Vacuum process equipment, vacuum transmission process equipment and methods
A process equipment, vacuum transfer technology, applied in conveyor objects, transportation and packaging, final product manufacturing, etc., can solve problems such as low production efficiency and complex doping steps for solar wafers
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Embodiment 1
[0061] Such as figure 2 As shown, this embodiment takes the case where the n+ pole and the p+ pole on the back of the solar wafer are fabricated by ion implantation and doping as an example to describe the vacuum process equipment and method of the present invention.
[0062] In this embodiment, it is obvious that n=2, that is, each wafer has two half-to-be-processed regions on the back side, which are used to form n+ poles and p+ poles. figure 2 In the middle, it is distinguished by grid filling and diagonal filling; there are two processing devices 3a and 3b. At this time, the two processing devices are ion implantation devices, but the processing device 3a is used to implant half of the backside of the wafer. n+ polar ions, such as P+ or As+ ions, and the processing device 3b is used to inject p+ polar ions, such as B+ ions, into the half area of the backside of the wafer; accordingly, the transport platform 2 is divided into two workpieces with the same size. Areas A and B...
Embodiment 2
[0075] Such as image 3 As shown, the difference between the vacuum process equipment of this embodiment and the first embodiment of the vacuum process equipment is only: 1) the arrangement of the wafers on the transfer platform 2 is different; 2) the size of the processing medium action area of the processing device is different .
[0076] In this embodiment, 1) In the same workpiece carrying area, the wafers are aligned with each other, and viewed along the moving direction of the transfer platform 2, the same processing area of each pair of adjacent wafers is adjacent, that is, it is used to form n+ poles. The area of is adjacent to the area used to form the p+ pole, that is, when viewed along the moving direction of the transport platform 2, the orientation of the n+ pole and p+ pole of each pair of adjacent wafers in each workpiece carrying area is On the contrary; 2) when viewed along a direction perpendicular to the moving direction of the transfer platform 2, the di...
Embodiment 3
[0087] The above two embodiments are aimed at the case where there are two areas to be processed with the same size on the workpiece, and the areas of the two areas to be processed each account for half of the size of the workpiece. Figure 4 As an example, the case where there are two regions to be processed on the workpiece, and the area of one of the two regions to be processed is less than half of the size of the workpiece, or the areas of the two regions to be processed are both less than half of the size of the workpiece. Description.
[0088] Such as Figure 4 As shown, the area to be processed (checkered filling area) corresponding to the processing device 3a at this time is less than half the size of the workpiece, and the area of the area to be processed (slashed filling area) corresponding to the processing device 3b is still the size of the workpiece The arrangement of all the workpieces on the transfer platform 2 is exactly the same as the arrangement of the workp...
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