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Package for semiconductor device, and method for manufacturing the same and semiconductor device

一种光半导体装置、制造方法的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决密封树脂27不足、外观缺陷、连接不良等问题

Inactive Publication Date: 2014-03-26
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, if a gap 28 occurs between the lead frames 21, 22 and the resin 24, there is a problem that when the semiconductor device is packaged with the sealing resin 27, the sealing resin 27 leaks from the gap 28, thereby causing appearance problems. Defects or insufficient sealing resin 27 inside the opening of the resin part 23, or leakage of the sealing resin 27 adheres to the external terminals, resulting in poor connection and poor mounting

Method used

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  • Package for semiconductor device, and method for manufacturing the same and semiconductor device
  • Package for semiconductor device, and method for manufacturing the same and semiconductor device
  • Package for semiconductor device, and method for manufacturing the same and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] First, use Figure 1A ~ Figure 1C , Figure 2A ~ Figure 2D , the structure and manufacturing method of the semiconductor device package in Embodiment 1 will be described.

[0045] Figure 1A ~ Figure 1C It is a figure which shows the structure of the package for semiconductor devices in Example 1, Figure 1A is a top view, Figure 1B yes Figure 1A X-X' section view in Figure 1C It is a bottom view. Figure 2A ~ Figure 2D It is a process sectional view showing the manufacturing process of the package for semiconductor devices of this invention.

[0046] exist Figure 1A ~ Figure 1C Among them, reference numeral 1 is a lead frame having a mounting region 4 for a semiconductor element for the internal lead, reference numeral 2 is a lead frame having a connection region 5 connected to a semiconductor device for the internal lead, and reference numeral 3 is a lead frame formed between the lead frame 1 and the lead frame. 2 to hold them and surround the loading area 4...

Embodiment 2

[0056] Next, use Figure 3A ~ Figure 3D , the structure of the semiconductor device package in Example 2 will be described.

[0057] Figure 3A ~ Figure 3D It is a figure which shows the structure of the package for semiconductor devices in Example 2, and is a figure which shows the structural example of a step.

[0058] In Example 1, a structure is adopted in which a step 10 is provided on the upper surface side of the semiconductor element mounting surface of the lead frames 1 and 2, and a thinner part of the lead frame is left on the back surface opposite to the upper surface. , but if Figure 3A As shown, it is also possible to adopt the following structure: that is, between the opposite side surfaces of the lead frames 1, 2, at least the part exposed from the resin part 3 to the inside of the opening, on the back surface of the lead frames 1, 2 opposite to the upper surface Step 11 is set. Even in the case where the step 11 is provided on the back side, the gap betwee...

Embodiment 3

[0066] Next, use Figure 4A ~ Figure 4C , the structure of the semiconductor device package in Example 3 will be described.

[0067] Figure 4A ~ Figure 4C It is a figure which shows the structure of the resin between the lead frames in the package for semiconductor devices of Example 3, Figure 4A is a perspective view of main parts illustrating a case where protrusions are provided as an example of unevenness, Figure 4B It is a perspective view of main parts illustrating a case where a depression is provided as an example of unevenness, Figure 4C It is a perspective view of main parts showing an example of a case where grooves are provided as unevenness.

[0068] The semiconductor device package in Example 3 is characterized in that unevenness is formed on the surface of the holding resin 6 of the semiconductor device package in Example 1 or Example 2 exposed between the lead frames 1 and 2 .

[0069] Such as Figure 4A ~ Figure 4C As shown, the resin part 3 surrounds...

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PUM

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Abstract

In a package for a semiconductor device according to the present invention, steps 10 are provided at least on the sides of lead frames 1 and 2 at exposed portions in the opening of a resin part 3, thereby increasing adhesion between the lead frames 1 and 2 and resin and suppressing leakage of molding resin and intrusion of outside air or moisture from a gap between the lead frames 1 and 2 and the resin.

Description

technical field [0001] The present invention relates to a semiconductor device in which a sealing resin is provided in a resin portion that holds a lead frame and forms a mounting region for a semiconductor element, and a semiconductor device package used for the semiconductor device. Background technique [0002] A conventional semiconductor device package will be described with reference to FIGS. 6A to 6C . [0003] 6A to 6C are schematic diagrams showing the structure of a conventional semiconductor device package. FIG. 6A is a top view, and FIG. 6B is a XX' cross-sectional view of FIG. 6A . A diagram of the structure of a semiconductor device. [0004] As shown in FIGS. 6A to 6C, the existing semiconductor device package includes: a lead frame 21 having a mounting area for a semiconductor element for the inner lead; a lead frame 22 having a connection area for connecting the semiconductor device to the inner lead; Lead frame 21 and lead frame 22 are held on the upper s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/31H01L33/48H01L33/62H01L33/54H01L33/00
CPCH01L23/49861B29C45/1671B29C45/14311H01L2224/48247H01L23/3107H01L33/62H01L2933/0033B29C45/14655H01L33/486H01L2224/48091H01L2924/00014
Inventor 西野正纪堀木厚
Owner PANASONIC CORP
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