Method for preventing circuit board solder mask ink from blocking hole
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- DALIAN CHONGDA CIRCUIT
- Publication Date
- 2012-07-04
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
Technical field:
[0001] The invention belongs to the technical field of circuit board production, and in particular relates to a method for preventing circuit board solder resist ink from clogging holes. Background technique:
[0002] After the circuit board is manufactured, silk screen ink needs to be applied to the board surface to prevent the circuit from oxidizing. However, due to the presence of via holes on the circuit board, when the screen printing ink is applied to the board surface, some ink will enter into the via holes and cause plugging. , thus affecting the soldering and electrical performance of the circuit board, especially the diameter of these via holes is small, about 0.25mm, 0.3mm, once the hole is plugged, it will be very troublesome to remove.
[0003] For this reason, at present, in order to prevent ink plugging, before screen printing ink on the surface of the circuit board, it is necessary to make a special screen printing screen. These blocking poi...