The invention relates to a flexible intracranial cortex
microelectrode chip, which comprises a flexible substrate, a
microelectrode unit, an
electrode lead which is electrically connected with the
microelectrode unit, a lead
welding spot which is electrically connected with the
electrode lead, and an insulating layer which is arranged on the flexible substrate and covers the
electrode lead, wherein the microelectrode unit, the electrode lead and the lead
welding spot are arranged on the flexible substrate. The invention also relates to a method for preparing the flexible intracranial cortex microelectrode
chip, a packaging structure for the flexible intracranial cortex microelectrode
chip, and a method for packaging the flexible intracranial cortex microelectrode chip. The flexible intracranial cortex microelectrode chip has high flexibility and can be well adhered to
cerebral cortex, information is detected, and electrical stimulation is applied. Better flexible matching between the flexible intracranial cortex microelectrode chip and the
cerebral cortex can be realized, and in the long-term implantation process, attenuation of
organism response on performance of the electrode is effectively reduced; and moreover,
tissue damage,
inflammatory response, incrustation, hemorrhage and other conditions are avoided.