Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method

Abstract

The invention provides a method for manufacturing an asymmetric factor multi-layer hardboard in a soft and hard combination board by adopting a separation lamination method. The method comprises the following steps: A. manufacturing a first double-side inner-layer hardboard, a second double-side inner-layer hardboard, a third double-side inner-layer hardboard and an integration curing board respectively; and B. arranging and sequentially laminating the first double-side inner-layer hardboard, a first prepreg, the second double-side inner-layer hardboard, a second prepreg, the third double-side inner-layer hardboard, a third prepreg and the integration curing board according to the sequence from top to bottom. The method has the following beneficial effects: due to the adoption of the method, the lamination becomes even, the copper electroplating is made to be uniform, the film lamination is compact, the net sticking phenomenon is reduced, and the misjudgment on electrical logging is reduced, therefore, the yield in production is improved. The material cost and the production cost are improved a little, but the yield in production is effectively improved; more important, when an IC (integrated circuit) or a BGA (ball grid array) is laminated on the surface of the board by a terminal client, bad empty welding caused by warping of the board is avoided, and the risk of goods returning from the client is reduced.

Description

technical field [0001] The invention relates to the production and lamination technology of flexible circuit boards and high-end asymmetric base multilayer hard boards of circuit boards, in particular to a method for producing asymmetric base multilayer hard boards in soft and hard combination boards by using separate pressing. Background technique [0002] At present, the production process of asymmetric cardinal multi-layer hard board in the industry is as follows: [0003] 1. Prepare the required inner layers as required. [0004] 2. Cut the prepreg and pure copper foil of the outer substrate according to the required size. [0005] 3. Press together according to the hierarchical structure requirements, and then make the outer layer. [0006] Although such a production process is simple and clear, the result is not ideal. The base multilayer board after lamination has better toughness due to the prepreg (epoxy resin), and it is easy to deform after high temperature. ...

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Problems solved by technology

[0006] Although such a production process is simple and clear, the result is not ideal. The base multilayer board after lamination has better toughness due to the prepreg (epoxy resin), and it is easy to deform after high temperature. The dimensional stability of pure copper foil is better. Therefore, it is in a bent state, which causes process abnormalities in the subsequent process: uneven thickness of copper plating, loose film adhesion, and screen printing sticking to the screen; resulting in low production yield of high-end boards; board warping also has fatal problems, and ICs are mounted on the surface of end customers 1. When installing LSI and various electronic components, due to the unevenness of the board surface, poor soldering is caused

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