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Manufacturing method of circuit board

A manufacturing method and circuit board technology, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, and can solve problems such as difficult realization of circuit boards

Active Publication Date: 2015-04-15
无锡广芯封装基板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The improved semi-additive method can be used to make circuit boards with a line spacing of more than 50 microns, but it is difficult to achieve circuit boards with a line spacing of less than 50 microns.

Method used

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  • Manufacturing method of circuit board
  • Manufacturing method of circuit board
  • Manufacturing method of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] The embodiment of the present invention provides a method for manufacturing a circuit board, which adopts an improved semi-additive method to perform pattern electroplating to form a circuit pattern preliminarily; dispose a resist wet film or a dry film on the preliminarily formed circuit pattern; perform rapid etching , To etch away the metal layer in the non-circuit pattern part; remove the resist wet film or dry film, and finally form the circuit pattern. The detailed description is given below in conjunction with the drawings.

[0011] Please refer to figure 1 , An embodiment of the present invention provides a method for manufacturing a circuit board, including:

[0012] 100. Perform pattern electroplating on the metal layer on the side of the circuit board where the metalized blind holes are provided to form a circuit pattern, and the circuit pattern is electrically connected to the upper layer circuit pattern through the metalized blind hole.

[0013] In this embodimen...

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PUM

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Abstract

The invention discloses a manufacturing method of a circuit board. The manufacturing method comprises the following steps: carrying out pattern plating on a metal layer on one surface, which is provided with a metallization blind hole, of the circuit board so as to form a circuit pattern, wherein the circuit pattern is electrically connected with an upper-layer circuit pattern through the metallization blind hole; arranging a corrosion-resistant film on the formed circuit pattern, wherein the shape of the corrosion-resistant film is matched with that of the circuit pattern; and etching out a metal layer at a non-circuit-pattern part. According to the technical scheme of the invention, the corrosion-resistant film is used for protecting the circuit pattern, so that the line width loss caused by lateral erosion during rapid etching can be reduced, thus a more exquisite circuit can be manufactured.

Description

Technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a manufacturing method of a circuit board. Background technique [0002] Common printed circuit boards, including low-end packaging substrates, are often made by subtractive methods. The subtractive method includes: first pressing a copper foil with a thickness of about 18 microns on the insulating dielectric layer between the layers, then filling the entire plate with holes and electroplating, and then using a resist dry film or a wet film to protect the need to form a circuit pattern After the parts are etched, the plating layer and copper foil of the parts that do not need to form a circuit are etched away to form a circuit pattern. Using the subtractive method, the thickness of the copper foil and plating that need to be etched is more than 20 microns. Because of the side etching, the line width loss after etching is large, and it is difficult to make a circuit board...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
Inventor 冯锡明谷新丁鲲鹏彭勤卫孔令文
Owner 无锡广芯封装基板有限公司