Flexible intracranial cortex microelectrode chip, and preparation method and packaging method and packaging structure thereof

Abstract

The invention relates to a flexible intracranial cortex microelectrode chip, which comprises a flexible substrate, a microelectrode unit, an electrode lead which is electrically connected with the microelectrode unit, a lead welding spot which is electrically connected with the electrode lead, and an insulating layer which is arranged on the flexible substrate and covers the electrode lead, wherein the microelectrode unit, the electrode lead and the lead welding spot are arranged on the flexible substrate. The invention also relates to a method for preparing the flexible intracranial cortex microelectrode chip, a packaging structure for the flexible intracranial cortex microelectrode chip, and a method for packaging the flexible intracranial cortex microelectrode chip. The flexible intracranial cortex microelectrode chip has high flexibility and can be well adhered to cerebral cortex, information is detected, and electrical stimulation is applied. Better flexible matching between the flexible intracranial cortex microelectrode chip and the cerebral cortex can be realized, and in the long-term implantation process, attenuation of organism response on performance of the electrode is effectively reduced; and moreover, tissue damage, inflammatory response, incrustation, hemorrhage and other conditions are avoided.

Description

【Technical field】 [0001] The present invention relates to the field of medical equipment, in particular to a flexible intracranial cortical microelectrode chip, a method for preparing a flexible intracranial cortical microelectrode chip, a packaging method for a flexible intracranial cortical microelectrode chip, a Packaging structure of flexible intracranial cortical microelectrode chips. 【Background technique】 [0002] Under normal physiological conditions, the surface of the human brain will produce weak electrical discharges with a certain pattern. When pathological changes occur in the brain, its firing patterns change. Clinically, by observing the changes of these discharge patterns, diseases can be diagnosed and treated. Epilepsy is currently the most widely used disease in the diagnosis and treatment of EEG. Epilepsy is caused by abnormal excitability or inhibitory failure of neurons in a certain area of ​​the brain, causing limb twitching or abnormal conscious be...

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Problems solved by technology

However, the traditional micromachining technology is based on rigid materials; while using rigid electrode chips to collect intracranial cortical EEG, there are several problems: 1. There is a huge gap between the rigid electronic device and the soft cerebral cortex Flexibility differences, if implanted for a long time, small disturbances in electronic devices may cause nerve tissue damage, inflammatory reactions, scabs and even cerebral hemorrhage; 2. At the same time, this huge flexibility difference will cause biological damage over time. The tissue wraps the rigid electronic device, so that the performance of the device is gradually lost; 3. There is a big difference between the planar structure of the rigid electronic device and the complex curved surface structure of the cerebral cortex, which affects the degree of spatial fit between the electronic interface and the neural tissue, thereby affecting Effective transmission of information; 4. When rigid electronic devices are implanted and general anesthesia is required for the patient, a bone flap craniotomy is used, which has a large wound and increases the risk of surgery

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