Heating and pressing device for anodic bonding of long glass cylinders

Abstract

The invention discloses a heating imposing electric device of long glass column anodic bonding. The device provided by the invention comprises adaptive pressure heads, a heating stage, heating pipes integrated inside the heating stage, heating blocks disposed on the heating stage, ceramic blocks installed on the heating blocks, a pedestal and a cylinder installed on the pedestal. The adaptive pressure heads comprise connecting rods, insulation blocks connected with the connecting rods, pressure head bases, pressure heads installed in the pressure head bases, glass column imposing electric reeds installed on the pressure head bases, and silicon chip imposing electric reeds installed on the insulation blocks. The adaptive pressure heads are connected with the cylinder through the connecting rods. The glass column imposing electric reeds contain two and the two glass column imposing electric reeds respectively clamp the two sides of the glass column. By the adoption of an imposing electric mode by clamping the two sides of the glass column, the imposing electric effect can be guaranteed, and the bonding efficiency is also greatly raised. In addition, the bonding time can be shortened and the imposing electric height is convenient to adjust if the glass column is long.

Description

Technical field [0001] The invention relates to a heating and pressing device, in particular to a heating and pressing device used for anodic bonding of long glass cylinders. Background technique [0002] Device-level packaging is a commonly used packaging method in the development stage of my country's MEMS (Micro-Electro-Mechanical Systems) industry with multiple varieties, high specificity, and small and medium batch industrialization. Single chip anode bonding is an important part of device-level packaging. With the development of MEMS technology, its process equipment market potential is very huge. As the industrial application of piezoresistive sensors and other MEMS devices matures, the demand for single-chip anode bonding process equipment that can adapt to different glass body shapes, which is indispensable in packaging, is becoming more and more obvious. At the same time, as the performance requirements of MEMS devices are getting higher and higher, more and more peop...

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a heating and powering device for anodic bonding of long glass cylinders, which can be flexibly integrated in single-chip anodic bonding equipment. The heating and powering device for anodic bonding of long glass cylinders Strong adaptability, high bonding precision, can effectively solve the problem of difficult voltage application between silicon wafer and glass column

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