Object inspection systems and methods

An inspection method and an object technology, which are applied in the field of object inspection systems in the field of lithography technology, can solve the problems of expensive inspection tools and the like

Active Publication Date: 2012-05-23
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, existing inspection tool

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Embodiment Construction

[0044]Embodiments of the invention relate to object inspection systems and methods. This specification discloses one or more embodiments that incorporate the features of this invention. The disclosed embodiments are merely exemplary of the invention. The scope of the present invention is not limited to these disclosed embodiments. The invention is defined by the appended claims.

[0045] The described embodiments and references in the specification to "one embodiment," "an embodiment," "exemplary embodiment," etc. mean that the described embodiments may include particular features, structures, or characteristics, but each embodiment It may not be necessary to include specific features, structures or characteristics. Also, these paragraphs are not necessarily referring to the same embodiment. Furthermore, when particular features, structures or characteristics are described in conjunction with an embodiment, it should be understood that it is within the scope of knowledge o...

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Abstract

Methods and systems for inspection of an object include the use of spectroscopic techniques for the detection of unwanted particles on an object's surface, based on the different responses of the unwanted particles as compared with the object to be inspected due to their different materials. Time resolved spectroscopy and/or energy resolved spectroscopy of secondary photon emission from the surface of the object can be used to obtain Raman and photoluminescence spectra. The objects to be inspected can for example be a patterning device as used in a lithographic process, for example a reticle, in which case the presence of metal, metal oxide or organic particles can be detected, for example. The methods and apparatus are highly sensitive, for example, being able to detect small particles (sub 100 nm, particularly sub 50 nm) on the patterned side of an EUV reticle.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to US Provisional Application 61 / 231,161, filed August 4, 2009, which is hereby incorporated by reference in its entirety. technical field [0003] Embodiments of the invention relate generally to object inspection systems and methods, and in particular to object inspection systems and methods in the field of lithography, where the object to be inspected may be, for example, a reticle or other patterning device. Background technique [0004] Photolithography is widely recognized as one of the key steps in the fabrication of integrated circuits (ICs) and other devices and / or structures. However, as the dimensions of features formed using lithography become smaller and smaller, lithography is becoming a more critical factor for achieving miniature ICs or other devices and / or structures to be fabricated. [0005] A lithographic apparatus is a machine that applies a desired ...

Claims

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Application Information

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IPC IPC(8): G03F1/84G03F1/22G01N21/64G01N21/95G03F1/00
CPCG03F1/84G03F1/24G01N21/94G01N21/65G01N21/956G01N21/9501G01N21/6489G01N21/6408
Inventor V·伊万诺夫A·邓鲍夫V·班尼恩L·斯卡克卡巴拉兹N·伊欧萨德
Owner ASML NETHERLANDS BV
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