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Lead frame-based discrete power inductor

A technology of lead frame and power inductors, which is applied in the direction of inductors with magnetic cores, transformer/inductor cores, transformer/inductor coils/windings/connections, etc., which can solve problems such as inconvenient manufacturing and complex structures, and achieve Effect of Thin Profile, Small Footprint, Compact Power Inductor

Active Publication Date: 2012-02-22
重庆万国半导体科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These non-wound discrete inductors require multiple layers and have complex structures that are inconvenient to manufacture

Method used

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  • Lead frame-based discrete power inductor
  • Lead frame-based discrete power inductor
  • Lead frame-based discrete power inductor

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Embodiment Construction

[0064] The present invention will now be described in detail in conjunction with the accompanying drawings, which are used as examples of the present invention so that those skilled in the art can implement the present invention. It should be noted that the following figures and examples are not meant to limit the scope of the present invention. Some of the components of the present invention may be realized in part or in whole by known elements, and among these known elements, only those parts necessary for understanding the present invention will be set forth, and the detailed description of the remaining known elements will be are omitted so as not to obscure the content of the present invention. Additionally, the present invention encompasses, by way of illustration, present and future known equivalents to those referred to herein.

[0065] The invention provides a discrete power inductor based on a lead frame. Embodiments of the invention include a magnetic core having ...

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Abstract

A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil. The present invention has the advantages of providing a compact power inductor and maximizing the inductance per unit area of the power inductor. The present invention also provides a power inductor combining a small physical size with the smallest turn number, wherein the power inductor has a small cover area and a thin contour. In addition, the power inductor of the present invention can be produced with low cost and high yield by simply using the present semiconductor packaging technology.

Description

[0001] This case is a divisional application [0002] Title of original invention: Discrete power inductor based on lead frame [0003] Original application number: 200910003340.9 [0004] Date of original filing: January 15, 2009 technical field [0005] The present invention relates generally to discrete inductors, and more particularly to discrete inductors having top and bottom lead frames, the internal connection pins of which form a coil around a closed-loop magnetic core. Background technique [0006] A review of the prior art discrete inductors has demonstrated a variety of configurations, including packaged wire wound inductors with either circular or planar windings around a magnetic core. Typical cores are toroidal cores, "I" barrel cores, "T" barrel cores, and "E" barrel cores. Other known structures include wire wound with iron powder cores and metal alloy dust cores. It is also known to form a surface mount discrete inductor provided with windings around th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/04H01F27/30H01F27/26H01F27/24
CPCH01L2924/0002H01L2924/00
Inventor 弗兰茨娃·赫尔伯特冯涛张晓天鲁军
Owner 重庆万国半导体科技有限公司
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