Method for preventing circuit board solder mask ink from blocking hole

A technology for solder mask ink and circuit board, which is applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve problems such as the production cost of blocking point leakage ink, and achieve the effect of low cost
CN102548232AInactive Publication Date: 2012-07-04DALIAN CHONGDA CIRCUIT

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
DALIAN CHONGDA CIRCUIT
Publication Date
2012-07-04
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention discloses a method for preventing circuit board solder mask ink from blocking a hole, which comprises the steps of utilizing a white net to perform silk-screen printing to one surface of a circuit board, spraying the other surface of the circuit board and flushing off the ink in a circuit board through hole. The method utilizes a screen printing plate with no blocking points to perform silk-screen printing ink to the board surface of the circuit board, and increases spraying pressure to the other surface of the circuit board when pre-baking, exposure and developing are performed to the board surface, flushes out the ink entering the through hole due to the silk-screen printing, and then repeats the steps to the other surface of the circuit board to achieve the whole silk-screen printing process. Compared with the prior art, the silk-screen printing ink on the surfaces of the whole circuit board is comprehensive, the phenomenon that no ink exists on the outer side of the through hole is not caused, and the situation that the hole is blocked does not exist. In addition, the screen printing plate with no blocking points is not required to be manufactured, and the method for preventing the circuit board solder mask ink from blocking the hole has the advantage of being low in cost.
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Description

Technical field:

[0001] The invention belongs to the technical field of circuit board production, and in particular relates to a method for preventing circuit board solder resist ink from clogging holes. Background technique:

[0002] After the circuit board is manufactured, silk screen ink needs to be applied to the board surface to prevent the circuit from oxidizing. However, due to the presence of via holes on the circuit board, when the screen printing ink is applied to the board surface, some ink will enter into the via holes and cause plugging. , thus affecting the soldering and electrical performance of the circuit board, especially the diameter of these via holes is small, about 0.25mm, 0.3mm, once the hole is plugged, it will be very troublesome to remove.

[0003] For this reason, at present, in order to prevent ink plugging, before screen printing ink on the surface of the circuit board, it is necessary to make a special screen printing screen. These blocking poi...

Claims

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