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Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof

A technology of benzocyclobutene and resin composition, which is applied in the field of photosensitive benzocyclobutene resin composition and preparation, can solve the problems of increased cost, non-photosensitivity, and complicated photolithography process, and achieve film-forming properties Good, cost reduction, simple and convenient method

Active Publication Date: 2014-05-07
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary BCB resin is not photosensitive, so it must be used in combination with other photosensitive materials (such as photoresist) when used as a patterned film material in the field of microelectronics, which complicates the photolithography process and increases the cost.

Method used

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  • Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof
  • Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof
  • Photosensitive benzocyclobutene resin compound and preparation method thereof as well as patterning method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] In a dark room, add 0.15g of benzocyclobutene resin and 2.5g of organic solvent into a 10mL brown bottle, and stir magnetically at room temperature for 30 minutes; then add 0.016g of photosensitizer to the system, continue to stir for 2 hours and then A negative photosensitive BCB resin composition with a mass fraction of about 25% was obtained, and the appearance of the composition was orange-yellow transparent liquid. Wherein, the structural formula of the benzocyclobutene resin is Among them, R is CO;

[0077] The photosensitizer is ultraviolet photosensitizer BAC-M, and the organic solvent is dichloromethane.

Embodiment 2

[0079] In a dark room, add 0.16g of benzocyclobutene resin and 2.3g of organic solvent into a 10mL brown bottle, and stir magnetically at room temperature for 60 minutes; then add 0.05g of photosensitizer to the system, and continue stirring for 5 hours. A negative photosensitive BCB resin composition with a mass fraction of about 8.7% was obtained, and the appearance of the composition was an orange-yellow transparent liquid. Wherein, the structural formula of the benzocyclobutene resin is Among them, R is CO;

[0080] The photosensitizer is ultraviolet photosensitizer BAC-M, and the organic solvent is dichloromethane.

Embodiment 3

[0082] In a dark room, add 0.06g of benzocyclobutene resin and 0.42g of organic solvent into a 5mL brown bottle, and stir magnetically at room temperature for 30 minutes; then add 0.0076g of photosensitizer to the system, continue stirring for 1 hour A negative photosensitive BCB resin composition with a mass fraction of about 13% was obtained, and the appearance of the composition was an orange-yellow transparent liquid. Wherein, the structural formula of the benzocyclobutene resin is Among them, R is C(CF 3 ) 2 ;

[0083] The photosensitizer is ultraviolet photosensitizer BAC-M, and the organic solvent is dichloromethane.

[0084] Please refer to figure 2 ,as well as Figure 3A to Figure 3E ,in figure 2 The flowchart of the patterning method of the photosensitive benzocyclobutene resin composition provided by the embodiment of the present invention, Figure 3A to Figure 3E The schematic diagram of the device structure corresponding to each step of the patterning me...

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PUM

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Abstract

A kind of photosensitive benzocyclobutene resin composition having good heat resistance and film forming property is provided, which comprises benzocyclobutene resin, photosensitizer and organic solvent; The preparation method for the composition is as following: adding benzocyclobutene resin into organic solvent, stirring the mixture for dissolving completely, then adding photosensitizer into the mixed solution, agitating the mixture under UV shielding condition to obtain the negative photosensitive benzocyclobutene resin composition. The preparation method is simple and convenient. Also disclosed is the patterning method for the resin composition, spin coating the photosensitive benzocyclobutene resin composition on a film coating substrate, then sequently undertaking pre-baking, exposing, developing and curing, so as to obtain a patterned photosensitive benzocyclobutene resin with mechanical strength. The patterning method requires no use of photoresist, is simple and convenient, and reduces the cost effectively.

Description

[0001] This application claims the priority of the Chinese patent application with the application number "201110268631.8" and the title of "benzocyclobutene-terminated soluble imide monomer and its preparation and use method", all the content in the priority text All are incorporated in this application document as the reference content of this application document. technical field [0002] The invention relates to the technical field of semiconductor technology, in particular to a photosensitive benzocyclobutene resin composition, a preparation method and a patterning method thereof. Background technique [0003] With the continuous reduction of the feature size of VLSI, the package size of the chip is also reduced correspondingly, and the package density is continuously increased. More and more multi-layer wiring technology is used in the chip packaging technology. For example, for a 256MB dynamic random access memory (DRAM), the maximum number of metal interconnection l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/031G03F7/029G03F7/00C07D209/48
CPCG03C1/52G03F7/0085G03F7/008
Inventor 杨军肖斐奚嘉亓恬珂叶晓通
Owner FUDAN UNIV