Method for detecting surface subfissure of silicon wafers

Abstract

The invention discloses a method for detecting the surface subfissure of silicon wafers. The method comprises a preparation part and an operation part; the preparation part comprises the following steps of: selecting and using a steam generating device, arranging a long and thin steam spraying pipe on the steam generating device, arranging a button which can be used for adjusting steam flow, and wrapping a plurality of layers of fine gauze at a nozzle of the steam spraying pipe, so that water droplets with larger particles can be filtered and steam can penetrate through the gauze; and the operation part comprises the following steps of: controlling a switch button, meanwhile, handholding the steam spraying pipe to parallelly move above the silicon wafers to be detected such that the steam is evenly sprayed on the surfaces of the silicon wafers, observing the surface phenomena of the silicon wafers, overturning the silicon wafers, handholding the steam spraying pipe to parallelly move above the silicon wafers, and observing the surface phenomena of the silicon wafers. The method is based on the characteristics of blowing detection, and the common steam generating device is adopted to replace the air blowing by a mouth for detection, so that the method has the advantages of simple method and easiness for implementation.

Description

technical field [0001] The invention relates to a method for detecting cracks on the surface of a silicon chip. Background technique [0002] In the field of photovoltaics, the hidden cracks of silicon wafers are relatively hidden cracks that cannot be seen under normal conditions. When the adhesive surface is about to be cut through, due to the internal thermal stress of crystalline silicon and the mechanical processing Cracks caused by stress and other reasons, because the cracks do not penetrate, may be located on either side of the silicon wafer, automatic detection equipment cannot be detected, the traditional detection method is to blow air on the surface of the silicon wafer, and the steam quickly covers And during the fast drying process, cracks appear and disappear quickly. There are two obvious defects in this testing method: blowing air for a long time in the mass production process will easily cause fatigue and dry mouth and tongue discomfort to the inspectors, ...

AI Technical Summary

Problems solved by technology

There are two obvious defects in this detection method: blowing air for a long time in the mass production process will easily cause fatigue and dry mouth and tongue discomfort to the inspectors, and blowing air will easily cause pollution to silicon wafers