A kind of preparation method of solder paste

A solder paste and ultrasonic technology, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as high-temperature melting, and achieve the effect of full solder joints, uniform grain distribution, and rapid removal of solder paste

Active Publication Date: 2020-12-15
SHENZHEN FITECH
View PDF1 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has not fundamentally solved the problem of solder paste refinement, and high-temperature melting or repeated grinding processes are still required when preparing solder paste

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of preparation method of solder paste
  • A kind of preparation method of solder paste
  • A kind of preparation method of solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Example 1: Add the raw materials for making solder paste into the reaction kettle, mix these raw materials evenly, heat and stir at 80°C for 1 hour after preliminary mixing, and the stirring speed is 0.1m / s, and prepare the initial solder paste reactant. Start the circulation pump to transfer the initial reactant to the ultrasonic treatment system, control the temperature of the material to 80°C through the constant temperature device, the power of the ultrasonic generator is 2kW, the frequency of the ultrasonic wave generated is 30kHz, and the ultrasonic treatment time is 4h, and the intermediate solder paste is prepared body. Then, adjust the power of the ultrasonic generator to 0.5kW, the frequency of the generated ultrasonic waves to 25kHz, and the ultrasonic cooling time to 0.5h. At this time, the temperature of the solder paste reaches room temperature to prepare the solder paste, which is then packaged and stored.

[0043] attached figure 1 It is the morphology...

Embodiment 2

[0044] Example 2: Add the raw materials for making solder paste into the reaction kettle, mix these raw materials evenly, heat and stir at 100°C for 0.5h after preliminary mixing, and the stirring speed is 0.5m / s to prepare solder paste initial reactant. Start the circulation pump to transfer the initial reactant to the ultrasonic treatment system, control the temperature of the material to 100°C through the constant temperature device, the power of the ultrasonic generator is 6kW, the frequency of the ultrasonic wave generated is 20kHz, and the ultrasonic treatment time is 2h, and the intermediate solder paste is prepared body. Then, adjust the power of the ultrasonic generator to 0.2kW, the frequency of the generated ultrasonic waves to 20kHz, and the ultrasonic cooling time to 2h. At this time, the temperature of the solder paste reaches room temperature to prepare the solder paste, and then pack it for storage.

[0045] attached image 3 It is the topography diagram of t...

Embodiment 3

[0046] Example 3: Add the raw materials for making solder paste into the reaction kettle, mix these raw materials evenly, heat and stir at 100°C for 0.5h after preliminary mixing, and the stirring speed is 1m / s, and prepare the initial solder paste reactant. Start the circulating pump to transfer the initial reactant to the ultrasonic treatment system, control the temperature of the material to 100°C through the constant temperature device, the power of the ultrasonic generator is 8kW, the frequency of the ultrasonic wave generated is 20kHz, and the ultrasonic treatment time is 1h, and the intermediate solder paste is prepared body. Then, adjust the power of the ultrasonic generator to 0.5kW, the frequency of the generated ultrasonic waves to 20kHz, and the ultrasonic cooling time to 2h. At this time, the temperature of the solder paste reaches room temperature to prepare the solder paste, and then pack it for storage.

[0047] attached Figure 4 It is the topography diagram...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a preparation method of paste flux. The preparation method comprises the following steps: putting basic raw materials for preparing the paste flux in a reaction container to be heated to 80-120 DEG C and to be uniformly stirred to prepare an initial reactant of the paste flux; in a constant temperature condition of 80-120 DEG C, applying ultrasonic waves to the initial reactant of the paste flux for dispersing treatment to prepare a paste flux intermediate; and cooling the paste flux intermediate to the room temperature, and continuously using ultrasonic waves in the cooling process for dispersing treatment to prepare the paste flux. The method provided by the invention is simple and convenient to operate and high in work efficiency. The particle sizes of crystalsin the paste flux prepared through the method provided by the invention are smaller than 20 [mu]m, and the paste flux is more uniform in grain distribution and superior in comprehensive performance.

Description

technical field [0001] The invention relates to the technical field of soldering paste preparation, in particular to a method for preparing fine soldering paste using ultrasonic technology. Background technique [0002] With the development of electronic preparation technology and the development trend of component miniaturization and high density, the solder paste used in SMT electronic component packaging will be more refined. Traditional T3 and T4 solder pastes cannot be applied to packaging processes such as fine-pitch and high-density components such as die-bonding and spray printing due to their large solder paste particle size. T6, T7 and T8 solder powders and corresponding solder pastes are used The formulated refined solder paste came into being. Here the particle diameter range represented by T3 is: 25~45μm, the particle diameter range represented by T4 is: 20~38μm, the particle diameter range represented by T6 is: 5~15μm, the particle diameter range represented b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 徐朴王思远刘传福
Owner SHENZHEN FITECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap