CIGS solar cell device and manufacturing method thereof
A technology for solar cells and copper indium gallium selenide, which is applied in the field of solar cells, can solve the problems of reduced battery cost, inability to completely avoid the absorption loss of a window layer film, cumbersome battery preparation process, and the like, and achieve the effect of simplifying the process
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[0030] A method for preparing a copper indium gallium selenide solar cell device in one embodiment, such as figure 2 shown, including the following steps:
[0031] Step S1: preparing a back electrode layer, a copper indium gallium selenide light absorption layer, a buffer layer and a barrier layer stacked in sequence on the substrate.
[0032]The substrate can be glass, stainless steel or polymer flexible substrate, etc. The back electrode layer is preferably a molybdenum metal layer. The buffer layer is preferably a CdS layer. The barrier layer is preferably an i-ZnO high resistance layer.
[0033] Use but not limited to magnetron sputtering molybdenum metal target to deposit molybdenum back electrode layer; use but not limited to magnetron sputtering selenization or four-source co-evaporation process to prepare CIGS light absorbing layer, the thickness of the deposited absorbing layer is about 2 μm ; Use but not limited to chemical water bath method to deposit CdS or ot...
Embodiment 1
[0051] 1. Soda-lime glass is used as the substrate, and the substrate thickness is 2mm; the molybdenum metal back electrode layer is deposited by sputtering the molybdenum metal target with the DC magnetron sputtering process, and the thickness is about 1 μm; the CIGS light absorption layer is deposited by the three-step co-evaporation method layer, the thickness is 2μm; the CdS buffer layer is deposited by chemical water bath method, the thickness is about 50nm; the i-ZnO high resistance layer is deposited by sputtering ZnO ceramic target by radio frequency magnetron sputtering process, and the power density is 0.5W / cm 2 , the sputtering time is 15min, the gas flow ratio Ar:O 2 =10:1, the thickness is about 50nm; thus the Mo / CIGS / CdS / i-ZnO structure is obtained.
[0052] 2. Preparation of single-layer graphene by chemical vapor deposition. Put the cleaned Cu sheet into the CVD furnace, turn on the mechanical pump, and pump air until the background vacuum is 3mTorr. Adjust t...
Embodiment 2
[0056] 1. With stainless steel as the substrate, the thickness of the substrate is 0.05mm; the molybdenum metal back electrode layer is deposited by sputtering the molybdenum metal target with the DC magnetron sputtering process, and the thickness is about 1 μm; the CIGS light absorbing layer is deposited by the three-step co-evaporation method , the thickness is 2μm; the CdS buffer layer is deposited by chemical water bath method, the thickness is about 50nm; the i-ZnO high resistance layer is deposited by sputtering ZnO ceramic target by radio frequency magnetron sputtering process, and the power density is 0.5W / cm 2 , the sputtering time is 15min, the gas flow ratio Ar:O 2 =10:1, the thickness is about 50nm; thus the Mo / CIGS / CdS / i-ZnO structure is obtained.
[0057] 2. Preparation of single-layer graphene by chemical vapor deposition. Put the cleaned Cu sheet into a CVD furnace, turn on the mechanical pump, and pump air until the background vacuum is 6mTorr. Adjust the fl...
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