A temperature control device and temperature control method for adjusting the temperature in a closed device
A closed and in-device technology, applied in the field of power supply, can solve the problems of multiple detection parameters and complex calculations
Active Publication Date: 2015-08-12
ZTE CORP
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Problems solved by technology
[0009] The technical problem to be solved by the present invention is a temperature control device and a temperature control method for adjusting the temperature inside the closed equipment, which are used to overcome the existing closed equipment, such as power supply cabinets, which have many detection parameters and complicated calculations when controlling the temperature. question
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[0053] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0054] In the embodiment of the present invention, the power supply chassis is taken as the main example to illustrate the temperature control scheme in the closed equipment. According to the input parameters or output parameters and fan parameters of the closed equipment, a reasonable calculation method is used to realize the control of the closed equipment. Predict the internal ambient temperature, and then adjust the speed of the air-cooled fan according to the fan operating curve to achieve the purpose of temperature control in the closed equipment by predicting the temperature situation.
[0055] At present, curve fitting technology is mostly used in image processing, or mainly used in a kind of curve fitting with data processing filter. In the case of increa...
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The invention discloses a temperature control device and method for adjusting a temperature in sealed equipment. The temperature control method comprises the following steps of: pre-defining detection areas, determining a temperature rise curve of each detection area through a sampling test, determining a fan speed regulation curve, and determining a relation curve of fan rotating speeds according to a temperature rise value of the sealed equipment and the temperature of a fan air inlet; when the sealed equipment is operated, obtaining the temperature rise values of the detection areas on the basis of temperature rise curves of the detection areas in a chassis according to an input current or an output current, and determining the temperature rise value of the chassis by using the temperature rise values of the detection areas; determining a target fan rotating speed under a current input parameter according to the temperature rise value of the chassis and the temperature of the air inlet; and adjusting a control parameter of a fan power source until the fan rotating speed reaches the target fan rotating speed on the basis of the fan speed regulation curve between the fan rotating speeds and a rotating speed control parameter according to the target fan rotating speed. When the temperature control is carried out by the temperature control device and method disclosed by the invention, the parameters to be detected are fewer, the temperature rise value can be predicted, and the fan rotating speeds can be adjusted in time so as to accurately control the temperature.
Description
technical field [0001] The invention relates to the technical field of power supplies, in particular to a temperature control device and a temperature control method for adjusting the temperature inside a closed device. Background technique [0002] Power supply products belong to power electronic equipment. The power tubes and other devices in the equipment will generate certain losses when they work, and most of these losses are converted into heat. In power supply products, power devices are generally placed in the power supply case. In order to ensure that the power tubes and other electronic components can work at the allowable ambient temperature, the equipment often uses fans to cool them. The power supply case will also have corresponding air inlets and air outlet. [0003] The temperature in the power supply chassis is generally controlled by the air-cooled fan, and the temperature control of the system is generally reflected in the speed regulation of the fan. Ex...
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IPC IPC(8): F04D27/00H05K7/20
Inventor 张新永何艳黎学伟
Owner ZTE CORP