Method for quickly judging failure mechanism consistency of temperature stress acceleration experiment
A temperature stress and failure mechanism technology, applied in electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as unavoidable invalid experiments and failure to represent the true life of devices
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[0074] The following will be combined with figure 1 The present invention is described in further detail with examples.
[0075] 1. A method for quickly distinguishing the consistency of the failure mechanism of the temperature stress accelerated experiment, characterized in that, comprising the following steps:
[0076] Step 1. Determine L accelerated test temperature stress levels T 1 2 l L , where l=1, 2, ... L;
[0077] Step 2. Collect T at the initial stage of the accelerated experiment 1 , T 2 ,...T l ,...T L Device parameter degradation data at the level;
[0078] The degradation data is set as the degradation time when the failure-sensitive parameter degrades to any degree, and here the degradation time when the failure-sensitive parameter degrades to 3% is taken as the degradation data;
[0079] Step 3, according to the parameter degradation data fitting parameter degradation distribution model determined in step 2, judge that it meets the Weibull degradation d...
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