Method for quickly judging failure mechanism consistency of temperature stress acceleration experiment

A temperature stress and failure mechanism technology, applied in electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as unavoidable invalid experiments and failure to represent the true life of devices

Inactive Publication Date: 2012-07-04
BEIJING UNIV OF TECH
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Problems solved by technology

However, the potential failure mechanism of the device under accelerated conditions may be stimulated and become the main failure mechanism, causing the failure mechanism to change under accelerated conditions, resulting in the device life obtained by the accelerated experim

Method used

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  • Method for quickly judging failure mechanism consistency of temperature stress acceleration experiment
  • Method for quickly judging failure mechanism consistency of temperature stress acceleration experiment
  • Method for quickly judging failure mechanism consistency of temperature stress acceleration experiment

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Embodiment Construction

[0074] The following will be combined with figure 1 The present invention is described in further detail with examples.

[0075] 1. A method for quickly distinguishing the consistency of the failure mechanism of the temperature stress accelerated experiment, characterized in that, comprising the following steps:

[0076] Step 1. Determine L accelerated test temperature stress levels T 1 2 l L , where l=1, 2, ... L;

[0077] Step 2. Collect T at the initial stage of the accelerated experiment 1 , T 2 ,...T l ,...T L Device parameter degradation data at the level;

[0078] The degradation data is set as the degradation time when the failure-sensitive parameter degrades to any degree, and here the degradation time when the failure-sensitive parameter degrades to 3% is taken as the degradation data;

[0079] Step 3, according to the parameter degradation data fitting parameter degradation distribution model determined in step 2, judge that it meets the Weibull degradation d...

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Abstract

The invention relates to a method for quickly judging failure mechanism consistency of a temperature stress acceleration experiment, which belongs to the filed of acceleration experiment. The method comprises utilizing an Arrhenius degradation model as a research basis; by means of combination with a Wilbur life distribution model, obtaining relation between the failure mechanism consistency of the acceleration life experiment and shape parameters under different stress levels; specific to early parameter degradation data in the acceleration experiment, calculating distribution shape parameters, and then quickly judging whether the failure mechanism is consistent under different experiment stresses in the initial stage of the experiment. The method for quickly judging failure mechanism inthe initial stage of the experiment avoids the invalid acceleration experiments caused by changes of the failure mechanism and saves experiment time.

Description

technical field [0001] The invention relates to a method for quickly judging the consistency of the failure mechanism of an accelerated temperature stress experiment, and belongs to the technical field of accelerated degradation experiment design. technical background [0002] With the development of science and technology, the reliability of electronic devices is getting higher and higher. In order to evaluate its reliability parameters, the application of accelerated experiments is becoming more and more extensive. However, the potential failure mechanism of the device under accelerated conditions may be stimulated and become the main failure mechanism, causing the failure mechanism to change under accelerated conditions, resulting in the device life obtained by the accelerated experiment cannot represent the real life of the device. At present, the method for judging the consistency of failure in constant stress accelerated experiments needs to judge the consistency of fa...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 郭春生万宁冯士维张燕峰朱慧
Owner BEIJING UNIV OF TECH
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