free low-temperature solder provided in this embodiment comprises the following components in terms of mass percentage: 1.0% bismuth, 0.01% silver, 0.01% antimony, 0.01% indium, 0.01% phosphorus, 0.01% germanium, beryllium 0.01%, cerium 0.01%; the balance is tin.

[0027] Its preparation method comprises the following steps:

[0028] The first step is to weigh bismuth powder, silver powder, antimony powder, indium powder, phosphorus powder, germanium powder, beryllium powder, cerium powder and tin powder according to the mass percentage. The particle size of the above powder is 170 mesh, and the oxygen content is 1,000 parts fifth;

[0029] The second step is to mix the powder with a V-type powder mixing machine. The duration of the powder mixing is 6 hours to obtain the mixed powder, and then the mixed powder is rolled into a 0.9mm thick slab on the powder rolling mill;

[0030] In the third step, the slab is put into a vacuum furnace, the vacuum degree is not...

Embodiment 3

[0033] A lead-free low-temperature solder provided in this embodiment includes the following components in terms of mass percentage:

[0034] Bismuth 10.0%, silver 0.05%, antimony 0.08%, indium 0.03%, phosphorus 0.07%, germanium 0.03%, beryllium 0.07%, cerium 0.08%; the balance is tin.

[0035] Its preparation method comprises the following steps:

[0036] The first step is to weigh bismuth powder, silver powder, antimony powder, indium powder, phosphorus powder, germanium powder, beryllium powder, cerium powder and tin powder according to the mass percentage. The particle size of the above powder is 200 mesh, and the oxygen content is 1,000 parts third;

[0037] The second step is to mix the powder with a V-type powder mixing machine. The duration of the powder mixing is 8 hours to obtain the mixed powder, and then the mixed powder is rolled into a 1.1mm thick slab on the powder rolling mill;

[0038] In the third step, the slab is put into a vacuum furnace, the vacuum degr...

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PUM

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Abstract

The invention belongs to the technical field of solder, and particularly relates to a lead-free low-temperature solder. The solder comprises, by mass, 0.001-58.0% of bismuth, 0.001-1.0% of silver, 0.001-2.0% antimony, 0.001-0.1% of indium, 0.001-0.15% of phosphorus, 0.001-0.08% of germanium, 0.001-0.015% of beryllium, 0.001-0.015% of cerium and the balance tin. Compared with the prior art, when welding is carried out at the temperature of 139DEG C to 200DEG C, little oxidation slag is generated, the surface of a tin furnace can be kept bright basically without oxidation at the temperature, thesolder can not be oxidized within 50 seconds at 200-260 DEG C, so that the welding efficiency is greatly improved, and the damage to electronic components of a PCBA board is reduced; the low-temperature solder is good in oxidation resistance; and in the welding process, compared with a common Sn-Ag-Cu system, the solder has fewer welding defects, the surfaces of welding spots are very light-bright, the welding spots are full, continuous welding does not occur, so that the welding quality is effectively improved, and the solder and the method are environment-friendly and safe.

Description

technical field [0001] The invention belongs to the technical field of solder, and in particular relates to a lead-free low-temperature solder and a preparation method thereof. Background technique [0002] The implementation of lead-free solder in the electronics industry is a general trend. The academic circles and the industry have recognized the performance of lead-free alloys represented by Sn-Ag-Cu in terms of soldering quality and long-term reliability. However, in high-density information equipment and portable equipment, low-temperature mounting technology is required for multilayering of substrates or embedding of devices. In addition, low-temperature soldering is required for soldering of heat-resistant components, lightning protection equipment, temperature-sensitive device equipment, LED lighting industry, low-temperature operation and other environments, instead of Sn-Ag-Cu high melting point solder. Therefore, low-temperature lead-free solder came into being....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 黄义荣黄守友林成在叶桥生
Owner THOUSAND ISLAND METAL FOIL
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