Vacuum process equipment, vacuum transmission process equipment and methods
A process equipment, vacuum transfer technology, applied in conveyor objects, transportation and packaging, final product manufacturing, etc., can solve problems such as low production efficiency and complex doping steps for solar wafers
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Embodiment 1
[0061] Such as figure 2 As shown, this embodiment takes the case of fabricating n+ poles and p+ poles on the back of a solar wafer by ion implantation doping as an example, and describes the vacuum process equipment and method of the present invention.
[0062] In this embodiment, it is obvious that n=2, that is, each wafer back has two regions to be processed, each accounting for half, which are respectively used to form n+ poles and p+ poles. figure 2In the middle, it is distinguished by square filling and oblique line filling respectively; there are two processing devices 3a and 3b, and the two processing devices are both ion implantation devices at this time, but the processing device 3a is used to implant half of the area on the back of the wafer n+ polar ions, such as P+ or As+ ions, and the processing device 3b is used to implant p+ polar ions, such as B+ ions, into the half area of the wafer backside; correspondingly, the transfer platform 2 is divided into two wor...
Embodiment 2
[0075] Such as image 3 As shown, the difference between the vacuum process equipment in this embodiment and the vacuum process equipment in Embodiment 1 is only: 1) the arrangement of wafers on the transport platform 2 is different; 2) the size of the processing medium action area of the processing device is different .
[0076] In this embodiment, 1) in the same workpiece loading area, the wafers are aligned with each other, and viewed along the moving direction of the transfer platform 2, the same area to be processed of each pair of adjacent wafers is adjacent, that is, for forming n+ poles The area is adjacent to the area used to form the p+ pole, that is to say, when viewed along the moving direction of the transfer platform 2, the orientations of the n+ pole and the p+ pole of each pair of adjacent wafers in each workpiece loading area are On the contrary; 2) when viewed along the direction perpendicular to the moving direction of the transport platform 2, the differ...
Embodiment 3
[0087] The above two embodiments are aimed at the situation that there are two regions to be processed with the same size on the workpiece, and the areas of the two regions to be processed each account for half of the size of the workpiece. Figure 4 For example, for the case where there are two areas to be processed on the workpiece, and the area of one of the two areas to be processed is less than half the size of the workpiece or the area of the two areas to be processed is less than half the size of the workpiece, detailed illustrate.
[0088] Such as Figure 4 As shown, at this time, the area of the area to be processed (square filled area) corresponding to the processing device 3a is less than half the size of the workpiece, and the area of the area to be processed (hatched area) corresponding to the processing device 3b is still the size of the workpiece half of that; and the arrangement of all the workpieces on the transfer platform 2 is exactly the same as th...
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