Data split method and correction method of stepping photoetching mask plate for diagrammed substrate process

Abstract

The invention relates to a data split method and a correction method of a stepping photoetching mask plate for a diagrammed substrate manufacturing process. The method comprises the following processes of: determining the size and the space size of small circles on the photoetching mask plate; determining the edge length of a regular triangle distributed by the small circles and setting the edge length as a; making a regular hexagon which takes 1 / 2a as the radius of an incircle and expanding the regular hexagon outwards; making the small circles needed in the regular hexagon and carrying out logic reduction operation on the small circles and the regular hexagon; according to the regular-triangle distribution mode, moving for 1 / 2a in the X direction of the coordinate and for a*sin600 in the Y direction, forming a two-hexagon regular hexagon diagram, and repeatedly distributing the two-hexagon regular hexagon diagram, wherein the stepping is a, 2a*sin600; obtaining the needed window diagram shown in the abstract and the drawings; carrying out centering processing on the obtained window diagram; and adding an overlaid mark of the stepping photoetching machine with the corresponding type. The invention has the advantages that an exposure window interface obtained after repeated distribution is of a regular gear shape or a sawtooth shape, so that the split mode on the circle is effectively avoided, the optical edge effect is greatly improved and simultaneously the accuracy requirement for manufacturing the photoetching mask plate is reduced.

Description

technical field [0001] The invention discloses a high-quality PSS (Pattern Sapphire Substrate, PSS) manufacturing process stepping photolithography mask plate (referred to as PSS plate) data splicing method and correction method, generally speaking, it is a method for stepping photolithography The engraving machine uses the data splicing method and correction method in the design process of the high-precision and high-yield photolithography mask plate that does not increase the requirements. This photolithography plate is mainly used in the PSS manufacturing process. Background technique [0002] Due to the high requirements of the PSS version - high precision and high yield. However, when making a mask for a stepper lithography machine, there are obvious optical edge effects, and there are obvious errors at the edge of the window pattern; when using a stepper lithography machine for lithography exposure, the steps in the X and Y directions The advance and verticality requi...

AI Technical Summary

Problems solved by technology

Due to the optical edge effect at the edge of the exposure window, there is a certain numerical error in the production and use of the photolithography mask. Therefore, on the semiconductor material after the splicing exposure, the splicing traces on the circle can be clearly seen, resulting in Decreased consistency of graphics across the material, reducing yield

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