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Electroplating hanging tool and manufacturing method thereof

An electroplating hanger and electroplating layer technology, applied in the electrolytic process, electrolytic components and other directions, can solve the problems of uneven thickness of the electroplating layer, affecting product performance, etc., to achieve uniform thickness of the electroplating layer, improve product performance, and overcome the effect of edge effects

Inactive Publication Date: 2012-07-11
PEKING UNIV FOUNDER GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides an electroplating hanger and a preparation method thereof, which are used to solve the problem that the thickness of the electroplating layer of the electroplating product is uneven due to the edge effect of the power line, thereby affecting the performance of the product

Method used

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  • Electroplating hanging tool and manufacturing method thereof
  • Electroplating hanging tool and manufacturing method thereof
  • Electroplating hanging tool and manufacturing method thereof

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preparation example Construction

[0032] A kind of preparation method of electroplating hanger of the present invention is characterized in that, comprises:

[0033] Install the circuit board on the hanger;

[0034] Making a shielding plate, wherein, the shielding plate is provided with a plurality of through holes, and the shielding plate is made of non-conductive material;

[0035] The shielding plate is installed on the hanger, so that: when the circuit board is installed on the hanger, the shielding plate shields the edge part or the whole plating area of ​​the electroplating area of ​​the circuit board.

[0036] Preferably, in each embodiment of the present invention, after the step of installing the circuit board on the hanger and before the step of making the shielding board, further include:

[0037] Carry out electroplating to the circuit board that is installed on the hanger;

[0038] Measure the thickness of the electroplating layer on each part of the surface of the electroplated circuit board, a...

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Abstract

The invention discloses an electroplating hanging tool comprising a hanging rack and a shielding board, wherein the shielding board is installed on the hanging rack; a plurality of through holes are arranged on the shielding board; the shielding board is made of nonconductive materials; and when a circuit board is installed on the hanging rack, the shielding board shields the edge part of an electroplating region of the circuit board or all electroplating regions. The invention also discloses a manufacturing method of the electroplating hanging tool. The manufacturing method comprises the following steps of: installing the circuit board on the hanging rack; manufacturing the shielding board, wherein the plurality of through holes are arranged on the shielding board, and the shielding board is made of nonconductive materials; installing the shielding board on the hanging rack, so that the shielding board shields the edge part of the electroplating region of the circuit board or all electroplating regions when the circuit board is installed on the hanging rack. According to the electroplating hanging tool, as the nonconductive shielding board provided with the through holes is added to the hanging rack, the distribution situation of a power line is changed when the circuit board is electroplated, and the edge effect of the power line is overcome, so that the electroplating layer of the electroplating hanging tool is uniform in thickness.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to an electroplating hanger and a preparation method thereof. Background technique [0002] In many processes in the circuit board manufacturing process, the product, that is, the circuit board, needs to be electroplated, and a layer of electroplating layer with uniform thickness is formed on the surface of the product through electroplating. The common electroplating layer is a copper layer. The thickness of the copper layer needs to meet the requirements of the product and requirements of its follow-up procedures. At present, during electroplating, the circuit board is usually first fixed in a special hanger, and then the hanger with the circuit board fixed is placed in the electroplating solution, and the electroplating is realized by using an electric current. [0003] In the electroplating process, especially in the graphic electroplating process, due to the irregular p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/08
Inventor 苏新虹朱兴华
Owner PEKING UNIV FOUNDER GRP CO LTD
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