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Supporting pad

A technology for retaining pads and retaining surfaces, which is applied in the direction of grinding workpiece supports, electrical components, and working carriers, etc. It can solve problems such as uneven force, enlarged depressions, and grinding of retaining pads, and achieve the effect of reducing the burden

Active Publication Date: 2015-03-25
FUJIBO HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the cushioning property is too low, the stress on the object to be polished will be uneven due to the grinding pressure. Therefore, the stress concentration is located on the convex part of the object to be polished that is sunk into the side of the holding pad, and this stress concentration will occur. Uneven grinding due to excessive grinding
On the contrary, when the cushioning property is improved, the stress borne by the object to be ground becomes less likely to produce uneven stress, and then although the surface smoothness of the object to be ground can be improved, the depressions become larger, which makes it easier to maintain The pad itself has the potential to be ground

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0050] In embodiment 1, in the making of urethane sheet 2, use the polyester MDI (diphenylmethane diisocyanate) polyurethane resin of 100% resin modulus value 10MPa, make it in After dissolving in DMF at a ratio of 18% by weight, 1% by weight of the hydrophilic additive relative to the polyurethane resin and 5% by weight of carbon black relative to the polyurethane resin were added to prepare A polyurethane resin solution with a viscosity of 3.3 Pa·s as measured by a B-type rotational viscometer was obtained. When coating the polyurethane resin solution, the clearance of the coating device was set to 0.7 mm. After the polyurethane resin solution was coated on the film-forming substrate of the PET film, it was immersed in water (coagulation solution) at a temperature of 25° C. to completely regenerate the polyurethane resin. After washing and drying, the rear surface Sr side of the obtained urethane sheet 2 was polished, and the double-sided tape 7 was bonded to the polished s...

Embodiment 2

[0052] In Example 2, the same polyurethane resin as in Example 1 was dissolved in DMF at a ratio of 20% by weight, and then 1% by weight of hydrophilic resin was added to the polyurethane resin. A polyurethane resin solution having a viscosity of 5.3 Pa·s as measured by a B-type rotational viscometer was prepared using a non-reactive additive and 5% by weight of carbon black relative to the polyurethane resin. Set the clearance of the coating device to 1.0mm, coat the polyurethane resin solution on the film-forming substrate, and then immerse it in water at a temperature of 10°C, so that the polyurethane resin can be completely regeneration. After washing and drying, the rear surface Sr side of the obtained urethane sheet 2 was polished, and the double-sided tape 7 was bonded to the polished surface to manufacture the holding pad 10 .

Embodiment 3

[0054] In Example 3, after dissolving the same polyurethane resin as in Example 1 at a ratio of 21% by weight in DMF, 3% by weight of hydrophilic A polyurethane resin solution having a viscosity of 8.2 Pa·s measured with a B-type rotational viscometer was prepared using a non-reactive additive and 5% by weight of carbon black relative to the polyurethane resin. Set the clearance of the coating device to 1.0mm, coat the polyurethane resin solution on the film-forming substrate, and then immerse it in water at a temperature of 10°C, so that the polyurethane resin can be completely regeneration. After washing and drying, the rear surface Sr side of the obtained urethane sheet 2 was polished, and the double-sided tape 7 was bonded to the polished surface to manufacture the holding pad 10 .

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PUM

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Abstract

A supporting pad is provided which has a supporting face with heightened flatness precision and can improve the in-plane evenness of an object to be polished.  The supporting pad (10) includes a urethane sheet (2).  The urethane sheet (2) has been formed by the wet solidification method and has a supporting face (Sh) for supporting an object to be polished.  The urethane sheet (2) has a skin layer (2a) of a microporous structure, and has many cells (3) formed on the inner side of the skin layer (2a) and having such a size that the cells (3) extend over almost the whole thickness of the urethane sheet.  In the urethane sheet (2), the bottoms of the cells (3) are located in the range of from the back side (Sr) to a depth of 0.1t therefrom, provided that t is the thickness of the urethane sheet (2).  In a lower layer part (Pr) sandwiched between the section which is located 0.1t inward from the back side (Sr) and is parallel to the back side (Sr) and the section which is located 0.4t inward from the back side (Sr) and is parallel to the back side (Sr), the urethane sheet has a porosity, concerning the cells (3), regulated to 75-95%.  In polishing, the urethane sheet (2) shows an increased compressive deformation in the lower layer part (Pr).

Description

technical field [0001] The present invention relates to a holding pad, and more particularly to a holding pad having a resin sheet formed with vertical foam by a wet coagulation method to hold a holding surface of an object to be polished. Background technique [0002] Surfaces (processed surfaces) of various materials (objects to be polished) such as silicon wafers (WF) for semiconductors, glass substrates for flat panel displays (FPD), and substrates for hard disks are used to improve flatness. The grinding machine with two fixed disks is used for grinding. Among these objects to be polished, for example, in the case of WF for semiconductors, due to the miniaturization of portable devices and the like used therein, in order to efficiently manufacture substrates, the objects to be polished for polishing processing are There is a tendency to oversize. In addition, the glass substrate for FPD tends to increase in size and thickness as the glass substrate to be polished in o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/32H01L21/304B24B37/30B24B41/06
CPCB24B37/30B24B41/068
Inventor 川村佳秀岩尾智浩佐藤章子
Owner FUJIBO HLDG