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Production method of overlapping hole printed board

A production method and printed board technology, which is applied in the direction of printed circuit manufacturing, printed circuit, and electrical connection formation of printed components, can solve the problems that laser drilling cannot be completed, and the intention of the customer's design cannot be achieved, so as to save production costs , Improve production efficiency, reduce the effect of process steps

Active Publication Date: 2012-05-16
SHANGHAI FAST PCB CIRCUIT TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the thickness of the board, laser drilling cannot be completed, and the ground of each layer cannot be well contacted, which fails to meet the customer's design intention

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0033] A method for producing a printed board with stacked holes, comprising the following steps:

[0034] 1) blanking;

[0035] 2) L3, L4 drilling;

[0036] 3) Metallization of L3 and L4 holes;

[0037] 4) L4 line production;

[0038] 5) L5, L6 drilling;

[0039] 6) Metallization of L5 and L6 holes;

[0040] 7) L5 line production, butt pad production;

[0041] 8) L3 to L6 pressing;

[0042] 9) L3 to L6 drilling;

[0043] 10) Metallization of L3 to L6 holes;

[0044] 11) Line production from L3 to L6;

[0045] 12) L7, L8 drilling;

[0046] 13) Metallization of holes L7 and L8;

[0047] 14) L7 line production, butt pad production;

[0048] 15) L1 to L8 pressing;

[0049] 16) Through holes L1 to L8;

[0050] 17) Metallization of L1 to L8 holes;

[0051] 18) Line production from L1 to L8;

[0052] Where: L1 to L8 are arranged sequentially from top to bottom.

[0053] Both L1 and L2 are single-sided copper-clad core boards.

[0054] Between L1 and L2, between L2 a...

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PUM

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Abstract

The invention relates to a production method of an overlapping hole printed board. The method comprises the following steps: (1) blanking; (2) drilling L3 and L4; (3) carrying out L3 and L4 hole metallization; (4) carrying out L4 line production; (5) drilling L5 and L6; (6) carrying out L5 and L6 hole metallization; (7) carrying out L5 line production and making a butt joint pad; (8) pressing L3, L4, L5 and L6 together; (9) drilling L3, L4, L5 and L6; (10) carrying out L3, L4, L5 and L6 hole metallization; (11) carrying out L3, L4 L5 and L6 line production; (12) drilling L7 and L8; (13) carrying out L7 and L8 hole metallization; (14) carrying out L7 line production and making a butt joint pad; (15) pressing L1, L2, L3, L4, L5, L6, L7 and L8 together; (16) making through holes on L1, L2, L3, L4, L5, L6, L7 and L8; (17) carrying out L1, L2, L3, L4, L5, L6, L7 and L8 hole metallization; (18) carrying out L1, L2, L3, L4, L5, L6, L7 and L8 line production. Compared with the prior art, the invention has the advantages of being raising production efficiency, saving production cost and the like.

Description

technical field [0001] The invention relates to a production method of a printed board, in particular to a production method of a printed board with stacked holes. Background technique [0002] Blind and buried holes with special structure printed boards made of special materials, among which L3-4, L3-6 are buried holes, and L4-8, L2-8, L7-8 are blind holes. The whole structure belongs to the cross blind buried structure, and the existing manufacturing process is as follows: [0003] Cutting → L3-4 drilling → L3-4 hole metallization → L4 line production → L3-6 pressing → L3-6 drilling → L3-6 hole metallization → L3-6 line production → L1-8 pressing → L1-8 drilling through holes, laser drilling blind holes → L1-8 hole metallization → L1-8 circuit production. [0004] Due to the thickness of the board, laser drilling cannot be completed, and the ground of each layer cannot be well contacted, which fails to meet the customer's design intention. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/42
Inventor 姚宇国
Owner SHANGHAI FAST PCB CIRCUIT TECH CORP LTD