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Method for reducing volatile organic compounds in composite resin particles, and composite resin particles

A technology of organic compounds and composite resins, used in transportation and packaging, thin material handling, etc., can solve the problems of increased production cost, poor rigidity, and poor foaming gas retention ability, and achieve excellent impact resistance and chemical resistance. Effect

Active Publication Date: 2012-02-22
SEKISUI PLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor foaming gas retention ability of polyolefin-based resins, it is necessary to accurately control the foam molding conditions, which is bound to be accompanied by the problem of increased production costs.
In addition, foamed molded articles made of polyolefin-based resins also have the disadvantage of poor rigidity compared with styrene-based resin foamed molded articles

Method used

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  • Method for reducing volatile organic compounds in composite resin particles, and composite resin particles
  • Method for reducing volatile organic compounds in composite resin particles, and composite resin particles
  • Method for reducing volatile organic compounds in composite resin particles, and composite resin particles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0157] a) Preparation of modified styrene-based resin particles of polyvinyl resin (PE) / polystyrene-based resin (PS)=40 / 60

[0158] 100 parts by weight of ethylene-vinyl acetate copolymer (hereinafter referred to as EVA) (trade name: "LV-115", Japan Polyethylene Corporation, melting point: 108° C., melt flow rate: 0.3 g / 10 minutes) and 0.5 parts by weight of synthetic hydrated silica are fed into an extruder for melting and mixing to pelletize with an underwater cutting method, thereby preparing oval (oval) EVA resin particles (polyolefin-based resin particles ). The average weight of the EVA resin particles was 0.6 mg.

[0159] Next, 128 g of magnesium pyrrolidinate and 32 g of sodium dodecylbenzenesulfonate were dispersed into 40 kg of water to prepare a dispersion medium.

[0160] 16 kg of synthetic hydrated silica-containing EVA resin particles were dispersed into the dispersion medium to prepare a suspension.

[0161] 12.2 g of t-butyl peroxybenzoate used as a polymer...

Embodiment 2

[0179] a) Preparation of modified styrene-based resin particles of polyvinyl resin (PE) / polystyrene-based resin (PS)=50 / 50

[0180] 100 parts by weight of ethylene-vinyl acetate copolymer (hereinafter referred to as EVA) (trade name: "LV-115", Japan Polyethylene Corporation, melting point: 108° C., melt flow rate: 0.3 g / 10 minutes) and 0.5 parts by weight of synthetic hydrated silica are fed into an extruder for melting and mixing to pelletize with an underwater cutting method, thereby preparing oval (oval) EVA resin particles (polyolefin-based resin particles ). The average weight of the EVA resin particles was 0.6 mg.

[0181] Next, 128 g of magnesium pyrrolidinate and 32 g of sodium dodecylbenzenesulfonate were dispersed into 40 kg of water to prepare a dispersion medium.

[0182] 20 kg of synthetic hydrated silica-containing EVA resin particles were dispersed into the dispersion medium to prepare a suspension.

[0183] 16.0 g of tert-butyl peroxybenzoate used as a poly...

Embodiment 3

[0195] a) Preparation of modified styrene-based resin particles of polyvinyl resin (PE) / polystyrene-based resin (PS)=30 / 70

[0196] 100 parts by weight of ethylene-vinyl acetate copolymer (hereinafter referred to as EVA) (trade name: "LV-115", Japan Polyethylene Corporation, melting point: 108° C., melt flow rate: 0.3 g / 10 minutes) and 0.5 parts by weight of synthetic hydrated silica are fed into an extruder for melting and mixing to pelletize with an underwater cutting method, thereby preparing oval (oval) EVA resin particles (polyolefin-based resin particles ). The average weight of the EVA resin particles was 0.6 mg.

[0197] Next, 128 g of magnesium pyrrolidinate and 32 g of sodium dodecylbenzenesulfonate were dispersed into 40 kg of water to prepare a dispersion medium.

[0198] 12 kg of synthetic hydrated silica-containing EVA resin particles were dispersed into the dispersion medium to prepare a suspension.

[0199] 9.5 g of tert-butyl peroxybenzoate used as a polym...

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Abstract

Disclosed is a method for reducing volatile organic compounds in composite resin particles, which comprises a step wherein composite resin particles containing a polyolefin resin and a polystyrene resin are contained and flowed in a container, and a gas that is at a temperature of from (T - 40) DEG C to (T - 10) DEG C when the softening point of the composite resin particles is represented by T DEG C is blown into the container from the lower portion until the amount of volatile organic compounds contained in the composite resin particles as a whole is reduced to 50 ppm or less.

Description

technical field [0001] The present invention relates to a method of reducing volatile organic compounds in composite resin particles and composite resin particles having reduced volatile organic compounds obtained by the method. More particularly, the present invention relates to a method of reducing volatile organic compounds in composite resin particles containing a polyolefin-based resin and a polystyrene-based resin and composite resin particles obtained by the method. Background technique [0002] Conventionally, it has been known that polystyrene-based resin foam moldings obtained by molding polystyrene-based resin pre-expanded particles in a mold are excellent in rigidity, heat insulation, lightness, water resistance and foam molding sex. However, such foam moldings have the disadvantage of poor chemical resistance and impact resistance. Furthermore, since foam moldings contain a large amount of volatile organic compounds (VOCs) such as styrene monomer, it is diffic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/12C08J9/18C08J9/232
CPCB29B2009/168C08F6/005C08J3/12C08J9/18C08J9/232C08J2323/02C08J2325/06C08J2351/06B29B9/06B29B9/12B29B2009/125Y10T428/2982Y10T428/2991C08L23/00C08L25/00C08J2323/00
Inventor 松村英保石田真司
Owner SEKISUI PLASTICS CO LTD