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Supporting pad

A technology for retaining pads and retaining surfaces, applied in the direction of grinding workpiece holders, electrical components, grinding tools, etc., can solve the problems of two kinds of flake peeling, etc., and achieve the effect of improving flatness precision and in-plane uniformity

Active Publication Date: 2012-05-30
FUJIBO HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is also the problem that the two kinds of flakes are peeled off during the grinding process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] In Example 1, polyester MDI (diphenylmethane diisocyanate) polyurethane resin was used in the preparation of the urethane sheet 2, and it was dissolved in DMF at a ratio of 20% by weight. 100 parts of the solution, 45 parts of DMF and 40 parts of a DMF dispersion containing 20% ​​by weight of carbon black as a pigment were added and mixed to prepare a polyurethane resin solution. The obtained polyurethane resin solution had a viscosity of 3.4 Pa.s. The viscosity is a numerical value measured under a temperature environment of 25° C. using a No. M3 rotary viscometer (manufactured by Toki Sangyo Co., Ltd., TVB-10 type). When coating the polyurethane resin solution, the clearance of the coating device was set to 1.0 mm. After the polyurethane resin solution was coated on the film-forming substrate of the PET film, it was continuously introduced into water (coagulation liquid) at a temperature of 20°C. At this time, the conveying speed (line speed) of the polyurethane res...

Embodiment 2

[0055] In Example 2, the urethane sheet 2 was produced in the same manner as in Example 1, except that the linear velocity of the polyurethane resin solution was set to 5 m / min, and the holding mat 10 was produced. . The viscosity of the polyurethane resin solution used is 3.2 Pa.s.

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PUM

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Abstract

A supporting pad is provided which has a supporting face with heightened flatness precision and can improve the in-plane evenness of an object to be polished. The supporting pad (10) includes a urethane sheet (2) formed by the wet solidification method and having a supporting face (Sh). The urethane sheet (2) has a skin layer (2a) formed therein and has many cells (4) formed on the inner side of the skin layer (2a). The cells (4) have such a size that the cells (4) extend over almost the whole thickness of the urethane sheet (2). The cells (4) each has been formed so that the diameter thereof in a lower layer (Pr) of the urethane sheet (2) is larger than the diameter thereof in an upper layer (Ph) of the sheet (2). The cells (4) have been formed so that the direction of cell formation in the upper layer (Ph) is evenly inclined in a certain direction relative to the thickness direction and that the direction of cell formation in the lower layer (Pr) is the same as the thickness direction. When the pad (10) is compressed in polishing, a stress is evenly imposed on the object being polished.

Description

technical field [0001] The present invention relates to a holding pad, in particular to a holding resin sheet having a holding surface with a plurality of vertical foams formed through the entire thickness by a wet coagulation method for holding objects to be ground. pad. Background technique [0002] For the surface (processed surface) of various materials (polished objects) such as silicon wafers (WF) for semiconductors, glass substrates for flat panel displays (FPD), and substrates for hard disks, in order to improve flatness, use equipment with Grinding process is performed by the grinding machine with two fixed discs arranged oppositely. Among these objects to be polished, especially for WF for semiconductors or glass substrates for FPD, due to the need to achieve high accumulation of defect-free multilayer wiring or to perform high-quality images, etc. The flatness of the base substrate of the material is increasingly required. [0003] For example, when grinding on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/27H01L21/304B24B37/30B24B41/06
CPCB24B37/22
Inventor 川村佳秀久米贵宏佐藤章子
Owner FUJIBO HLDG