Unlock instant, AI-driven research and patent intelligence for your innovation.

Wind guide cover and electronic device using same

A technology for electronic devices and windshields, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of airflow loss, poor adaptability, etc., and achieve the effects of improving heat dissipation performance, reliability, and connection strength

Inactive Publication Date: 2012-07-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when only one CPU is required to be set inside the mainframe, this air hood will cause a large amount of airflow to be lost from the area where the CPU is not provided in the air hood because the positions of two CPUs are reserved, and the adaptability is relatively small. Difference

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wind guide cover and electronic device using same
  • Wind guide cover and electronic device using same
  • Wind guide cover and electronic device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] see figure 1 and figure 2 , the electronic device 10 includes a casing 12, a circuit board 13 located in the casing 12, a first processor 15 and a second processor 16 arranged on the circuit board 13, respectively arranged on the first A first heat sink 17 and a second heat sink 18 on a processor 15 and a second processor 16 , and a wind guide cover 19 fixedly connected with the casing 12 and located on the circuit board 13 .

[0032] The first processor 15 and the second processor 16 are arranged side by side at a corner of the casing 12 . The air guide cover 19 is located above the first radiator 17 and the second radiator 18, and includes a top plate 190, two side plates 192 extending downward from opposite sides of the top plate 190, and a set of There are two windshields 193 below the top plate 190 .

[0033] The top plate 190 is substantially rectangular and located right above the first heat sink 17 and the second heat sink 18 . The two side plates 192 are r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a wind guide cover which comprises a top plate and two side plates which are bent towards the same direction and extend from two opposite sides of the top plate, wherein a channel for air to circulate is formed by the enclosing of the top plate and the two side plates; the wind guide cover also comprises at least one wind deflector positioned between the two side plates, the wind deflector is arranged in the channel, a torsional spring is arranged between the wind deflector and the top plate, the wind deflector comprises a first side and a second side opposite to the first side, the second side rotates relative to the first side; and when the wind deflector rotates relative to the first side due to an external force, the torsional spring can offer a reacting force for the wind deflector to stop the rotation of the wind deflector. The invention also relates to an electronic device with the wind guide cover.

Description

technical field [0001] The invention relates to an airflow guide device, in particular to an air guide cover for guiding air flow to dissipate heat from electronic components and an electronic device utilizing the air guide cover. Background technique [0002] In existing computers, users can install one or two CPUs in the mainframe according to different needs. Therefore, the design of the heat dissipation system in the computer needs to adapt to the situation that one or two CPUs are installed in the mainframe at the same time. [0003] In this regard, a common practice in the industry is to arrange an air guide cover inside the host. The air guide cover has a top plate and two side plates extending vertically downward from opposite sides of the top plate. The top plate and the two side plates jointly enclose an air outlet and an air inlet which are arranged in communication. A fan is arranged at the air inlet, and the air outlet is located outside the two CPUs and facin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/20G06F1/20H01L23/467
Inventor 魏钊科
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD